Abstract:
PROBLEM TO BE SOLVED: To provide an optical device module which can be easily manufactured and made compact and in which insertion work into a case body is easily performed. SOLUTION: A solid-state imaging device 11 is connected to one end of a flexible substrate 13, and the other end is turned to an external connection part 15 provided with an external take-out electrode 15b. On the loading part 135 of the flexible substrate 13, a plurality of electronic components 17a and 17b are loaded. The flexible substrate 13 is bent so as to form an acute angle with the solid-state imaging element 11 at a first bend part and is bent so as to form an acute angle with the external terminal part 15 at a second bend part 15a. Then, the two acute angles are in the relation of alternate-interior angles, and a solid-state imaging apparatus 1 is Z-shaped on the cross section. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
The invention relates to an electronic device (13) for a display device (2) of a motor vehicle (1), with a first circuit board (15) and with a second circuit board (16), wherein the first circuit board (15) has a first support element (19) and the second circuit board (16) has a second support element (20) separate from the first support element (19), and wherein the second support element (20) is disposed inclined to the first support element (19) at a predetermined angle (α), wherein the first circuit board (15) and the second circuit board (16) have at least one common conducting track (26), wherein the first support element (19) and the second support element (20) are connected to each other in a connecting area (27) by the at least one conducting track (26).
Abstract:
An electronic apparatus (100) comprises a PCB (30) arranged in a box-shaped housing (40) having a bottom (41) and sidewalls (42, 43). The PCB comprises a central section (35) and two side sections (34, 36), separated by two longitudinal elongate bending portions (33A; 33B), respectively. The PCB is bent so that said side sections are at an angle 90° with respect to said central section. Said central section is in good thermal contact with the housing bottom preferably over the entire surface area of said central PCB section. Said side sections are in good thermal contact with the housing side walls, respectively, preferably over the entire surface area of said side sections. Thus, the apparatus combines a compact design with a good heat discharge capability.
Abstract:
PROBLEM TO BE SOLVED: To provide an optical transceiver which deals with the downsizing using a transmitting and receiving integrated type optical transmitter receiver module and reduces the manufacturing costs.SOLUTION: An FPC substrate 3 integrally includes: a fixing part 31 adhering to a substrate 21; a first portion 32 which extends from the fixing part 31 to the side of an optical transmitter receiver module 1, has a bending part arranged substantially parallel with a width direction of the substrate 21, and is arranged substantially perpendicular to an optical axis of an optical transmission part 11; and a second portion 33 which extends from the other part of the fixing part 31 to the optical transmitter receiver module 1 and has a bending part arranged substantially perpendicular to the first portion 32. The optical transmitter receiver module 1 is connected with a transmitter-receiver circuit 2 by the FPC substrate 3 and those components are housed in a housing.
Abstract:
본 발명의 한 실시예에 따르면, 구조물은 가요성(flexible) 부재와, 상기 가요성 부재에 부착되고, 상기 가요성 부재의 적어도 일부분의 변형을 방지하기 위한 적어도 하나의 보강(reinforcement) 부재, 및 상기 적어도 하나의 보강 부재를 부착시킨 상기 가요성 부재를 탑재하기 위한 설치(mounting) 부재를 포함할 수 있다. 다양한 다른 실시예들이 가능하다
Abstract:
According to one exemplary embodiment, a mounting structure 100 may include a flexible member 110, at least one reinforcement member 120-1, 120-2 attached to the flexible member, and preventing the deformation of at least one portion of the flexible member, and a mounting member 130 for mounting the flexible member attaching the at least one reinforcement member. Various other exemplary embodiments are possible.
Abstract:
The present embodiments provide channel letter lighting devices and/or systems. A lighting system, comprising a plurality of electrically connected lighting units, comprising conductors to provide an electrical signal to each of the units. Each of the lighting units comprise a housing, a printed circuit board (PCB) mounted within the housing and having a plurality of tabs and a plurality light emitting elements on the tabs. The tabs are angled in relation of the remainder of the PCB or housing. The electrical signal applied to the light emitting elements causes them to emit light substantially away from said housing. The lighting system further comprises a sealant within the housing filling cavities around the light emitting elements and the cavity around said PCB and a mounting mechanism for mounting the unit to a structure.