公开(公告)号：EP0764352A4

公开(公告)日：2000-03-15

申请号：EP95923103

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09 ,  H01R23/68

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A connector for microelectronic elements includes a sheet-like body (30) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有多个孔（36）的片状体（3），期望地布置成规则的格子图案。 每个孔设置有弹性层状接触件（38），其具有向内延伸到主体中的孔的多个突起（42）。 具有诸如其上的焊球的凸起引线（70）的微电子元件（68）可以通过使凸块引线进入连接器的孔而与连接器接合，以使触点与触点接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：AT342582T

公开(公告)日：2006-11-15

申请号：AT95924747

申请日：1995-06-29

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/56 ,  H01R13/24 ,  H01R12/22

Abstract: A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

公开(公告)号：AT267474T

公开(公告)日：2004-06-15

申请号：AT95923103

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：AU2928697A

公开(公告)日：1997-11-19

申请号：AU2928697

申请日：1997-05-01

Applicant: TESSERA INC

Inventor： SMITH JOHN W

IPC: H01L21/56 ,  H01L23/055 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  B23K31/02 ,  H01B1/02 ,  H01R3/08 ,  H01R9/09 ,  H05K3/34 ,  H05K7/10

Abstract: A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

公开(公告)号：AU3138995A

公开(公告)日：1996-02-16

申请号：AU3138995

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R9/09

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：WO9828955A2

公开(公告)日：1998-07-02

申请号：PCT/US9723949

申请日：1997-12-12

Applicant: TESSERA INC

Inventor： SMITH JOHN W ,  FJELSTAD JOSEPH

IPC: H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H05K

CPC classification number: H01L23/49816 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

Abstract: A structure (13) including a conductive, preferably metallic conductive layer (26) is provided with leads (12) on a bottom surface. The leads have fixed (16) ends permanently attached to the structure and free ends (18) detachable from the structure. The structure is engaged with a microelectronic element (22) such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals (32) connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

Abstract translation: 包括导电优选金属导电层（26）的结构（13）在底表面上设置有引线（12）。 引线具有永久地附接到结构的固定的（16）端部，并且可自由结构的自由端（18）可拆卸。 该结构与诸如半导体芯片或晶片的微电子元件（22）接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构来使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为连接到至少一些引线的单独的电端子（32）。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：WO0111662A2

公开(公告)日：2001-02-15

申请号：PCT/US0022227

申请日：2000-08-11

Applicant: TESSERA INC

Inventor： HABA BELGACEM ,  SMITH JOHN W

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/768 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/40 ,  H05K3/46 ,  H01L

CPC classification number: H05K3/4076 ,  H01L21/486 ,  H01L2924/0002 ,  H05K2203/083 ,  H05K2203/085 ,  H05K2203/1105 ,  H01L2924/00

Abstract: Electrical connections are made between a pair of elements (32, 38) disposed on opposite side of a hole (28) extending through a dielectric layer (20) by evaporating a conductive material (40) such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

Abstract translation: 通过蒸发导电材料（40），例如具有高蒸气压的金属，在穿过介电层（20）延伸穿过介电层（20）的相对侧上的一对元件（32,38） 同时保持孔处于基本密封的状态。 该过程可以同时进行以在微电子单元内形成多个连接，例如在多层电路板内。

公开(公告)号：EP0792573A4

公开(公告)日：1998-02-25

申请号：EP95942861

申请日：1995-11-16

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

CPC classification number: H05K7/20445 ,  H01L23/3672 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T29/4935

Abstract: A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors (94, 96). The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.

Abstract translation: 用于将热量从诸如半导体芯片的微电子部件传导到散热器的热连接器。 连接器包括大量柔性热导体，期望形成为细长的“S”形条带。 导体可以弯曲以适应由热膨胀引起的部件的组装和位移偏差。 导体可以具有相对较薄的颈部部分以增加导体的柔性。连接器可以通过包括将导体制成扁平条的方法制造，导体连接到一对相对的平面片并垂直移动片 彼此远离地将导体垂直地扩展到它们的最终三维配置。

公开(公告)号：EP1206325A4

公开(公告)日：2006-08-02

申请号：EP00954052

申请日：2000-08-11

Applicant: TESSERA INC

Inventor： HABA BELGACEM ,  SMITH JOHN W

IPC: H05K3/40 ,  B05D5/12 ,  H01L21/48 ,  H01L21/60 ,  H01L21/768 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/46

CPC classification number: H05K3/4076 ,  H01L21/486 ,  H01L2924/0002 ,  H05K2203/083 ,  H05K2203/085 ,  H05K2203/1105 ,  H01L2924/00

Abstract: Electrical connections are made between a pair of elements (32, 38) disposed on opposite side of a hole (28) extending through a dielectric layer (20) by evaporating a conductive material (40) such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

公开(公告)号：EP0853816A4

公开(公告)日：1999-12-22

申请号：EP96933850

申请日：1996-09-23

Applicant: TESSERA INC

Inventor： FARACI TONY ,  DISTEFANO THOMAS H ,  SMITH JOHN W

IPC: H01L25/18 ,  H01L21/60 ,  H01L25/04 ,  H01L21/44

CPC classification number: H01L24/86 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/7965 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

Abstract: A plurality of separate semiconductor chips (58), each having a contact-bearing surface (59) and contacts (64) on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet (30) with terminals (34) thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads (40) are disposed between the dielectric element and the semiconductor chips. Each lead has a first end (42) connected to a terminal on the dielectric element, and a second end (44) connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

Abstract translation: 多个单独的半导体芯片，每个分别具有接触表面和在该表面上的触点，被布置成阵列，使得接触表面面对并限定阵列的第一表面。 具有端子的柔性介电片覆盖在半导体芯片的第一或接触支承表面上。 细长引线设置在介质元件和半导体芯片之间。 每个引线具有连接到电介质元件上的端子的第一端，以及连接到阵列中的半导体芯片上的触点的第二端。 所有的引线通过相对于彼此移动介质元件和阵列同时地相对于所有第二端同时移位引线的所有第一端而同时形成。 电介质元件在成形步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。