公开(公告)号：US09942981B2

公开(公告)日：2018-04-10

申请号：US15603326

申请日：2017-05-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US20130096233A1

公开(公告)日：2013-04-18

申请号：US13637629

申请日：2011-03-22

Applicant: Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

Inventor： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC: C08L63/00 ,  C08K9/02 ,  C08K3/10 ,  C08K3/22

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Abstract translation: 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US20120305295A1

公开(公告)日：2012-12-06

申请号：US13576893

申请日：2010-02-03

Applicant: Kazuya Kimura ,  Kazuhiko Ooga ,  Kiichiro Miura

Inventor： Kazuya Kimura ,  Kazuhiko Ooga ,  Kiichiro Miura

IPC: C09D175/04 ,  H05K3/22 ,  H05K1/02

CPC classification number: C08G18/6674 ,  C08G18/0852 ,  C08G18/4833 ,  C08G18/4845 ,  C08G18/758 ,  C08L63/00 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0227

Abstract: It is an object of the present invention to provide a thermosetting composition which is excellent in low warpage properties and long-term electrical insulation reliability and is capable of forming an insulating film that inhibits disconnection of wiring of a flexible wiring board. The thermosetting composition of the present invention is a thermosetting composition for forming an insulating film, by curing the composition, on a flexible wiring board comprising a wiring pattern formed on a flexible substrate, and is characterized in that a cured product obtained by curing the composition has a tensile elastic modulus of 0.5 to 2.0 GPa.

Abstract translation: 本发明的目的是提供一种热弯性组合物，其具有优异的低翘曲性能和长期的电绝缘可靠性，并且能够形成一种绝缘膜，其阻止柔性布线板的布线断开。 本发明的热固性组合物是通过固化该组合物而形成绝缘膜的热固性组合物，该柔性布线板包括形成在柔性基板上的布线图案，其特征在于，将通过固化该组合物而获得的固化产物 拉伸弹性模量为0.5〜2.0GPa。

公开(公告)号：EP1200509B1

公开(公告)日：2004-11-24

申请号：EP00945027.1

申请日：2000-07-01

Applicant: Kreido Laboratories

Inventor： HOLL, Richard, A.

IPC: C08J3/20 ,  C08K3/00 ,  C08K3/08 ,  C08K3/22 ,  C08K5/00 ,  C08K7/22 ,  C08K9/10 ,  C08L71/12 ,  H01B3/30

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

公开(公告)号：EP1200509A1

公开(公告)日：2002-05-02

申请号：EP00945027.1

申请日：2000-07-01

Applicant: Holl Technologies Company

Inventor： HOLL, Richard, A.

IPC: C08J3/20 ,  C08K3/00 ,  C08K3/08 ,  C08K3/22 ,  C08K5/00 ,  C08K7/22 ,  C08K9/10 ,  C08L71/12 ,  H01B3/30

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

公开(公告)号：JP5576930B2

公开(公告)日：2014-08-20

申请号：JP2012507012

申请日：2011-03-22

Applicant: パナソニック株式会社

Inventor： 知明 岩見 ,  匡陽 松本 ,  智之 阿部 ,  神夫 米本 ,  弘明 藤原

IPC: C08G59/20 ,  C08G59/68 ,  C08J5/24 ,  C08K3/22 ,  C08K3/24 ,  C08K9/02 ,  C08L63/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

公开(公告)号：WO2017012119A1

公开(公告)日：2017-01-26

申请号：PCT/CN2015/084938

申请日：2015-07-23

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  HUANG, Yan ,  CHEN, Hongyu ,  YANG, Yunfeng ,  DU, Libo

Inventor： HUANG, Yan ,  CHEN, Hongyu ,  YANG, Yunfeng ,  DU, Libo

IPC: C04B35/583 ,  B29B9/08

CPC classification number: C04B35/62836 ,  C04B35/03 ,  C04B35/10 ,  C04B35/14 ,  C04B35/581 ,  C04B35/62886 ,  C04B35/62892 ,  C04B35/634 ,  C04B2235/386 ,  C04B2235/5427 ,  C04B2235/5436 ,  C08K3/36 ,  C08K9/10 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/003 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0227

Abstract: Thermally conductive particles with core-shell structure, a method for forming the particles, a composition containing the particles and a resin and a polymer composite material formed from the composition. The particle is useful for a thermal management element of electronic devices.

Abstract translation: 具有核 - 壳结构的导热性颗粒，形成颗粒的方法，含有颗粒的组合物和树脂以及由该组合物形成的聚合物复合材料。 该颗粒可用于电子设备的热管理元件。

公开(公告)号：WO2014196444A1

公开(公告)日：2014-12-11

申请号：PCT/JP2014/064277

申请日：2014-05-29

Applicant: 昭和電工株式会社

Inventor： 内田　博 ,  若林　正一郎 ,  原　真尚 ,  ドウ　クン

IPC: C08L101/12 ,  C08K3/04 ,  C08K3/08 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/22 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/044 ,  C08K3/045 ,  C08K3/046 ,  C08K3/08 ,  C08K2201/001 ,  C08K2201/016 ,  H01B13/003 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2203/102 ,  C08L63/00

Abstract: 【課題】マイクロ波により加熱する場合に、スパークの発生を抑制することができるマイクロ波加熱用導電性樹脂組成物を提供する。 【解決手段】炭素質ではない導電フィラーと、硬化性を有するバインダー樹脂と、炭素質ではない導電フィラーより体積固有抵抗値が高い炭素質材料とを含み、炭素質ではない導電フィラーとバインダー樹脂の合計１００質量部に対してアスペクト比が２０以下の炭素質材料を１～２０質量部含むマイクロ波加熱用導電性樹脂組成物。上記炭素質材料がマイクロ波を効率的に吸収することにより、マイクロ波を照射して導電性樹脂組成物を加熱・硬化する際に、スパークの発生を抑制することができる。

Abstract translation: 为了提供微波加热用导电性树脂组合物，所述导电性树脂组合物在进行微波加热时几乎不产生火花。 [溶液]将要进行微波加热并包含非碳质导电填料，可固化粘合剂树脂和体积电阻率值高于非碳质导电填料的碳质材料的导电树脂组合物和 碳质材料的纵横比为20以下，相对于非碳质导电性填料和粘合剂树脂的总计100质量份，含有1〜20质量份。 碳质材料有效地吸收微波，使得当通过微波照射加热和固化时，导电树脂组合物几乎不引起火花。

公开(公告)号：US11895768B2

公开(公告)日：2024-02-06

申请号：US17641548

申请日：2019-10-02

Applicant: ROGERS CORPORATION

Inventor： Eui Kyoon Kim ,  Bruce Fitts ,  Christopher Brown

IPC: H05K1/02 ,  H05K1/03 ,  C23C16/455 ,  C23C16/40

CPC classification number: H05K1/0204 ,  C23C16/403 ,  C23C16/45525 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0293

Abstract: In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

公开(公告)号：US20190203003A1

公开(公告)日：2019-07-04

申请号：US16009266

申请日：2018-06-15

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： CHIH-WEI LIAO ,  GUAN-SYUN TSENG ,  TSUNG-HSIEN LIN ,  JU-MING HUANG ,  CHEN-HUA YU

IPC: C08J5/24 ,  C08L63/00 ,  C09D163/00 ,  C09D5/18 ,  B32B15/092 ,  H05K1/03 ,  H05K1/02 ,  H05K3/02

CPC classification number: C08J5/24 ,  B32B15/092 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2421/00 ,  C08J2465/02 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2207/53 ,  C09D5/18 ,  C09D163/00 ,  H05K1/024 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0212 ,  H05K2201/0227

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.