公开(公告)号：DE102008006757A1

公开(公告)日：2009-08-06

申请号：DE102008006757

申请日：2008-01-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HERRMANN SIEGFRIED ,  GUENTHER EWALD KARL MICHAEL

IPC: H01L33/48 ,  H01L33/62

Abstract: The component has a contact area (10a) electrically connected with a structured electrically conductive layer (4) by a through contact (13a). Another contact area (10b) is electrically connected with a contact structure (13b) by another through contact (13c), where the through contacts are guided by an electrically insulating substrate (9). A rear side contact (3a) of a semiconductor chip (2) is connected with the contact structure that is arranged on the surface of the substrate, where the surface is turned towards the chip. The semiconductor chip is arranged between the electrically insulating substrate and another electrically insulating substrate (1) i.e. glass substrate. The structured electrically conductive layer contains a transparent conductive oxide and is coated with a metal layer. The electrically insulating substrate (9) contains ceramic, alumina or aluminum nitride. An independent claim is also included for a method for producing a surface-mountable component.

公开(公告)号：DE102007051168A1

公开(公告)日：2009-04-02

申请号：DE102007051168

申请日：2007-10-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED

IPC: H01L25/075 ,  H01L33/00

Abstract: The method involves producing multiple sub-layers consisting of layer stacks (ST) on a growth wafer by a layer deposition or an epitaxial growth. The layer stacks are separated mechanically in module units. The separated module units are tested and are detached from the temporary carrier (TT). The tested module units are fixed on a substrate and are combined to a light emitting diode-module. An independent claim is included for a light emitting diode-module with a substrate.

公开(公告)号：DE69939877D1

公开(公告)日：2008-12-18

申请号：DE69939877

申请日：1999-07-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  INST MATERIALS RESEARCH & ENG

Inventor： GUENTHER EWALD KARL MICHAEL ,  CHEN ZHONG ,  COTTERELL BRIAN

IPC: H01L21/027 ,  H05B33/10 ,  B81B7/00 ,  B81C1/00 ,  H01L27/32 ,  H01L33/26 ,  H01L33/42 ,  H01L51/50 ,  H01L51/52 ,  H01L51/56 ,  H05B33/02 ,  H05B33/26

公开(公告)号：DE10339985B4

公开(公告)日：2008-12-04

申请号：DE10339985

申请日：2003-08-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HAERLE VOLKER ,  GUENTHER EWALD KARL MICHAEL

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/0224 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02 ,  H01S5/022

公开(公告)号：DE69937407T2

公开(公告)日：2008-07-24

申请号：DE69937407

申请日：1999-07-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL

IPC: G09F9/30 ,  H01L31/12 ,  H01L21/44 ,  H01L27/32 ,  H01L33/00 ,  H01L51/52 ,  H05B33/00 ,  H05K5/02

Abstract: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

公开(公告)号：DE69937407D1

公开(公告)日：2007-12-06

申请号：DE69937407

申请日：1999-07-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL

IPC: G09F9/30 ,  H01L31/12 ,  H01L21/44 ,  H01L27/32 ,  H01L33/00 ,  H01L51/52 ,  H05B33/00 ,  H05K5/02

Abstract: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

公开(公告)号：DE69935261D1

公开(公告)日：2007-04-05

申请号：DE69935261

申请日：1999-12-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL

IPC: G02F1/1339 ,  H05B33/04 ,  H01L51/50 ,  H01L51/52

公开(公告)号：DE69908194T2

公开(公告)日：2004-02-05

申请号：DE69908194

申请日：1999-12-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  HAGEN KLAUSMANN

IPC: H05B33/04 ,  C09J201/00 ,  C09K3/10 ,  H01L25/04 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10 ,  H01L27/15 ,  H01L51/20

Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

公开(公告)号：DE102008025160A1

公开(公告)日：2009-12-03

申请号：DE102008025160

申请日：2008-05-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  WILM ALEXANDER ,  GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED

IPC: G02B27/18

Abstract: A multicolour LED, in which layers for generating light of different colors are arranged one above the other, is used as the light source in a projector.

公开(公告)号：DE502005003505D1

公开(公告)日：2008-05-08

申请号：DE502005003505

申请日：2005-09-13

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  SORG JOERG ERICH ,  STATH NORBERT

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62

Abstract: An optoelectronic component comprises a semiconductor chip (1) with a lower contact (4) on a support (10) both encapsulated by an electrically insulating transparent material (3) having holes to a contact (6) and connection area (8) that are joined by a conductive layer (14). Radiation emitted (13) is decoupled through the encapsulation. Independent claims are also included for the following: (A) a production process for the above;and (B) a lighting device as above.