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公开(公告)号：US07678319B2
公开(公告)日：2010-03-16
申请号：US12024354
申请日：2008-02-01
Applicant: Junichi Seki , Tohru Den
Inventor： Junichi Seki , Tohru Den
IPC: B29C59/00
CPC classification number: G03F7/0002 , B29C35/02 , B29C43/003 , B29C43/021 , B29C59/002 , B29C59/022 , B29C2043/025 , B29C2043/3634 , B29C2059/023 , B81C99/0085 , B81C2201/034 , B82Y10/00 , B82Y40/00
Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.
Abstract translation: 用于图案化工件的成型装置包括具有要传送到工件的图案的模具，图案包括凹部，用于支撑模具的第一支撑构件和与第一支撑构件相对设置的第二支撑构件，用于 支撑工件。 按压机构使第一和第二支撑构件彼此靠近，将模具和工件一起压在一起，以将工件上的图案转印到模具上。 在第一支撑构件侧的模具的表面，第一支撑构件的区域和第二支撑构件的区域中的至少一个表面上设置嵌入部分。 凹部对应于模具图案中的凹部。
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公开(公告)号：US07674104B2
公开(公告)日：2010-03-09
申请号：US12024338
申请日：2008-02-01
Applicant: Junichi Seki , Tohru Den
Inventor： Junichi Seki , Tohru Den
IPC: B29C43/04
CPC classification number: G03F7/0002 , B29C35/02 , B29C43/003 , B29C43/021 , B29C59/002 , B29C59/022 , B29C2043/025 , B29C2043/3634 , B29C2059/023 , B81C99/0085 , B81C2201/034 , B82Y10/00 , B82Y40/00
Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.
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公开(公告)号：US07601270B1
公开(公告)日：2009-10-13
申请号：US09605520
申请日：2000-06-27
Applicant: Marc A. Unger , Hou-Pu Chou , Todd A. Thorsen , Axel Scherer , Stephen R. Quake
Inventor： Marc A. Unger , Hou-Pu Chou , Todd A. Thorsen , Axel Scherer , Stephen R. Quake
IPC: B29C51/00
CPC classification number: B29C51/00 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2300/0861 , B01L2300/0887 , B01L2300/123 , B01L2400/046 , B01L2400/0481 , B01L2400/0655 , B33Y80/00 , B81B5/00 , B81B2201/036 , B81B2201/054 , B81C1/00119 , B81C2201/019 , B81C2201/034 , C12Q1/6874 , F04B43/043 , F15C1/06 , F15C5/00 , F16K11/20 , F16K13/00 , F16K31/126 , F16K99/0001 , F16K99/0015 , F16K99/0046 , F16K99/0048 , F16K99/0051 , F16K99/0059 , F16K2099/0074 , F16K2099/0076 , F16K2099/0078 , F16K2099/008 , F16K2099/0094 , Y10T137/0491 , Y10T137/0497 , Y10T137/2224 , Y10T137/87249 , Y10T156/10 , Y10T428/24479 , Y10T428/24744 , C12Q2535/125
Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.
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324.发明授权Method for manufacturing microstructures having multiple microelements with through-holes 有权具有多个具有通孔的微量元素的微结构的制造方法公开(公告)号：US07578954B2
公开(公告)日：2009-08-25
申请号：US10373251
申请日：2003-02-24
Applicant: Vladimir Gartstein , Faiz Feisal Sherman
Inventor： Vladimir Gartstein , Faiz Feisal Sherman
CPC classification number: B81C1/00111 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B26F1/24 , B26F1/26 , B81B2201/055 , B81C2201/034 , B81C2201/036
Abstract: A method is provided for manufacturing microstructures of the type which contain a substrate and an array of protruding microelements with through-holes, which are used in penetrating layers of skin. The microelements are embossed or pressed into an initial substrate structure, which in some embodiments is formed from extruded polymeric material, and in some cases from two layers of polymer that are co-extruded. The through-holes are formed from filled through-cylinders of a second material that is removed after the embossing or pressing step; in other instances, the through-holes are left hollow during the embossing or pressing step.
Abstract translation: 提供了一种用于制造包含基底的微结构的方法和具有通孔的突出微元件阵列，其用于穿透皮肤层。 微元件被压花或压制成初始的基底结构，其在一些实施方案中由挤出的聚合物材料形成，并且在一些情况下由共挤出的两层聚合物形成。 通孔由在压花或压制步骤之后被去除的第二材料的填充的通孔形成; 在其他情况下，在压花或压制步骤期间，通孔留空。
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公开(公告)号：US20090184088A1
公开(公告)日：2009-07-23
申请号：US12017944
申请日：2008-01-22
Applicant: Robert J. Carlson
Inventor： Robert J. Carlson
CPC classification number: B29C33/3842 , B29C41/00 , B29C59/14 , B29C59/16 , B29K2909/00 , B29K2995/0037 , B81B7/00 , B81B2201/05 , B81B2201/058 , B81B2203/0127 , B81C99/009 , B81C2201/0132 , B81C2201/0143 , B81C2201/034 , C23F1/02 , H01L21/30604 , Y10T428/24496
Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.
Abstract translation: 本发明涉及用作至少部分微机电特征的模具的图案化气凝胶基层。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，可以以明显高于在较致密的材料中形成结构特征的速率的速率在气凝胶层中形成结构特征。 本发明还包括一种图案化气凝胶层以产生这种基于气凝胶的模具的方法。 本发明还包括使用基于气凝胶的模具制造微机电特征的方法。 该方法包括将致密材料层直接沉积在已经形成在气凝胶层中的微机电特征的至少一部分的轮廓上。
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Patent Agency Ranking
326.发明授权公开(公告)号：US07538930B2
公开(公告)日：2009-05-26
申请号：US10539388
申请日：2003-11-20
Applicant: Dirk Jan Broer , Grietje Neeltje Mol , Christiane Maria Rosette De Witz
CPC classification number: B29C37/0053 , B29C33/42 , B29C43/021 , B29C2035/0827 , B29L2011/0016 , B29L2031/756 , B81B3/0035 , B81B2201/047 , B81C2201/034
Abstract: The invention relates to a micro-mechanical thermal structure for modulating a light beam and a method for manufacturing such a structure. The micro-mechanical structure comprises two layers of material with different thermal expansion coefficients in a first direction and a second direction respectively, in which the first direction is transverse to the second direction and the two layers comprise an oriented polymer and the director of the molecules of the oriented polymer of the first layer is transverse to the director of the molecules of the oriented polymer of the second layer. An array of such micro-mechanical structures may form a thermo-optical modulator for modulating light. The method comprises a step of providing a mold with an orientation-inducing layer to obtain a molecular orientation in a mono-meric state of liquid crystalline monomers and a step of fixing the molecular orientation by photo-polymerization.
Abstract translation: 本发明涉及用于调制光束的微机械热结构及其制造方法。 微机械结构包括在第一方向和第二方向上分别具有不同热膨胀系数的两层材料，其中第一方向横向于第二方向，并且两层包括取向聚合物和分子的导向体 的第一层的取向聚合物横向于第二层的取向聚合物的分子的导向体。 这种微机械结构的阵列可以形成用于调制光的热光调制器。 该方法包括提供具有取向诱导层以获得液晶单体的单体状态的分子取向的模具和通过光聚合固定分子取向的步骤的步骤。
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公开(公告)号：US20090041986A1
公开(公告)日：2009-02-12
申请号：US12103090
申请日：2008-04-15
Applicant: Jun-Ying Zhang , Jerome C. Porque , Jennifer J. Sahlin , Terry L. Smith , Ding Wang
Inventor： Jun-Ying Zhang , Jerome C. Porque , Jennifer J. Sahlin , Terry L. Smith , Ding Wang
CPC classification number: B32B3/02 , B81B2203/0361 , B81B2207/056 , B81C1/00103 , B81C2201/034 , Y10T428/24479
Abstract: Provided is a method of fabricating hierarchical articles that contain nanofeatures and microstructures. The method includes providing a substrate that includes nanofeatures and then creating microstructures adding a layer, removing at least a portion of the layer to reveal at least a portion of the substrate.
Abstract translation: 提供了一种制造包含纳米尺度和微结构的层次制品的方法。 该方法包括提供包括纳米尺度的衬底，然后产生添加层的微结构，去除该层的至少一部分以露出衬底的至少一部分。
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328.发明申请DEVICE CONTAINING CYTOPHILIC ISLANDS THAT ADHERE CELLS SEPARATED BY CYTOPHOBIC REGIONS 失效含有CYPOPHOBIC区域分离细胞的胞质岛的装置公开(公告)号：US20090011493A1
公开(公告)日：2009-01-08
申请号：US12166287
申请日：2008-07-01
Applicant: Rahul Singhvi , Amit Kumar , George M. Whitesides , Donald E. Ingber , Gabriel P. Lopez , Daniel I. C. Wang , Gregory N. Stephanopoulos
Inventor： Rahul Singhvi , Amit Kumar , George M. Whitesides , Donald E. Ingber , Gabriel P. Lopez , Daniel I. C. Wang , Gregory N. Stephanopoulos
IPC: C12M1/00
CPC classification number: C12N1/00 , B01J19/0046 , B01J2219/00382 , B01J2219/00385 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00619 , B01J2219/00621 , B01J2219/00626 , B01J2219/0063 , B01J2219/00637 , B01J2219/00659 , B01J2219/0072 , B81B2201/0214 , B81C1/00206 , B81C2201/034 , B82Y5/00 , B82Y30/00 , C12N5/0068 , C12N5/067 , C12N2535/10 , C12Q1/02 , C40B60/14
Abstract: The invention provides a device for adhering cells in a specific and predetermined position, and associated methods. The device includes a plate defining a surface and a plurality of cytophilic islands that adhere cells, isolated by cytophobic regions to which cells do not adhere, contiguous with the cytophilic islands. The islands or the regions or both may be formed of a self-assembled monolayer (SAM).
Abstract translation: 本发明提供一种用于将细胞粘附在特定和预定位置的装置以及相关方法。 该装置包括限定表面的板和多个细胞亲和岛，其附着细胞，由细胞不粘附的细胞渗透区隔离，与细胞色素岛邻接。 岛或区域或两者可以由自组装单层（SAM）形成。
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公开(公告)号：US07407614B2
公开(公告)日：2008-08-05
申请号：US11064005
申请日：2005-02-24
Applicant: Kia Silverbrook
Inventor： Kia Silverbrook
CPC classification number: H01L23/315 , B29C33/0022 , B29C43/36 , B29C2035/0822 , B29C2043/503 , B81B2201/0235 , B81B2207/056 , B81C1/00269 , B81C1/00333 , B81C1/00904 , B81C2201/034 , B81C2203/0127 , G01P1/023 , G01P15/0802 , H01L23/16 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The present invention relates to a method for forming a protective cap for a device. Typically, the device would be formed on a silicon wafer and is, for example, a MEMS device. The method involves the steps of locating thermosplastic material between a first wafer including a first recess and a second wafer including two second recesses. The first and second wafers are positioned relative to one another so that the first recess is in register with the two second recesses and the thermoplastic material is heated. The first and second wafers are pressed together so that heated thermosplastic material enters the first and second recesses and thereby forms the cap. A method for forming a plurality of protective caps for devices is also provided.
Abstract translation: 本发明涉及一种用于形成装置的保护盖的方法。 通常，器件将形成在硅晶片上，并且例如是MEMS器件。 该方法包括将热塑性材料定位在包括第一凹部的第一晶片和包括两个第二凹槽的第二晶片之间的步骤。 第一和第二晶片相对于彼此定位，使得第一凹槽与两个第二凹部对准，热塑性材料被加热。 将第一和第二晶片压在一起，使得加热的热塑性材料进入第一和第二凹槽，从而形成盖。 还提供了一种用于形成用于装置的多个保护盖的方法。
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公开(公告)号：US20080128945A1
公开(公告)日：2008-06-05
申请号：US12024354
申请日：2008-02-01
Applicant: Junichi Seki , Tohru Den
Inventor： Junichi Seki , Tohru Den
IPC: B28B3/00
CPC classification number: G03F7/0002 , B29C35/02 , B29C43/003 , B29C43/021 , B29C59/002 , B29C59/022 , B29C2043/025 , B29C2043/3634 , B29C2059/023 , B81C99/0085 , B81C2201/034 , B82Y10/00 , B82Y40/00
Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.
Abstract translation: 用于图案化工件的成型装置包括具有要传送到工件的图案的模具，图案包括凹部，用于支撑模具的第一支撑构件和与第一支撑构件相对设置的第二支撑构件，用于 支撑工件。 按压机构使第一和第二支撑构件彼此靠近，将模具和工件一起压在一起，以将工件上的图案转印到模具上。 在第一支撑构件侧的模具的表面，第一支撑构件的区域和第二支撑构件的区域中的至少一个表面上设置嵌入部分。 凹部对应于模具图案中的凹部。
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