公开(公告)号：US06144104A

公开(公告)日：2000-11-07

申请号：US275129

申请日：1999-03-24

Applicant: Jay DeAvis Baker ,  Mohan R. Paruchuri ,  Prathap Amerwai Reddy ,  Vivek Amir Jairazbhoy

Inventor： Jay DeAvis Baker ,  Mohan R. Paruchuri ,  Prathap Amerwai Reddy ,  Vivek Amir Jairazbhoy

IPC: H01L21/58 ,  H01L23/373 ,  H01K23/48 ,  H01K23/52

CPC classification number: H01L24/83 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05599 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/351

Abstract: A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.

Abstract translation: 将用于将诸如半导体管芯的电子部件附接到基板的产品包括施加到基板的相对低熔点温度的焊料预制件; 以及可焊接材料的珠粒，其以足以基本上容纳焊料材料的量施加到围绕焊料预制件的周边的基底，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和基板之间的间隙 尺寸。

公开(公告)号：US5928404A

公开(公告)日：1999-07-27

申请号：US827589

申请日：1997-03-28

Applicant: Mohan R. Paruchuri ,  Dongkai Shangguan

Inventor： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34 ,  C22C13/00

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/262 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K3/3442 ,  H05K3/3463

Abstract: A method of manufacturing an electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 60-99% Sn, 0-40% Pb and 0-10% Ag. The additive powder metal is selected from the metal group comprising Sn, Pb, Ni, Cu, Ag, and Bi and mixtures thereof.

Abstract translation: 一种制造具有主焊料粉末和在焊接过程中不熔化的添加金属粉末成分的电焊膏的方法。 金属粉末可以是元素金属或金属合金。 初级粉末与常规焊膏中使用的粉末相同。 添加剂粉末的熔点显着高于初级粉末的熔点。 主要粉末包含60-99％的Sn，0-40％的Pb和0-10％的Ag。 添加剂粉末金属选自包括Sn，Pb，Ni，Cu，Ag和Bi的金属和它们的混合物。

公开(公告)号：US5894054A

公开(公告)日：1999-04-13

申请号：US781569

申请日：1997-01-09

Applicant: Mohan R. Paruchuri ,  Dongkai Shangguan

Inventor： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC: B23K1/012 ,  B23K35/28 ,  B32B15/01 ,  F28F3/02 ,  F28F21/08 ,  B32B15/20

CPC classification number: F28F21/089 ,  B23K1/012 ,  B23K35/282 ,  B32B15/017 ,  F28F21/084 ,  F28F3/025 ,  B23K2203/10 ,  Y10S165/905 ,  Y10T428/12681 ,  Y10T428/12736 ,  Y10T428/12792

Abstract: The present invention is an aluminum assembly comprising at least two components brazed to each other. The assembly comprises: at least a first aluminum based component having a coating of a zinc-antimony alloy having at least 1.0 wt. % antimony applied to a region of a surface of the component which is to be joined to a second aluminum based component; and at least one second aluminum based component disposed adjacent to the coating; whereby the at least first aluminum based component and the at least second aluminum based component are joined together during a controlled atmosphere brazing (CAB) process.

Abstract translation: 本发明是一种铝组件，其包括彼此钎焊的至少两个组件。 组件包括：至少第一铝基组分，其具有至少1.0重量％的锌 - 锑合金涂层。 施加到待连接到第二铝基部件的部件的表面的区域上的％锑; 以及至少一个第二铝基部件，其邻近所述涂层设置; 由此在受控气氛钎焊（CAB）工艺期间，将至少第一铝基组分和至少第二铝基组分接合在一起。

公开(公告)号：US06852932B2

公开(公告)日：2005-02-08

申请号：US10650309

申请日：2003-08-28

Applicant: Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/11 ,  H01R12/04

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1056

Abstract: A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Abstract translation: 一种多层电路板，其具有与电接地构件选择性地和电隔离的孔，并且还具有由聚合物材料在结构上支撑的选择性地形成的空气桥和/或交叉构件。 每个孔选择性地接收导电材料。

公开(公告)号：US06739041B2

公开(公告)日：2004-05-25

申请号：US09815234

申请日：2001-03-22

Applicant: Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

IPC: H05K320

CPC classification number: H05K3/462 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.

Abstract translation: 一种用于制造多层电子电路板82,168的方法10,90，包括在导电构件12,92上形成至少一个突起15,100的步骤，并且添加另外的材料34,56,58的导电层 ，104,114,138,140连接到构件12,92，同时在层82,168内选择性地延伸突起15,100，从而形成电路板82,168。形成的电路板的一部分可以按顺序蚀刻 以选择性地产生空气桥86或互连部分164。

公开(公告)号：US06729023B2

公开(公告)日：2004-05-04

申请号：US09815564

申请日：2001-03-23

Applicant: Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K302

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1056

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract translation: 一种用于制造具有孔96,98的多层电路板116的方法，其可以与电接地构件46选择性地和电隔离，并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个 孔96,98选择性地接收导电材料114。

公开(公告)号：US06673723B2

公开(公告)日：2004-01-06

申请号：US09815226

申请日：2001-03-22

Applicant: Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

IPC: H01L21302

CPC classification number: H05K3/44 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1184

Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.

Abstract translation: 制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。

公开(公告)号：US06613239B2

公开(公告)日：2003-09-02

申请号：US09836644

申请日：2001-04-17

Applicant: Andrew Z. Glovatsky ,  Robert E. Belke ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Marc A. Straub ,  Richard K. McMillan ,  Ram S. Raghava ,  Thomas B. Krautheim ,  Michael A. Howey ,  Vivek A. Jairazbhoy

Inventor： Andrew Z. Glovatsky ,  Robert E. Belke ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Marc A. Straub ,  Richard K. McMillan ,  Ram S. Raghava ,  Thomas B. Krautheim ,  Michael A. Howey ,  Vivek A. Jairazbhoy

IPC: B44C122

CPC classification number: H05K3/4641 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09881 ,  H05K2203/0733 ,  H05K2203/1184 ,  Y10T29/49155

Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

公开(公告)号：US06611429B2

公开(公告)日：2003-08-26

申请号：US09989887

申请日：2001-11-21

Applicant: Daniel Kline ,  Hong Zhou ,  Karen Lee Chiles ,  Lawrence LeRoy Kneisel ,  Mohan R. Paruchuri ,  Puqiang Zhang

Inventor： Daniel Kline ,  Hong Zhou ,  Karen Lee Chiles ,  Lawrence LeRoy Kneisel ,  Mohan R. Paruchuri ,  Puqiang Zhang

IPC: H05K720

CPC classification number: H05K9/0039 ,  Y10S439/947 ,  Y10T29/49117

Abstract: The present invention is generally directed grounding an electrical connection to a magnesium cross beam of a motor vehicle. In order to ensure proper grounding, the cross beam is provided with a copper connector. The connector defines a first aperture. An electric circuit is preferably traced on a plastic substrate, where the substrate defines a second aperture. The substrate is placed on top of the cross beam such that the first aperture and the second aperture are aligned with each other. An attaching means such as screws is inserted through the first aperture to the second aperture such that the substrate is attached to the cross beam. In order to prevent the movement of the substrate relative to the cross beam the second aperture is provided with a washer.

Abstract translation: 本发明通常指向与机动车辆的镁横梁的电连接接地。 为了确保正确接地，横梁设有铜连接器。 连接器限定第一孔。 电路优选地在塑料基板上追踪，其中基板限定第二孔。 将基板放置在横梁的顶部上，使得第一孔和第二孔彼此对准。 诸如螺钉的附接装置通过第一孔插入到第二孔，使得基底附接到横梁。 为了防止基板相对于横梁的运动，第二孔设置有垫圈。

公开(公告)号：US06601753B2

公开(公告)日：2003-08-05

申请号：US09859553

申请日：2001-05-17

Applicant: Jay DeAvis Baker ,  Lawrence Leroy Kneisel ,  Mohan R. Paruchuri ,  Prathap Amervai Reddy ,  Vivek Amir Jairazbhoy

Inventor： Jay DeAvis Baker ,  Lawrence Leroy Kneisel ,  Mohan R. Paruchuri ,  Prathap Amervai Reddy ,  Vivek Amir Jairazbhoy

IPC: B23K3538

CPC classification number: H01L24/90 ,  B23K35/264 ,  H01L23/10 ,  H01L23/44 ,  H01L24/32 ,  H01L24/48 ,  H01L24/72 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73251 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/32 ,  H01L2224/72 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.