Abstract:
PROBLEM TO BE SOLVED: To provide an actuator of piezoelectric actuation type, solving problems of the actuation voltage shift and stiction of electrodes, and, thereby, having a small secular change and stable actuation characteristics. SOLUTION: The actuator includes: a substrate 110; a fixed electrode 140 provided on a major surface 112 of the substrate 110; a first dielectric film 150 provided on the fixed electrode 140, and made of crystalline material; a movable beam 200 opposed to the major surface 112, and held above the substrate 110 with a gap thereto; a movable electrode 202 provided on a surface of the movable beam 200, opposed to the fixed electrode 140, and AC voltage being applied between the movable electrode 202 and the fixed electrode 140; and a second dielectric film 250 provided on a surface opposed to the fixed electrode 140, and made of crystalline material. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an actuator of which the maximum electrostatic capacity is made large by reducing the influence of warpage of a beam, and, moreover, in which steep variation in the electrostatic capacity around the maximum electrostatic capacity is relaxed, and to provide electronic equipment using the actuator. SOLUTION: The actuator includes: a first beam extending from a first fixed end to a first connection end; a first fixed part connecting the first fixed end and a substrate, and supporting the first beam above a main surface of the substrate while keeping a gap therebetween; a second beam extending from a second connection end to a first acting end, provided in parallel with the first beam, and having a fist division part divided by a first slit extending from the first acting end toward the second connection end; a first connection part connecting the first connection end and the second connection end, and supporting the second beam above the main surface of the substrate while keeping the gap therebetween; and a first fixed electrode opposed to part of the first acting end side of the first division part, and provided on the main surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a microphone having flexibility, foldability and bendability by forming an MEMS (micro-electromechanical system) transducer structure on a flexible polymeric substrate by using a PECVD (plasma enhanced chemical vapor deposition) process. SOLUTION: A manufacturing method of a flexible MEMS transducer includes a step of forming a sacrificial layer 210 on the flexible substrate; step of laminating a membrane layer 220 on the layer 210 by the PECVD process, and then patterning the layer 220; step of depositing a lower electrode layer 230 on the layer 220, and then patterning the layer 230; step of depositing a piezoelectric polymer on the layer 230, depositing an upper electrode layer 250 thereon, patterning the layer 250, and then patterning the piezoelectric polymer to form an active layer 240; step of forming a first connection pad 272 so as to be connected to the layer 230, and forming a second connection pad 271 so as to be connected to the layer 250; and step of removing the layer 210. COPYRIGHT: (C)2004,JPO
Abstract:
A semiconductor device (100, 200) includes a first silicon layer (111) disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers. A cavity (102) within the first silicon layer is bounded by interior surfaces of the second and third silicon layers, and a passageway (101) extends through the second silicon layer to enable material removal from within the semiconductor device to form the cavity. A metal feature (105) is disposed within the passageway to hermetically seal the cavity.
Abstract:
A microelectronic system including hydrogen barriers and copper pillars for wafer level packaging and method of fabricating the same are provided. Generally, the method includes: forming an insulating hydrogen barrier over a surface of a first substrate; exposing at least a portion of an electrical contact to a component in the first substrate by removing a portion of the insulating hydrogen barrier, the component including a material susceptible to degradation by hydrogen; forming a conducting hydrogen barrier over at least the exposed portion of the electrical contact; and forming a copper pillar over the conducting hydrogen barrier. In one embodiment, the material susceptible to degradation is lead zirconate titanate (PZT) and the microelectronic systems device is a ferroelectric random access memory including a ferroelectric capacitor with a PZT ferroelectric layer. Other embodiments are also disclosed.
Abstract:
Providing a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate (1) to obtain an insulating layer (2) thereon and providing a metal layer (3) on the insulating layer (2); providing a sacrificial layer (4) on the metal layer (3); providing a first thermal bimorph layer (5) on the sacrificial layer (4); providing a second thermal bimorph layer (6) on the first thermal bimorph layer (5); providing a metal connecting layer (7) at the positions on the metal layer (3) where the sacrificial layer (4) is not provided; forming corresponding back holes (16) on the substrate (1) and the insulating layer (2) and releasing the sacrificial layer (4); forming a warped thermal bimorph diaphragm with the first thermal bimorph layer (5) and the second thermal bimorph layer (6) after the sacrificial layer (4) is released. With the MEMS speaker with thermal bimorphs, the problems of high production cost, complicated wafer process and limitations on sound performance improvements are solved.