Abstract:
표면 마운트 회로 보호 장치 (10)는 제1 및 제2 주표면 및 이들 사이의 두께를 갖는 층상 PTC 저항 요소(12)를 포함한다. 제1 주표면과 실질적으로 함께 연장되는 제1 전극층은 인쇄 회로 기판에 납땜되기에 적합한 제1 금속 물질로 형성된다. 제2 주표면에 형성된 제2 전극 층은 용접 플레이트(18)을 형성하거나 정의하는 구조를 포함한다. 금속 용접 플레이트는 장치에 대하여 결과적으로 현저한 손상을 일으키지 않고 스트랩 인터커넥트(34)의 저항 마이크로 스팟용접을 견딜 수 있는 열 질량 및 두께를 갖는다. 상기 장치는 바람직하게는 배터리 스트랩 인터커넥트에 의해 배터리/전지에 연결된 배터리 보호 회로를 형성하는 인쇄 회로 기판 어셈블리 (20)에 표면 마운트되며, 이때, 배터리 스트랩 인터커넥트 중 하나가 장치의 용접 풀레이트에 마이크로 스팟용접되는 것이 바람직하다. 스팟 용접, 표면 마운트, 스트랩 인터커넥트
Abstract:
A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.
Abstract:
A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.
Abstract:
In an electric circuit comprising a plurality of power semiconductor devices (1), each of the power semiconductor devices has a heat-dissipating metal part (5) that is electrically connected to an electrode of the device inside the semiconductor package, and the heat-dissipating metal parts of the power semiconductor devices of which the electrodes connected to the heat radiating metal parts are at the same potential are connected and fixed to an electrically conductive heat-dissipating body to use the body as a connecting terminal. Further, some of the heat-dissipating bodies are electrically connected and fixed to an electrically conductive heat-dissipating plate (7) to use it as a connecting terminal. Alternatively, the heat-dissipating bodies are electrically insulated from and fixed to another heat-dissipator (11).
Abstract:
A method for mounting electronic components, such as capacitor, to a flat flexible insulating substrate (16) having conductive material thereon. In one form of the invention, an electronic component (14) is attached to a given area of the substrate with one conductive side (14b) of the electronic component in electrical connection with the conductive material on the substrate. A slot (20) is formed in the substrate substantially about the electronic component but less than 360° thereabout to define a tongue (22a), including the electronic component, and an integral hinge portion (24) of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360 ° slot (56) is formed in the substrate (50). One conductive (46) side of the electronic component (14) is in electrical connection with the conductive material on the substrate (58) within the closed slot, and the other conductive side (14) of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal (62) is electrically connected to the conductive material on the substrate inside the closed slot.
Abstract:
A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.