Abstract:
A NAND-type flash memory array and an operating method thereof are provided to reduce program disturbance by using a body biasing contact region connected to an active region on a lower portion of a side of a second select gate line. At least one bit line(B/L0,B/L1) is formed on an SOI substrate. A first select transistor, plural memory cells, and a second select transistor are serially connected to each bit line by their geared sources and drains. The source of the second select transistor is electrically connected to a common source line(CSL) vertically arranged to the bit line. A gate of the first select transistor and a gate of the second select transistor are respectively connected to a first select gate line(SSL) and a second select gate line(GSL) arranged to be crossed with the bit line. Gates of the memory cells are respectively connected to plural word lines(W/L0,W/L1) arranged to be crossed with the bit line. A body biasing contact region(BBC) is connected to an active region on a lower portion of a side of the second select gate line.
Abstract:
본 발명은 SOI 기판 상에 직렬 연결된 소자의 바디 바이어싱 구조에 관한 것으로, 공통 소스/드레인 영역의 정션 깊이를 얕게 만듦으로써, 통상적인 벌크 MOSFET처럼 하나의 바디 바이어싱 콘택만으로도 여러 개의 소자에 대해 바디 바이어싱을 가능하게 하여 SOI 기판의 플로팅 바디 효과(floating body effect)를 제거하는 효과가 있다. SOI, 바디, 바이어스, 플로팅
Abstract:
The present invention relates to a semiconductor memory device which applies a temperature-compensated word line voltage to a word line in a data reading operation. In the present invention, disclosed is the semiconductor memory device comprising a memory cell array which includes a plurality of word lines, a plurality of bit lines, and a plurality of nonvolatile memory cells which are connected to the word lines and the bit lines; and a word line voltage applying unit which applies a temperature-compensated read voltage to a selected word line and applies a temperature-compensated pass voltage to an unselected word line in the reading operation.
Abstract:
A non-volatile memory device according to an embodiment of the present invention comprises: a memory cell array including word lines and bit lines; and a control logic which performs a program operation to program memory cells connected to a selected word line by applying a program voltage to the selected word line of the memory cell array, and performs a delete operation to delete the memory cells by applying a delete voltage and a delete verify voltage to the selected word line, wherein the control logic extracts information of the deleted state of the memory cell by applying a read voltage to the selected word line, and controls the level of the delete verify voltage based on the delete state information.
Abstract:
A nonvolatile memory device is provided. The nonvolatile memory device includes a nonvolatile memory chip which includes a static latch and a dynamic latch which receives data from the static latch through a floating node, a device controller which controls the operation of the nonvolatile memory chip, and a refresh controller which controls the refresh operation of the dynamic latch. The dynamic latch includes a storage node, a writing transistor which writes the data of the floating node on the storage node and a reading transistor which reads the data of the storage node. The writing transistor and the reading transistor share the floating node.