Abstract:
PURPOSE: An optical amplifying medium, a manufacturing method thereof, and an optical device including the optical amplifying medium are provided to used as an optical inter connector between chips by being easily applied to an existing semiconductor device. CONSTITUTION: A first material layer and a second material layer are formed on a substrate(100). The first material layer(10) dopes an activator. The second material layer(20) includes a sensitizer. The activator is erbium. The sensitizer is silicon nano cluster. The substrate is annealed in order to form the sensitizer inside the second material layer.
Abstract:
PURPOSE: A non-volatile memory device and method of fabricating the same are provided to increase the number of first electrodes and second electrodes for high integration. CONSTITUTION: The non-volatile memory device includes at least one data storage layer(130), at least one first electrode(110), at least one second electrode(140). The second electrode is arranged to cross the first electrode. The data storage layer is interposed in the crossing potion of the second electrode with the first electrode. At least first electrode includes a junction diode(D) connected to the data storage layer.
Abstract:
A memory device and a memory reading method thereof are provided to improve the performance of an error correction by performing the ECC(Error Correction Code) decoding of the data read from the multi bit cells. A memory device(100) includes a multi bit cell array(110), an error detector(120), and a data estimator(130). The error detector reads a first data page from a memory page(111) inside the multi bit cell array. The error detector performs ECC decoding of the first data page and detects the error bit of the first data page. The estimator identifies the multi bit cell with an error bit. The estimator estimates the data of the second data page stored in the identified multi bit cell.
Abstract:
A non-volatile memory device and a manufacturing method thereof are provided to reduce a manufacturing cost by using a stacked structure for simplifying a manufacturing process. A non-volatile memory device(100c) includes at least one or more semiconductor pillar(145a), at least one or more first control gate electrode(110a), at least one or more second control gate electrode(110b), a first charge storage layer, and a second charge storage layer. The first control gate electrode is arranged in one side of the semiconductor pillar. The second control gate electrode is arranged in the other side of the semiconductor pillar. The first charge storage layer is inserted into a space between the first control gate electrode and the semiconductor pillar. The second charge storage layer is inserted between the second control gate electrode and the semiconductor pillar.
Abstract:
A capacitorless DRAM and its operation method are provided to isolate the charge storage layer from the source area and drain region and to improve data retention property. The semiconductor layer(310) is separated from the upper side of the substrate(300). The semiconductor layer comprises the source region(S1), and the drain region(D1) and channel region(C1). The charge storage layer(H1) is equipped on the channel region. The gate(400) is formed in the top of the substrate. The gate contacts with the channel region and charge storage layer. The channel region is protruded than the source region and drain region. The charge storage layer is separated from the source region and drain region.
Abstract:
A non-volatile memory device and operation method thereof is provided to improve a speed of a read operation by being no need to performing a read operation about all bits of memory cells. A non-volatile memory device comprises a plurality of memory cells(MC1~MCn), a memory block(MB11~MB4n), and a controller. The memory cells stores a respective date. The memory block respectively includes a block state confirmation cell storing information about the number of bit filled in the memory cell. The controller reads a data from the memory block to a bit stored in the block state confirmation cell.
Abstract:
A memory cell programming method is provided to improve programming speed by programming a plurality of memory block groups. In a memory cell programming method of programming M bit data in a plurality of memory blocks, a plurality of memory blocks is divided into a plurality of memory block groups. In a plurality of memory blocks, An i(i is the natural number less than M) number of bit is written in a plurality of memory block groups having memory block groups more than 2, and i+1 number of the bit in the memory block group more than 2.
Abstract:
A nonvolatile memory device and a method for operating the same are provided to block current flow from a unit cell to bit lines by turning off an assistant transistor so as to solve a problem that the off-cell is not read. A pair of control gate electrodes(135) are provided on a semiconductor substrate(105). A source region(140) is placed between the control gate electrodes. A pair of assistant gate electrodes(115) are recessed in the semiconductor substrate. A pair of drain regions(145) are limited to the semiconductor substrate respectively. The semiconductor substrate has a bulk wafer structure, and an epitaxial layer is formed on the bulk wafer. A pair of tunneling insulating layers(120) are placed between the semiconductor substrate and charge storage layers. A pair of blocking insulating layers(130) are placed between the control gate electrodes and the charge storage layers. A pair of gate insulating layers(110) are placed between the assistant gate electrodes and the semiconductor substrate. First and second channel regions(165,170) are connected directly by placing the control gate electrodes and the assistant gate electrodes horizontally. The drain regions are connected with bit lines(160).
Abstract:
A resistive memory device is provided to decrease the consumption of power by reducing remarkably on-current compared to a conventional resistive memory device using a doped oxide layer formed on an RRAM(Resistance Random Access Memory) material. A resistive memory device includes a lower electrode(21), a first oxide layer, a current control layer and an upper electrode. The first oxide layer(22) is formed on the lower electrode. The first oxide layer is capable of storing information by using two resistive states. The current control layer(23) is formed on the first oxide layer. The current control layer is made of a second oxide material. The upper electrode(24) is formed on the current control layer. The first oxide layer is made of one selected from a group consisting of NiOx, ZrOx, Nb2O5-x, HfO, ZnO, WC3, CoO, CuO2, and TiO2. The current control layer is made of one selected from a group consisting of a transitional metal doped ZnOx and RuOx.