Abstract:
The present invention (Figure 1) is directed to semiconductor films and a process for their preparation. In accordance with the process of the present invention, semiconductor organic material is blended with a multi-component solvent blend and the blend is deposited on a receiving material to provide a continuous highly ordered film having greater periodicity than films produced with a single solvent/semiconducting material blend under similar processing conditions.
Abstract:
A semiconductor device having a flexible or rigid substrate (11) having a gate electrode (21), a source electrode (61 and 101), and a drain electrode (62 and 102) formed thereon and organic semiconductor material (51, 81, and 91) disposed at least partially thereover. The gate electrode (21) has a thin dielectric layer 41 formed thereabout through oxidation. In many of the embodiments, any of the above elements can be formed through contact or non-contact printing. Sizing of the resultant device can be readily scaled to suit various needs.
Abstract:
A method and apparatus for writing to solid-state memory is provided herein. In particular, a controller is provided that monitors operating parameters of each die within the system. In order to enable fast, real-time write operations, feedback from each die is analyzed and compared with a stored set of operating parameters. Based on this comparison, a particular die is chosen for write operations such that system performance is optimized.
Abstract:
A semiconductor device comprising a flexible or rigid substrate (10) having a gate electrode (11), a source electrode (12), and a drain electrode (13) formed thereon and organic semiconductor material (14) disposed at least partially thereover. With appropriate selection of material, the gate electrode (11) will form a Schottky junction and an ohmic contact will form between the organic semiconductor material (14) and each of the source electrode (12) and drain electrode (13). In many of the embodiments, any of the above elements can be formed through contact or non-contact printing. Sizing of the resultant device can be readily scaled to suit various needs.
Abstract:
A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate (10) has a layer of metal (11) adhered to the surface, and the metal layer is formed into entities (12). Each entity (12) has a fracture initiating feature (14, 54) formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities (12) are fractured in a controlled manner by subjecting the substrate (10) and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity (12) into two or more sub-entities (42) that are electrically isolated from each other by the stress fracture.
Abstract:
An integrated electrically-responsive lenticular display apparatus (300) includes a lenticular lens (301) integrally combined with at least one electrically-responsive light-emissive pattern (202). The electrically-responsive light-emissive pattern (202) is a printed electrically-responsive light-emissive pattern. The printed pattern may be printed directly onto the lenticular lens (301) or onto a substrate (502), which then attaches to the lenticular lens (301). The electrically-responsive light-emissive pattern (202) can be interleaved with another pattern (203). The other pattern (203) may include another electrically-responsive light-emissive pattern or a non-electrically-responsive light-emissive pattern.
Abstract:
An electroluminescent display device is fabricated by creating a generic electroluminescent base laminate or precursor (100) containing a base electrode (120) and an electroluminescent layer (130). A custom graphic arts film or precursor (200) containing a graphic element (260) and a corresponding electrode (220) is also fabricated. The two precursors are then bonded together using an adhesive to create the customized EL display, so that only the sections of the electroluminescent display device that are associated with the corresponding electrode on the graphic arts film emit light.
Abstract:
An electroluminescent display device contains an electroluminescent phosphor (140) sandwiched between a pair of electrodes (120, 220) and a graphic arts element (260). The device is fabricated by bonding a generic electroluminescent base laminate (100) containing an electrode (120) and an electroluminescent layer (140), to a custom graphic arts film (200) containing a graphic element (260) and a corresponding electrode (220). The generic electroluminescent base laminate is made at a first location or time, and the custom graphic arts film is made at a second location or time.
Abstract:
A functional ink (200) suitable for use as a dielectric layer (303) in a printed semiconductor device (300) comprises a dielectric carrier (201) and a plurality of dielectric particles (202) sized less than about 1,000 nanometers that are disposed within the dielectric carrier. In a preferred approach the dielectric carrier comprises a dielectric resin and the dielectric particles comprise a ferroelectric material (such as, but not limited to, BaTiO 3 . So provided, this functional ink can be applied to a substrate (301) of choice through a printing technique of choice to thereby provide a resultant printed semiconductor device, such as a field effect transistor, having a relatively thin dielectric layer comprised of this functional ink.
Abstract translation:适合用作印刷半导体器件(300)中的电介质层(303)的功能油墨(200)包括电介质载体(201)和尺寸小于约1000纳米的多个电介质颗粒(202) 电介质载体。 在优选的方法中,电介质载体包括电介质树脂,并且电介质颗粒包含铁电材料(例如但不限于BaTiO 3 N 3)。因此,该功能性油墨可以应用于基底 (301),通过选择的打印技术来选择,从而提供具有由该功能性墨水组成的相对薄的介电层的所得印刷半导体器件,例如场效应晶体管。