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    A FORKED PROBE FOR TESTING SEMICONDUCTOR DEVICES
    31.
    发明申请
    A FORKED PROBE FOR TESTING SEMICONDUCTOR DEVICES 审中-公开
    一种用于测试半导体器件的探测探针

    公开(公告)号：WO2009035456A2

    公开(公告)日：2009-03-19

    申请号：PCT/US2007/078433

    申请日：2007-09-13

    Applicant: TOUCHDOWN TECHNOLOGIES, INC

    Inventor： ISMAIL, Salleh

    IPC: H01L29/04

    CPC classification number: G01R1/06727 ,  G01R1/07342

    Abstract: A novel forked probe design for use in a novel probe card is presented that comprises a forked bending element that more efficiently stores displacement energy. Specifically, the novel probe card comprising a substrate and a forked probe connected to the substrate. The forked probe includes a base that is connected to the substrate and a forked bending element connected to the base, wherein the forked bending element comprises at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure. Connected to the first prong is the probe tip that is adapted to make contact with the DUT. Refinements to the probe card include that the first and second prongs are adapted to bend such that each prong elastically stores a portion of the displacement energy when the probe tip contacts the DUT. Also, the forked bending element may be manufactured using photolithography and using layered photolithography. Each prong may be comprised of different materials. And the forked bending element may be comprised of a nickel alloy. Also, the first prong may be constructed to be stiffer than the second prong, which may yield a shorter scrub length. The stiffness of the prongs may be manipulated by altering the geometry and/or material of the prongs.

    Abstract translation: 提出了一种用于新型探针卡的新型分叉探针设计，其包括更有效地存储位移能量的分叉式弯曲元件。 具体而言，该新型探针卡包括基板和连接至该基板的分叉探针。 叉形探针包括连接到基底的基部和连接到基部的分叉弯曲元件，其中分叉弯曲元件至少包括通过叉形连接结构连接到第二叉的第一叉以及连接到叉的叉形柄 连接结构。 连接到第一个插脚的是适合与DUT接触的探针尖端。 对探针卡的改进包括第一和第二插脚适合于弯曲，使得当探针尖端接触DUT时，每个插脚弹性地存储一部分位移能量。 而且，分叉弯曲元件可以使用光刻和使用分层光刻来制造。 每个叉可以由不同的材料组成。 叉状弯曲元件可以由镍合金构成。 而且，第一叉可以被构造成比第二叉更硬，这可以产生更短的刷洗长度。 叉的刚度可以通过改变叉的几何形状和/或材料来操纵。

    A DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM
    32.
    发明申请
    A DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM 审中-公开
    一种用于重复微电子系统的装置和方法

    公开(公告)号：WO2009011696A1

    公开(公告)日：2009-01-22

    申请号：PCT/US2007/073579

    申请日：2007-07-16

    Applicant: TOUCHDOWN TECHNOLOGIES, INC

    Inventor： NAMBURI, Lakshmikanth

    IPC: G01R31/02 ,  H01L21/00 ,  H05K3/00

    CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/07342

    Abstract: A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage. A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card. A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.

    Abstract translation: 公开了一种用于修复MEMS系统的新型装置和方法，包括用于半导体测试的探针卡。 在一个实施例中，与用于测试半导体晶片的诊断计算机一起使用的探针卡包括衬底，连接到衬底的多个操作探针，其中多个操作探针适于与诊断计算机进行电连接， 多个连接到基板的替换探针，其中多个操作探针和多个置换探针构成在基本上相同的制造过程中。 还公开了可以修复的新型探针卡。 具体地说，探针卡与用于测试半导体晶片的诊断计算机一起使用的探针卡，所述探针卡包括衬底和连接到所述衬底的探测器的多个操作，其中所述多个操作探针适于与所述诊断计算机进行电连接 ，并且其中所述多个操作探针包括通过施加电压而被激活的牺牲材料。 还公开了一种从探针卡中去除损坏的探针的方法。 该方法从包括连接到基板的多个操作探针的探针卡移除损坏的探针，并且多个操作探针包括通过施加电压而被激活的牺牲材料。 该方法包括识别损坏的探针，向损坏的探针施加电压，将损坏的探针暴露于蚀刻溶液中，并从探针卡上移除损坏的探针。 还公开了用于从探针卡修复损坏的探针的第二种方法。 该方法修复来自探针卡的损坏的探针，所述探针卡包括连接到基底的多个操作探针和连接到所述基底的多个替代探针，并且其中所述多个操作探针和所述多个置换探针基本相同 制造工艺。 该方法包括以下步骤：识别损坏的探针，从探针卡移除损坏的探针，将多个置换探针中的一个与基底分开，以及安装从多个替换探针分离的一个探针，其中损坏的探针被去除 。 公开了对这些装置和方法的若干改进。

    OPTICALLY ENHANCED PROBE ALIGNMENT
    33.
    发明申请
    OPTICALLY ENHANCED PROBE ALIGNMENT 审中-公开
    光学增强探测对准

    公开(公告)号：WO2007102834A3

    公开(公告)日：2008-01-03

    申请号：PCT/US2006021701

    申请日：2006-06-06

    Applicant: TOUCHDOWN TECHNOLOGIES INC

    Inventor： WALKER STEVEN J

    IPC: G01R31/02 ,  G06K9/00 ,  H04N7/18

    CPC classification number: G01R31/2891 ,  G01R1/06794 ,  G01R1/07342

    Abstract: A novel probe card that comprises a set of fiducials (10, IS, 2025 and 60) and a method for using the same are disclosed The set o fiducials (10, 15, 20, 25 and 60) comppses a first fiducial (10, 15, 20 and 25) and a second fiducial (60) fixed relative to the probe substrate (5) Comparing the relative positions of the fiducials (10, 15, 20, 25 and 60) determines whether the probes (20) are in pr alignment This can be performed by the unaided eye or by using a low powered microscope (165) This novel probe card may also used with computer vision alignment methods, thus enhancing the speed and accuracy of the computer vision method.

    Abstract translation: 公开了一种包括一组基准（10，IS，2025和60）的新型探针卡及其使用方法，所述基准（10,15,20,25和60）包含第一基准（10， 相对于探针基板（5）固定的第二基准（60）。比较基准（10,15,20,25和60）的相对位置确定探针（20）是否处于pr 对准这可以通过肉眼或使用低功率显微镜进行（165）这种新型探针卡也可以与计算机视觉对准方法一起使用，从而提高计算机视觉方法的速度和准确性。

    OPTICALLY ENHANCED PROBE ALIGNMENT
    34.
    发明申请
    OPTICALLY ENHANCED PROBE ALIGNMENT 审中-公开
    光学增强探测对准

    公开(公告)号：WO2007102834A2

    公开(公告)日：2007-09-13

    申请号：PCT/US2006/021701

    申请日：2006-06-06

    Applicant: TOUCHDOWN TECHNOLOGIES, INC.

    Inventor： WALKER, Steven, J.

    IPC: G01R31/02

    CPC classification number: G01R31/2891 ,  G01R1/06794 ,  G01R1/07342

    Abstract: A novel probe card that comprises a set of fiducials and a method for using the same are disclosed. The set of fiducials comprises a first fiducial and a second fiducial fixed relative to the probe card substrate. Comparing the relative positions of the fiducials determines whether the probes are in proper alignment. This can be performed by the unaided eye or by using a low powered microscope. This novel probe card may also be used with computer vision alignment methods, thus enhancing the speed and accuracy of the computer vision method.

    Abstract translation: 公开了一种包括一组基准的新型探针卡及其使用方法。 该组基准包括相对于探针卡基片固定的第一基准和第二基准。 比较基准的相对位置决定探针是否正确对齐。 这可以通过肉眼或使用低功率显微镜进行。 这种新型探针卡也可以与计算机视觉对准方法一起使用，从而提高计算机视觉方法的速度和准确性。

    TORSION SPRING PROBE CONTACTOR DESIGN
    37.
    发明申请
    TORSION SPRING PROBE CONTACTOR DESIGN 审中-公开
    扭力弹簧探头接触器设计

    公开(公告)号：WO2007015713A1

    公开(公告)日：2007-02-08

    申请号：PCT/US2005/042135

    申请日：2005-11-18

    Applicant: TOUCHDOWN TECHNOLOGIES, INC.

    Inventor： KHOO, Melvin ,  TEA, Nim ,  ISMAIL, Salleh ,  HSU, Yang ,  TANG, Weilong ,  GARABEDIAN, Raffi

    IPC: G01R1/067 ,  G01R3/00

    CPC classification number: G01R1/06727 ,  G01R1/06738 ,  G01R3/00

    Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.

    Abstract translation: 本发明涉及一种用于与微电子器件上的接触焊盘进行电连接的探针。 具有长度，厚度，宽度，近端和远端的脚连接到基底。 脚的长度大于其宽度。 具有长度，宽度，厚度，近端和远端的扭杆在扭杆的近端处连接到脚的远端。 扭杆位于第一平面内。 具有长度，宽度和厚度的间隔件连接到扭杆的远端。 具有长度，宽度，厚度，近端和远端的臂在臂近端处连接到所述间隔件。 臂位于第二平面中，第二平面位于与第一平面不同的平面上。 具有顶侧和底侧的第一柱连接到臂的远端附近的臂。 尖端电连接到柱的顶侧。

    PROCESS FOR FORMING MICROSTRUCTURES
    39.
    发明申请
    PROCESS FOR FORMING MICROSTRUCTURES 审中-公开
    形成微结构的方法

    公开(公告)号：WO2006068737A1

    公开(公告)日：2006-06-29

    申请号：PCT/US2005/041661

    申请日：2005-11-18

    Applicant: TOUCHDOWN TECHNOLOGIES, INC.

    Inventor： TANG, Weilong ,  HSU, Tseng-Yeng ,  ISMAIL, Salleh ,  TEA, Nim, Hak ,  KHOO, Melvin, B. ,  GARABEDIAN, Raffi ,  NAMBURI, Lakshmikanth

    IPC: G03F7/00

    CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    STIFFENER PLATE FOR A PROBECARD AND METHOD
    40.
    发明申请
    STIFFENER PLATE FOR A PROBECARD AND METHOD 审中-公开
    用于检测和方法的STIFFENER板

    公开(公告)号：WO2012099572A1

    公开(公告)日：2012-07-26

    申请号：PCT/US2011/021503

    申请日：2011-01-18

    Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  ANDBERG, John

    Inventor： ANDBERG, John

    IPC: G01R31/20

    CPC classification number: G01R1/07307 ,  G01R31/2886

    Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.

    Abstract translation: 微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括主体和多个安装点，其中至少一个安装点通过一个或多个横向延伸的梁柔性地连接到主体，所述梁具有垂直于横向方向的截面模数，显着大于 在横向上。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。

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