公开(公告)号：EP1732113B1

公开(公告)日：2012-10-10

申请号：EP06076564.1

申请日：1999-06-22

Applicant: STMicroelectronics, Inc.

Inventor： Chan, Tsiu C. ,  Chiu, Anthony M. ,  Smith, Gregory C.

IPC: H01L21/288 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76873 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76877 ,  H01L23/53242 ,  H01L23/53252 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1732113A3

公开(公告)日：2011-08-31

申请号：EP06076564.1

申请日：1999-06-22

Applicant: STMicroelectronics, Inc.

Inventor： Chan, Tsiu C. ,  Chiu, Anthony M. ,  Smith, Gregory C.

IPC: H01L21/288 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76873 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76877 ,  H01L23/53242 ,  H01L23/53252 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming interconnects in an integrated circuit, comprising: forming a dielectric layer over a substrate; forming a groove (114) for an interconnect in the dielectric layer; forming an aluminium seed layer over the upper surface of the dielectric layer, over sidewalls of the groove, and over a bottom of the groove to a thickness of approximately 200 Å; zincating the substrate to form a zinc coating on the aluminium seed layer; plating the substrate with silver to form a conformal silver layer (116) on an upper surface of the dielectric layer and on sidewalls of the groove, filling an unfilled portion of the groove; and removing portions of the conformal silver layer on the dielectric layer, leaving a silver interconnect within the groove.

公开(公告)号：EP1640334B1

公开(公告)日：2009-11-25

申请号：EP05255976.2

申请日：2005-09-26

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M. ,  Siegel, Harry Michael

IPC: B81B7/00

CPC classification number: B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0163

公开(公告)号：EP1548824A3

公开(公告)日：2006-08-23

申请号：EP04257575.3

申请日：2004-12-06

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M. ,  Tee, Tong Yan

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2924/00014 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45099

Abstract: A system and method is disclosed for improving solder joint reliability in an integrated circuit package. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.

Abstract translation: 公开了一种用于提高集成电路封装中的焊点可靠性的系统和方法。 四边形，平坦的，非引线的集成电路封装的每个端子形成有在端子的底表面中限定焊料槽的部分。 集成电路封装的管芯焊盘的外表面也形成有在管芯焊盘的周边上限定多个焊料槽的部分。 当将焊料施加到管芯焊盘和端子时，填充焊料槽的焊料增加了集成电路封装的焊点可靠性。

公开(公告)号：EP1646102A2

公开(公告)日：2006-04-12

申请号：EP05256167.7

申请日：2005-10-03

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M.

IPC: H01M8/06

CPC classification number: H01M8/0612 ,  H01M8/04089 ,  H01M8/04201 ,  H01M8/04291 ,  H01M8/0656 ,  H01M8/186 ,  H01M2008/1095 ,  Y02E60/528

Abstract: A fuel cell device includes a housing containing a fuel processor that generates fuel gas and a fuel cell having electrodes forming an anode and cathode, and an ion exchange electrolyte positioned between the electrodes. The housing can be formed as first and second cylindrically configured outer shell sections that form a battery cell that is configured similar to a commercially available battery cell. A thermal-capillary pump can be operative with the electrodes and an ion exchange electrolyte, and operatively connected to the fuel processor. The electrodes are configured such that heat generated between the electrodes forces water to any cooler edges of the electrodes and is pumped by capillary action back to the fuel processor to supply water for producing hydrogen gas. The electrodes can be formed on a silicon substrate that includes a flow divider with at least one fuel gas input channel that can be controlled by a MEMS valve.

Abstract translation: 一种燃料电池装置包括：壳体，该壳体包含产生燃料气体的燃料处理器和具有形成阳极和阴极的电极以及位于电极之间的离子交换电解质的燃料电池。 壳体可以形成为第一和第二圆柱形构造的外壳部分，其形成类似于市售电池单元的电池单元。 热毛细管泵可以与电极和离子交换电解质一起操作，并可操作地连接到燃料处理器。 电极被配置成使得在电极之间产生的热量迫使水流到电极的任何较冷的边缘并且通过毛细作用被泵送回到燃料处理器以供应用于产生氢气的水。 电极可形成在硅衬底上，该硅衬底包括具有至少一个可由MEMS阀控制的燃料气体输入通道的分流器。

公开(公告)号：EP1640334A2

公开(公告)日：2006-03-29

申请号：EP05255976.2

申请日：2005-09-26

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M. ,  Siegel, Harry Michael

IPC: B81B7/00

CPC classification number: B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0163

Abstract: An integrated lid for micro-electro-mechanical system (MEMS) devices is formed from a nitride layer deposited over a cavity containing movable parts for the device. Pillars are formed through openings within large area movable parts to support the lid over those parts. Slides are formed and moved under large etchant openings through the lid to allow the openings to be sealed by sputtering.

Abstract translation: 用于微机电系统（MEMS）器件的集成盖由淀积在包含用于器件的可移动部件的腔体上的氮化物层形成。 支柱通过大面积可移动部件内的开口形成，以支撑盖在这些部件上方。 形成滑块并在大的蚀刻剂开口下移动通过盖子以允许通过溅射密封开口。

公开(公告)号：EP1333480A3

公开(公告)日：2004-08-25

申请号：EP03250537.2

申请日：2003-01-29

Applicant: STMicroelectronics, Inc.

Inventor： Siegel, Harry Michael ,  Chiu, Anthony M.

IPC: H01L21/56

CPC classification number: H01L21/566 ,  H01L23/3107 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The preformation of the film allows materials to be used that are not suitable for use with prior art methods.

公开(公告)号：EP1341231A2

公开(公告)日：2003-09-03

申请号：EP03250539.8

申请日：2003-01-29

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M. ,  Siegel, Harry Michael

IPC: H01L23/522 ,  H01L21/768 ,  H01L21/3105

CPC classification number: H01L21/481 ,  H01L21/4857 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/09781 ,  H05K2201/09881 ,  H05K2203/0278 ,  H01L2924/00014

Abstract: A system and method is disclosed for providing mechanical planarization of a sequential build up substrate for an integrated circuit package. A planarization plate is placed in contact with an uneven external surface of a dielectric layer that covers underlying functional circuit elements and filler circuit elements. A heating element in the planarization plate flattens protruding portions of the external surface of the dielectric layer to create a flat external surface on the dielectric layer. After the flat external surface of the dielectric layer has cooled, it is then covered with a metal conductor layer. The method of the present invention increases the number of sequential buildup layers that may be placed on a sequential buildup substrate.

公开(公告)号：EP1321931A2

公开(公告)日：2003-06-25

申请号：EP02258372.8

申请日：2002-12-04

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M. ,  Thomas, Danielle A.

IPC: G11B7/135 ,  G02B6/00

CPC classification number: G11B7/1372 ,  G02B6/4214 ,  G02B6/43 ,  G11B7/123

Abstract: 028 Light from a laser diode is directed by mirrors on angled surfaces of an optical unit through a first lens at an optical disc. Light returns from the disc on a parallel path through a second lens and is directed at a photodetector. A semiconductor device controls the operation of the laser diode and receives signals form the photodetector for processing. The optical unit is formed from one or two glass elements cut from a larger glass wafer or wafers using photolithographic techniques. The mirrors are formed by thin films deposited on angled glass surfaces formed by selective plasma etching of the wafers. At least one mirror is partially reflective and is formed by depositing a thin film of titanium nitride.

Abstract translation: 028来自激光二极管的光由镜子通过光盘上的第一透镜在光学单元的倾斜表面上引导。 光从平行路径通过第二透镜从光盘返回并且被引导到光电检测器。 半导体器件控制激光二极管的操作并从光电检测器接收信号进行处理。 光学单元由使用光刻技术的较大玻璃晶片或晶片切割的一个或两个玻璃元件形成。 反射镜由沉积在通过晶片的等离子体蚀刻形成的倾斜玻璃表面上的薄膜形成。 至少一个反射镜是部分反射的，并且通过沉积氮化钛薄膜而形成。

公开(公告)号：EP1018698A3

公开(公告)日：2000-12-06

申请号：EP99310543.6

申请日：1999-12-23

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M.

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: A structure and method is disclosed for dissipating electrostatic charges comprising an insulating layer between and over a plurality of conductive plates, wherein the insulating layer isolates the conductive plates and protects the conductive plates from damage, and wherein the insulating layer comprises a conductive discharge grid adjacent the conductive plates.