Actuator
    302.
    发明专利
    Actuator 审中-公开
    执行机构

    公开(公告)号:JP2009194291A

    公开(公告)日:2009-08-27

    申请号:JP2008035748

    申请日:2008-02-18

    Abstract: PROBLEM TO BE SOLVED: To provide an actuator of piezoelectric actuation type, solving problems of the actuation voltage shift and stiction of electrodes, and, thereby, having a small secular change and stable actuation characteristics. SOLUTION: The actuator includes: a substrate 110; a fixed electrode 140 provided on a major surface 112 of the substrate 110; a first dielectric film 150 provided on the fixed electrode 140, and made of crystalline material; a movable beam 200 opposed to the major surface 112, and held above the substrate 110 with a gap thereto; a movable electrode 202 provided on a surface of the movable beam 200, opposed to the fixed electrode 140, and AC voltage being applied between the movable electrode 202 and the fixed electrode 140; and a second dielectric film 250 provided on a surface opposed to the fixed electrode 140, and made of crystalline material. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种压电致动型致动器,解决了电极的致动电压偏移和静电的问题,从而具有小的长期变化和稳定的致动特性。 解决方案:致动器包括:基板110; 设置在基板110的主表面112上的固定电极140; 设置在固定电极140上并由结晶材料制成的第一电介质膜150; 与主表面112相对的可移动光束200,并且与基板110保持在间隙上; 设置在与固定电极140相对的可移动光束200的表面上的可动电极202以及施加在可动电极202和固定电极140之间的AC电压; 以及设置在与固定电极140相对的表面上并由结晶材料制成的第二电介质膜250。 版权所有(C)2009,JPO&INPIT

    Actuator and electronic equipment using the same
    303.
    发明专利
    Actuator and electronic equipment using the same 审中-公开
    使用其的执行器和电子设备

    公开(公告)号:JP2009171737A

    公开(公告)日:2009-07-30

    申请号:JP2008007249

    申请日:2008-01-16

    Abstract: PROBLEM TO BE SOLVED: To provide an actuator of which the maximum electrostatic capacity is made large by reducing the influence of warpage of a beam, and, moreover, in which steep variation in the electrostatic capacity around the maximum electrostatic capacity is relaxed, and to provide electronic equipment using the actuator. SOLUTION: The actuator includes: a first beam extending from a first fixed end to a first connection end; a first fixed part connecting the first fixed end and a substrate, and supporting the first beam above a main surface of the substrate while keeping a gap therebetween; a second beam extending from a second connection end to a first acting end, provided in parallel with the first beam, and having a fist division part divided by a first slit extending from the first acting end toward the second connection end; a first connection part connecting the first connection end and the second connection end, and supporting the second beam above the main surface of the substrate while keeping the gap therebetween; and a first fixed electrode opposed to part of the first acting end side of the first division part, and provided on the main surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:通过减小光束的翘曲的影响,提供其最大静电容量大的致动器,此外,其中最大静电容量附近的静电电容的急剧变化被放宽 并提供使用致动器的电子设备。 解决方案:致动器包括:从第一固定端延伸到第一连接端的第一梁; 连接第一固定端和基板的第一固定部分,并且在保持其间的间隙的同时将第一光束支撑在基板的主表面上方; 第二光束从第二连接端延伸到与第一光束平行的第一作用端,并且具有由从第一作用端朝向第二连接端延伸的第一狭缝分隔的第一分割部分; 连接第一连接端和第二连接端的第一连接部,并且在保持其间的间隙的同时将第二梁支撑在基板的主表面上方; 以及与第一分割部的第一作用端侧的一部分相对的第一固定电极,设置在基板的主面上。 版权所有(C)2009,JPO&INPIT

    HYDROGEN BARRIERS IN A COPPER INTERCONNECT PROCESS
    308.
    发明申请
    HYDROGEN BARRIERS IN A COPPER INTERCONNECT PROCESS 审中-公开
    氢在铜互连过程中的障碍

    公开(公告)号:WO2017171935A1

    公开(公告)日:2017-10-05

    申请号:PCT/US2016/059951

    申请日:2016-11-01

    Abstract: A microelectronic system including hydrogen barriers and copper pillars for wafer level packaging and method of fabricating the same are provided. Generally, the method includes: forming an insulating hydrogen barrier over a surface of a first substrate; exposing at least a portion of an electrical contact to a component in the first substrate by removing a portion of the insulating hydrogen barrier, the component including a material susceptible to degradation by hydrogen; forming a conducting hydrogen barrier over at least the exposed portion of the electrical contact; and forming a copper pillar over the conducting hydrogen barrier. In one embodiment, the material susceptible to degradation is lead zirconate titanate (PZT) and the microelectronic systems device is a ferroelectric random access memory including a ferroelectric capacitor with a PZT ferroelectric layer. Other embodiments are also disclosed.

    Abstract translation: 提供了一种包括氢阻挡层和用于晶片级封装的铜柱的微电子系统及其制造方法。 通常,该方法包括:在第一衬底的表面上形成绝缘氢阻挡层; 通过去除绝缘氢阻挡层的一部分而将至少一部分电接触暴露于第一衬底中的部件,所述部件包括易被氢降解的材料; 在至少所述电触点的暴露部分上形成导电氢势垒; 并在导电氢屏障上形成铜柱。 在一个实施例中,易于劣化的材料是锆钛酸铅(PZT),并且微电子系统器件是包括具有PZT铁电层的铁电电容器的铁电随机存取存储器。 其他实施例也被公开。

    METHOD FOR MANUFACTURING THERMAL BIMORPH DIAPHRAGM AND MEMS SPEAKER WITH THERMAL BIMORPHS
    309.
    发明申请
    METHOD FOR MANUFACTURING THERMAL BIMORPH DIAPHRAGM AND MEMS SPEAKER WITH THERMAL BIMORPHS 审中-公开
    制造具有热BIMORPHS的热BIMORPH隔膜和MEMS扬声器的方法

    公开(公告)号:WO2016029357A9

    公开(公告)日:2016-05-12

    申请号:PCT/CN2014085204

    申请日:2014-08-26

    Applicant: GOERTEK INC

    Abstract: Providing a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate (1) to obtain an insulating layer (2) thereon and providing a metal layer (3) on the insulating layer (2); providing a sacrificial layer (4) on the metal layer (3); providing a first thermal bimorph layer (5) on the sacrificial layer (4); providing a second thermal bimorph layer (6) on the first thermal bimorph layer (5); providing a metal connecting layer (7) at the positions on the metal layer (3) where the sacrificial layer (4) is not provided; forming corresponding back holes (16) on the substrate (1) and the insulating layer (2) and releasing the sacrificial layer (4); forming a warped thermal bimorph diaphragm with the first thermal bimorph layer (5) and the second thermal bimorph layer (6) after the sacrificial layer (4) is released. With the MEMS speaker with thermal bimorphs, the problems of high production cost, complicated wafer process and limitations on sound performance improvements are solved.

    Abstract translation: 提供一种用于制造热双压电晶片振膜和具有热双压电晶片的MEMS扬声器的方法,其中所述方法包括以下步骤:热氧化衬底(1)以在其上获得绝缘层(2)并且提供金属层(3) 绝缘层(2); 在金属层(3)上提供牺牲层(4); 在所述牺牲层(4)上提供第一热双压电晶片层(5); 在所述第一热双压电晶片层(5)上提供第二热双压电晶片层(6); 在未设置牺牲层(4)的金属层(3)上的位置设置金属连接层(7) 在所述衬底(1)和所述绝缘层(2)上形成相应的背孔(16)并释放所述牺牲层(4); 在牺牲层(4)被释放后形成具有第一热双压电晶片层(5)和第二热双压电晶片层(6)的翘曲热双压电晶片振膜。 采用具有热双压电晶片的MEMS扬声器,解决了高生产成本,复杂的晶片工艺和对声音性能改进的限制的问题。

    駆動装置
    310.
    发明申请
    駆動装置 审中-公开
    驱动装置

    公开(公告)号:WO2015146146A1

    公开(公告)日:2015-10-01

    申请号:PCT/JP2015/001652

    申请日:2015-03-24

    Inventor: 内納 亮平

    Abstract:  本発明は、移動部が傾動する際の可動櫛歯電極の変位を大きくし、移動部の変位を静電容量の変化に基づいて精度良く検出することを目的とする。 本発明のミラーデバイス(300)は、ベース部(302)と、ミラー(305)と、アクチュエータ(306)と、ミラー(305)のX軸に対してアクチュエータ(306)とは反対側に設けられた延長部(304)と、固定櫛歯電極(308)と、ミラー(305)のうちX軸に対してアクチュエータ(306)とは反対側に設けられた可動櫛歯電極(307)とを備えている。可動櫛歯電極(307)は、ヒンジ(373)を介してミラー(305)に連結されたビーム部(371)と、ビーム部(371)に設けられた電極指(372)とを有する。延長部(304)は、ヒンジ(341)を介してベース部(302)に連結されている。ミラー(305)は、ヒンジ(341)を通る主軸回りに傾動する。

    Abstract translation: 本发明的目的是增加可移动梳状电极在移动部件倾斜时的位移,并且基于电容的变化以高精度检测所述运动部件的位移。 该反射镜装置(300)具有底座(302),反射镜(305),致动器(306),设置在与来自致动器(306)的反射镜(305)的X轴相反侧的延伸部分(304) ,固定梳状电极(308)和可动梳状电极(307),其设置在来自致动器(306)的反射镜(305)的X轴的相反侧。 每个可移动梳状电极(307)设置有经由铰链(373)连接到反射镜(305)和设置在所述光束部分(371)上的电极指(372))的光束部分(371)。 每个延伸部分(304)经由铰链(341)连接到基座(302)。 每个反射镜(305)围绕通过相应的铰链(341)的主轴倾斜。

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