公开(公告)号：EP4140942A1

公开(公告)日：2023-03-01

申请号：EP22190178.8

申请日：2022-08-12

Applicant: STMicroelectronics S.r.l.

Inventor： FERRARI, Paolo ,  VILLA, Flavio Francesco ,  CAMPEDELLI, Roberto ,  LAMAGNA, Luca ,  DUQI, Enri ,  AZPEITIA URQUIA, Mikel ,  NICOLI, Silvia ,  TURI, Maria Carolina

IPC: B81C1/00

Abstract: Method for manufacturing a micro-electro-mechanical device (30; 30'), comprising the steps of: forming, on a substrate (2), a first protection layer (5) of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer (5), a sacrificial layer (8, 8') of silicon oxide removable with HF; forming, on the sacrificial layer (8, 8'), a second protection layer (15) of crystallized aluminum oxide; exposing a sacrificial portion (8') of the sacrificial layer (8, 8'); forming, on the sacrificial portion (8'), a first membrane layer (20) of a porous material, permeable to HF; forming a cavity (22) by removing the sacrificial portion (8') through the first membrane layer (20); and sealing pores of the first membrane layer (20) by forming a second membrane layer (24) on the first membrane layer (20).

公开(公告)号：EP3936907A1

公开(公告)日：2022-01-12

申请号：EP21184894.0

申请日：2021-07-09

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  BONI, Nicolò ,  MERLI, Massimiliano ,  DUQI, Enri

IPC: G02B5/18 ,  G02B26/08 ,  G02B26/10

Abstract: The MEMS micromirror device (20) is formed in a package (24) including a containment body (22) and a lid (26) transparent to a light radiation. The package forms a cavity (23) housing a tiltable platform (21) having a reflecting surface (21A). A metastructure (30-32) is formed on the lid (26) and/or on the reflecting surface (21A) and comprises a plurality of diffractive optical elements (35).

公开(公告)号：EP3326964B1

公开(公告)日：2019-07-24

申请号：EP17172106.1

申请日：2017-05-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  GIUSTI, Domenico

IPC: B81C1/00 ,  B81B7/00

公开(公告)号：EP3263516A9

公开(公告)日：2018-04-11

申请号：EP16206894.4

申请日：2016-12-23

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  DUQI, Enri ,  CONTI, Sebastiano

IPC: B81B3/00 ,  G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B3/0045 ,  B81B7/008 ,  B81B2201/042 ,  B81B2203/0315 ,  B81B2203/056 ,  G02B26/0841 ,  G02B26/101 ,  G05F3/26 ,  H02M1/12 ,  H02M1/15 ,  H02M1/42 ,  H02M1/4225 ,  H02M1/4258 ,  H02M3/33507 ,  H02M2001/0025 ,  H02M2001/0032 ,  H04N9/3155 ,  H04N9/3173 ,  Y02B70/16

Abstract: A micro-electro-mechanical device (50), wherein a platform (52) is formed in a top substrate and is configured to turn through a rotation angle (θ). The platform has a slit (70) and faces a cavity (53). A plurality of integrated photodetectors (70) is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

Abstract translation: 一种微电子机械装置（50），其中平台（52）形成在顶部基板中并且构造成转过旋转角度（θ）。 该平台具有狭缝（70）并且面向空腔（53）。 多个集成光电检测器（70）形成在底部基板中以便检测通过狭缝的光并且通过狭缝产生与光相关的信号。 狭缝的面积随着平台的旋转角度而变化并引起衍射，或多或少地作为角度的函数来标记。 相对于狭缝布置在不同位置的两个光电检测器的信号之间的差异产生角度。

公开(公告)号：EP3263516A1

公开(公告)日：2018-01-03

申请号：EP16206894.4

申请日：2016-12-23

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  DUQI, Enri ,  CONTI, Sebastiano

IPC: B81B3/00 ,  G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B3/0045 ,  B81B7/008 ,  B81B2201/042 ,  B81B2203/0315 ,  B81B2203/056 ,  G02B26/0841 ,  G02B26/101 ,  G05F3/26 ,  H02M1/12 ,  H02M1/15 ,  H02M1/42 ,  H02M1/4225 ,  H02M1/4258 ,  H02M3/33507 ,  H02M2001/0025 ,  H02M2001/0032 ,  H04N9/3155 ,  H04N9/3173 ,  Y02B70/16

Abstract: A micro-electro-mechanical device (50), wherein a platform (52) is formed in a top substrate and is configured to turn through a rotation angle (θ). The platform has a slit (70) and faces a cavity (53). A plurality of integrated photodetectors (70) is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

公开(公告)号：EP3205997A1

公开(公告)日：2017-08-16

申请号：EP17156382.8

申请日：2017-02-15

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  MURARI, Bruno ,  CONTI, Sebastiano

IPC: G01L19/06 ,  G01L9/00 ,  G01L15/00

CPC classification number: B81B7/0041 ,  B81B2201/0264 ,  G01L9/0054 ,  G01L9/0072 ,  G01L15/00 ,  G01L19/0645

Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

Abstract translation: 封装的压力传感器，包括：MEMS压力传感器芯片; 以及弹性体材料的封装层，特别是PDMS，其在MEMS压力传感器芯片上方延伸并且形成用于将施加在其表面上的力传递到MEMS压力传感器芯片的装置。

公开(公告)号：EP3141521A1

公开(公告)日：2017-03-15

申请号：EP16161870.7

申请日：2016-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  CONTI, Sebastiano

IPC: B81B7/00

Abstract: A MEMS device (20) is provided with: a supporting base (22), having a bottom surface (22b) in contact with an external environment; a sensor die (24), which is of semiconductor material and integrates a micromechanical detection structure (25); a sensor frame (30), which is arranged around the sensor die (24) and is mechanically coupled to a top surface (22a) of the supporting base (22); and a cap (36), which is arranged above the sensor die (24) and is mechanically coupled to a top surface (30a) of the sensor frame (30), a top surface (36a) of the cap (36) being in contact with an external environment. The sensor die (24) is mechanically decoupled from the sensor frame (30).

Abstract translation: MEMS器件（20）具有：支撑基座（22），具有与外部环境接触的底面（22b）; 传感器芯片（24），其是半导体材料并且集成了微机械检测结构（25）; 传感器框架（30），其布置在所述传感器模具（24）周围并机械地联接到所述支撑基座（22）的顶表面（22a）; 以及盖（36），其设置在所述传感器模具（24）的上方并且机械地联接到所述传感器框架（30）的顶表面（30a），所述盖子（36）的顶表面（36a）处于 与外部环境接触。 传感器模具（24）与传感器框架（30）机械地分离。

公开(公告)号：EP4239305A1

公开(公告)日：2023-09-06

申请号：EP23157007.8

申请日：2023-02-16

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  FEDELI, Patrick ,  MANCA, Nicolò ,  ADORNO, Silvia

IPC: G01L27/00 ,  H04W4/029 ,  G01C5/06 ,  G01C25/00

Abstract: Method (50) for determining a first (P 1 ') and a second (P 2 ') calibrated value of atmospheric pressure, performed by an electronic apparatus (10) comprising a fixed device (14) and a first (12a) and a second (12b) movable device comprising respectively a first (16a) and a second (16b) movable barometer. The method (50) comprises: determining (S10) whether the movable devices are being inductively charged by the fixed device; if so, acquiring (S12) respective measured values of atmospheric pressure (P 1 , P 2 ) through the movable barometers (16a, 16b), and a reference value of atmospheric pressure (P rif ) in a common reference point of the electronic apparatus (10), the movable barometers being at respective predefined height differences (Δh) with respect to the common reference point; calculating (S14) respective pressure differences (ΔP 1 , ΔP 2 ) as a function of the measured values of atmospheric pressure and of the reference value of atmospheric pressure; and when the movable devices are not being charged, acquiring (S20) new measured values of atmospheric pressure through the movable barometers, and determining (S20) the respective calibrated values of atmospheric pressure as a function of the new measured values of atmospheric pressure and of the pressure differences.

公开(公告)号：EP4092475A1

公开(公告)日：2022-11-23

申请号：EP22171657.4

申请日：2022-05-04

Applicant: STMicroelectronics S.r.l.

Inventor： BONI, Nicolò ,  MENDICINO, Gianluca ,  DUQI, Enri ,  CARMINATI, Roberto ,  MERLI, Massimiliano

IPC: G02B26/08

Abstract: A microelectromechanical mirror device (1; 100) has, in a die (1') of semiconductor material: a fixed structure (4) defining a cavity (3); a tiltable structure (2) carrying a reflecting region (2'), elastically suspended above the cavity; at least a first pair of driving arms (12a, 12b), coupled to the tiltable structure and carrying respective piezoelectric material regions (13) which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements (6a, 6b), which couple the tiltable structure elastically to the fixed structure, being stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor (20), configured to provide a detection signal (S r ) indicative of the rotation of the tiltable structure. At least one test structure (30, 30') is integrated in the die to provide a calibration signal (S c ) indicative of a sensitivity variation of the piezoresistive sensor (20), in order to calibrate the detection signal (S r ).

公开(公告)号：EP3854751A1

公开(公告)日：2021-07-28

申请号：EP21152454.1

申请日：2021-01-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BONI, Nicolò ,  BALDO, Lorenzo ,  MERLI, Massimiliano ,  CARMINATI, Roberto

IPC: B81C1/00 ,  G02B26/08

Abstract: A method of processing a wafer (100) for manufacturing an oscillating structure (30), comprising the steps of: forming torsional elastic elements (56, 58); forming a mobile element (54, 60) connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure (112); and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.