公开(公告)号：US20070224720A1

公开(公告)日：2007-09-27

申请号：US11640849

申请日：2006-12-19

Applicant: Cheng-Chang Lee ,  Hsueh-Kuo Liao ,  Shih-Peng Chen ,  Tai-Kang Shing ,  Huang-Kun Chen

Inventor： Cheng-Chang Lee ,  Hsueh-Kuo Liao ,  Shih-Peng Chen ,  Tai-Kang Shing ,  Huang-Kun Chen

IPC: H01L21/00

CPC classification number: B81C1/0019 ,  B81C2201/0109 ,  B81C2201/0111

Abstract: A manufacturing method of a suspended microstructure includes the steps of providing a substrate having a surface; forming a first depositing layer over a part of the surface; forming a second depositing layer over the first depositing layer and another part of the surface wherein an adhesion between the first depositing layer and the substrate is weaker than that between the second depositing layer and the substrate; forming a hole through the second depositing layer to partially expose the surface of the substrate; and filling the hole with an etchant to remove a part of the substrate so as to form a cavity.

Abstract translation: 悬浮微结构的制造方法包括提供具有表面的基板的步骤; 在所述表面的一部分上形成第一沉积层; 在所述第一沉积层和所述表面的另一部分上形成第二沉积层，其中所述第一沉积层和所述衬底之间的粘附弱于所述第二沉积层和所述衬底之间的粘附; 通过所述第二沉积层形成孔以部分地暴露所述基底的表面; 并用蚀刻剂填充孔以去除衬底的一部分以形成空腔。

公开(公告)号：US07274078B2

公开(公告)日：2007-09-25

申请号：US11158544

申请日：2005-06-22

Applicant: Venkatachalam C. Jaiprakash ,  Jonathan W. Ward ,  Thomas Rueckes ,  Brent M. Segal

Inventor： Venkatachalam C. Jaiprakash ,  Jonathan W. Ward ,  Thomas Rueckes ,  Brent M. Segal

IPC: H01L27/14

CPC classification number: G11C13/025 ,  B81B2203/0338 ,  B81B2203/04 ,  B81C1/00142 ,  B81C2201/0109 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B2202/02 ,  C01B2202/22 ,  G11C11/56 ,  G11C13/0033 ,  G11C23/00 ,  G11C2213/16 ,  G11C2213/77 ,  G11C2213/81 ,  H01H1/0094 ,  H01L21/76838 ,  H01L51/0048 ,  H01L2221/1094 ,  Y10S977/943

Abstract: Electro-mechanical switches and memory cells using vertically-disposed nanofabric articles and methods of making the same are described. An electro-mechanical device, includes a structure having a major horizontal surface and a channel formed therein. A conductive trace is in the channel; and a nanotube article vertically suspended in the channel, in spaced relation to a vertical wall of the channel. The article is electro-mechanically deflectable in a horizontal direction toward the conductive trace. Under certain embodiments, the vertically suspended extent of the nanotube article is defined by a thin film process. Under certain embodiments, the vertically suspended extent of the nanotube article is about 50 nanometers or less. Under certain embodiments, the nanotube article is clamped with a conducting material disposed in porous spaces between some nanotubes of the nanotube article. Under certain embodiments, the nanotube article is formed from a porous nanofabric. Under certain embodiments, the nanotube article is electromechanically deflectable into contact with the conductive trace and the contact is either a volatile state or non-volatile state depending on the device construction. Under certain embodiments, the vertically oriented device is arranged into various forms of three-trace devices. Under certain embodiments, the channel may be used for multiple independent devices, or for devices that share a common electrode.

公开(公告)号：US07202101B2

公开(公告)日：2007-04-10

申请号：US10902984

申请日：2004-07-30

Applicant: Kaigham J. Gabriel ,  Xu Zhu

Inventor： Kaigham J. Gabriel ,  Xu Zhu

IPC: H01L21/62

CPC classification number: B81C1/00158 ,  B81B2201/018 ,  B81B2201/0257 ,  B81C2201/0109 ,  H01G5/16

Abstract: The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabricated from such a structure. In one embodiment, a first metal layer is carried by a substrate. A first sacrificial layer is carried by the first metal layer. A second metal layer is carried by the sacrificial layer. The second metal layer has a portion forming a micro-machined metal mesh. When the portion of the first sacrificial layer in the area of the micro-machined metal mesh is removed, the micro-machined metal mesh is released and suspended above the first metal layer a height determined by the thickness of the first sacrificial layer. The structure may be varied by providing a base layer of sacrificial material between the surface of the substrate and the first metal layer. In that manner, a portion of the first metal layer may form a micro-machined mesh which is released when a portion of the base sacrificial layer in the area of the micro-machined mesh is removed. Additionally, a second layer of sacrificial material and a third metal layer may be provided. A micro-machined mesh may be formed in a portion of the third metal layer. The structure of the present invention may be used to construct variable capacitors, switches and, when certain of the meshes are sealed, microspeakers and microphones.

Abstract translation: 本发明涉及由使用标准CMOS处理技术构建的金属和牺牲材料的交替层的结构，用于构建这种结构的工艺，用于从这种结构制造器件的工艺以及由这样的器件制造的器件 结构体。 在一个实施例中，第一金属层由衬底承载。 第一牺牲层由第一金属层承载。 第二金属层由牺牲层承载。 第二金属层具有形成微加工金属网的部分。 当去除微加工金属网的区域中的第一牺牲层的部分时，微加工金属网被释放并悬浮在第一金属层上方的高度由第一牺牲层的厚度确定。 可以通过在衬底的表面和第一金属层之间提供牺牲材料的基底层来改变结构。 以这种方式，第一金属层的一部分可以形成微机加工的网，其在微加工网的区域中的部分基底牺牲层被去除时释放。 另外，可以提供第二层牺牲材料和第三金属层。 微加工网可以形成在第三金属层的一部分中。 本发明的结构可用于构造可变电容器，开关，并且当确定的网孔被密封时，微型扬声器和麦克风。

公开(公告)号：US07123399B2

公开(公告)日：2006-10-17

申请号：US11054056

申请日：2005-02-09

Applicant: Christopher Gudeman ,  James Hunter ,  Richard Yeh ,  David T. Amm

Inventor： Christopher Gudeman ,  James Hunter ,  Richard Yeh ,  David T. Amm

IPC: G02B26/00

CPC classification number: B81C1/00111 ,  B81B2203/0136 ,  B81B2203/0307 ,  B81C2201/0109 ,  G02B26/0808

Abstract: A MEM device in accordance with the invention comprises one or more movable micro-structures which are preferably ribbon structures or cantilever structures. The ribbon structures or cantilever structures are preferably coupled to a substrate structure through one or more support regions comprising a plurality of anchor support features and a plurality of post support features. The MEM device is preferably an optical MEM device with a plurality of movable ribbon structures each being supported by opposing ends through support regions each comprising a plurality of anchor support features and a plurality of post support features. In accordance with the method of the embodiments, the positions of the anchor and post support features, the number of anchor and support features and the spacings between the support features can selected during fabrication of the device to determine an operating condition of the MEM device.

Abstract translation: 根据本发明的MEM装置包括优选带状结构或悬臂结构的一个或多个可移动微结构。 带状结构或悬臂结构优选地通过包括多个锚固支撑特征和多个支撑支撑特征的一个或多个支撑区域耦合到基底结构。 MEM装置优选地是具有多个可移动带结构的光学MEM装置，每个可移动带结构各自由相对的端部支撑，每个支撑区域包括多个锚固支撑特征和多个支撑支撑特征。 根据实施例的方法，可以在制造装置期间选择锚和支柱特征的位置，锚固和支撑特征的数量以及支撑特征之间的间隔，以确定MEM装置的操作状态。

公开(公告)号：US20060204699A1

公开(公告)日：2006-09-14

申请号：US11297124

申请日：2005-12-07

Applicant: George Maltezos ,  Hongxing Tang ,  Michael Roukes ,  Axel Scherer

Inventor： George Maltezos ,  Hongxing Tang ,  Michael Roukes ,  Axel Scherer

IPC: B29C33/40 ,  B29C33/76 ,  B28B7/38 ,  F16L11/04

CPC classification number: B29C33/0016 ,  B01L3/502707 ,  B01L3/502738 ,  B01L2200/12 ,  B29K2891/00 ,  B29L2031/7506 ,  B29L2031/756 ,  B33Y80/00 ,  B81B2201/054 ,  B81C1/00119 ,  B81C99/009 ,  B81C2201/0109 ,  F16K27/003 ,  F16K99/0001 ,  F16K99/0026 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0088 ,  Y10T428/1393

Abstract: A method for fabricating parylene coated microfluidic valves is disclosed. A three-dimensional mold made of a first wax is formed. A sacrificial material made of a second wax is provided as a temporary support and then dissolved. A parylene coating is deposited onto the mold. A component material is poured onto the mold and cured, and the first wax is melted away. Further, a method for parylene coating of two-dimensional microfluidic components comprises: forming a lithographic mold of a microfluidic component, the mold made of a photoresist material; coating the lithographic mold with parylene; and removing the lithographic mold.

Abstract translation: 公开了一种制造聚对二甲苯涂布的微流体阀的方法。 形成由第一蜡制成的三维模具。 提供由第二蜡制成的牺牲材料作为临时载体，然后溶解。 聚对二甲苯涂层沉积在模具上。 将组分材料倒在模具上并固化，并将第一蜡熔化掉。 此外，二维微流体组分的聚对二甲苯涂布方法包括：形成微流体组分的光刻模具，由光致抗蚀剂材料制成的模具; 用聚对二甲苯涂布平版印模; 并去除平版印刷模具。

公开(公告)号：US20060134819A1

公开(公告)日：2006-06-22

申请号：US11019912

申请日：2004-12-21

Applicant: Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian

Inventor： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian

IPC: H01L21/00 ,  H01L21/302

CPC classification number: B81C1/00666 ,  B81C2201/0109 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

公开(公告)号：US07005314B2

公开(公告)日：2006-02-28

申请号：US09894334

申请日：2001-06-27

Applicant: Qing Ma ,  Peng Cheng

Inventor： Qing Ma ,  Peng Cheng

IPC: H01L21/00

CPC classification number: B81C1/00126 ,  B81C2201/0109 ,  H03H3/0072

Abstract: A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducing a second structural material over the sacrificial material; and removing the sacrificial material. An apparatus comprising a first structure on a substrate; and a second structure on the substrate and separated from the first structure by an unfilled gap defined by the thickness of a removed film.

公开(公告)号：US06975010B2

公开(公告)日：2005-12-13

申请号：US10320679

申请日：2002-12-17

Applicant: Eun-sung Lee ,  Moon-chul Lee ,  Hyun-ok Kim

Inventor： Eun-sung Lee ,  Moon-chul Lee ,  Hyun-ok Kim

IPC: B81C1/00 ,  B81B3/00 ,  H01L29/82

CPC classification number: B81B3/0078 ,  B81B2203/0307 ,  B81C2201/0109

Abstract: A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.

Abstract translation: 一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。 沉积在基板上的牺牲层被图案化以具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。 如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。 如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。 因此，只有在浮动部分下面的牺牲层被去除。 由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。 此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

公开(公告)号：US20050204821A1

公开(公告)日：2005-09-22

申请号：US11072859

申请日：2005-03-03

Applicant: Frank Fischer ,  Hans Artmann ,  Lars Metzger ,  Arnim Hoechst ,  Julian Gonska

Inventor： Frank Fischer ,  Hans Artmann ,  Lars Metzger ,  Arnim Hoechst ,  Julian Gonska

IPC: G01L9/00 ,  B81B3/00 ,  B81C1/00 ,  G01J1/02 ,  G01L7/08 ,  H01L29/84

CPC classification number: B81B7/0029 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0109

Abstract: A micromechanical component having a diaphragm is provided, the structure of which effectively prevents the penetration of dirt particles into the cavity. A method for manufacturing such a component is also provided. The structure of the component is implemented in a layer structure which includes at least one first sacrificial layer and a layer system over the first sacrificial layer. A cavity is formed in the first sacrificial layer underneath the diaphragm. In the region of the diaphragm between the upper layer and the lower layer of the layer system situated directly above the first sacrificial layer, at least one access channel to the cavity is formed which has at least one opening in the upper layer and at least one opening in the lower layer, the opening in the upper layer and the opening in the lower layer being offset with respect to each other.

Abstract translation: 提供了具有隔膜的微机械部件，其结构有效地防止了灰尘颗粒进入空腔。 还提供了制造这种部件的方法。 组件的结构以包括至少一个第一牺牲层和第一牺牲层上的层系统的层结构来实现。 在隔膜下方的第一牺牲层中形成空腔。 在位于第一牺牲层正上方的层系统的上层和下层之间的隔膜区域中，形成至少一个到空腔的通道，其在上层中具有至少一个开口，并且至少一个开口 在下层中开口，上层中的开口和下层中的开口相对于彼此偏移。

公开(公告)号：US06946315B2

公开(公告)日：2005-09-20

申请号：US10961162

申请日：2004-10-12

Applicant: Koichi Ikeda ,  Takashi Kinoshita

Inventor： Koichi Ikeda ,  Takashi Kinoshita

IPC: B81C1/00 ,  B81B3/00 ,  H01L21/00

CPC classification number: B81C1/00611 ,  B81B2201/042 ,  B81B2203/0118 ,  B81C2201/0109 ,  B81C2201/0119 ,  B81C2201/0125

Abstract: The present invention is directed to manufacturing methods of electrostatic type MEMS devices. The manufacturing method of the present invention includes the steps of forming a substrate side electrode on a substrate, forming a fluid film before or after forming a sacrificial layer, further forming a beam having a driving side electrode on a planarized surface of the fluid film, and finally, removing the sacrificial layer. Furthermore, performing the foregoing method planarizes the surface of a driving side electrode, reduces fluctuations in the shape of a beam, and improves the performance and the uniformity of the MEMS device.

Abstract translation: 本发明涉及静电型MEMS器件的制造方法。 本发明的制造方法包括在基板上形成基板侧电极，在形成牺牲层之前或之后形成流体膜的步骤，在流体膜的平坦化表面上进一步形成具有驱动侧电极的光束， 最后，去除牺牲层。 此外，执行上述方法使驱动侧电极的表面平坦化，减小了波束形状的波动，提高了MEMS器件的性能和均匀性。