Abstract:
A refrigerator box for a van is provided to improve stability of the refrigerator box by securely coupling an under frame of the refrigerator box to a lower frame of the refrigerator box. A refrigerator box for a van comprises a refrigerator installed on a van frame. A side panel(130) is vertically installed along a peripheral portion of a bottom panel and an edge of a roof panel is coupled to an upper portion of the side panel. A door is coupled to rear portions of the bottom panel and the roof panel. A low-temperature maintaining unit(160) is installed at the side panel. The low-temperature maintaining unit includes a thermo-electric module(161) having a heating section inserted into a resting groove formed in an inner panel and a cooling section directed toward an interior of the refrigerator box. A heat-insulation member(134) is interposed between an outer panel(131) and an inner panel(133).
Abstract:
PURPOSE: A structure of a vertical BMFET(Bipolar Mode Field Emission Transistor) having a multi-gate and a fabricating method thereof are provided to improve electric characteristics by improving a structure of a vertical BMFET. CONSTITUTION: A source region(4) and a gate region(3) are formed under a source electrode(S) and a gate electrode(G). A PN junction is formed between the gate region(3) and the source region(4). An epitaxial layer(2) is formed on a substrate(1). A drain electrode is formed under the substrate(1). The gate region(3) is located on the epitaxial layer(2). A MOS type gate(90) is contacted commonly with each side of the source region(4), the gate region(3), and the epitaxial layer(2) through the insulating layer(100). The source region(4) and the drain region(1) are formed by implanting the first conductive dopant ions. The gate region(3) is formed by implanting the second conductive dopant ions.
Abstract:
PURPOSE: A manufacturing method of a TFT(Thin Film Transistor) is provided to improve a channel structure for optimizing a hydrogenating effect. CONSTITUTION: A manufacturing method of a TFT(Thin Film Transistor) comprises the steps of: forming a first insulation layer on a substrate; forming a first conductive layer on the first insulation layer; forming a multi channel having a plurality of channels for securing an inflow path of a hydrogen radical between the source/drain regions of an activation region in a succeeding hydrogenating process simultaneously with defining the activation region by performing a photo lithography and an etching precesses on the first conductive layer; forming a second insulation layer and a second conductive layer on the entire surface; forming a gate electrode having a plurality of grooves in the channel direction for securing an inflow path of a hydrogen radical in a succeeding hydrogenating process simultaneously with patterning the second insulation layer and the second conductive layer; forming injecting impurity ions into the gate electrode and source/drain regions by using the gate electrode as self-aligned ion-implanting mask and forming a passivation layer; performing a hydrogenating process on the entire surface; and connecting the gate electrode and the source/drain regions with a metal line for applying the external voltage to the gate electrode and the source/drain regions.
Abstract:
엑사이머 레이저 방사에 의한 폴리실리콘 싱글 일렉트론 소자의 제조방법에 따르면, 기판위에 아몰퍼스 실리콘 막, 절연막, 버퍼막을 차례로 형성하는 단계와, 상기 버퍼막을 사진식각하여 팁형상의 윈도우를 패턴하고 상기 아몰퍼스 실리콘을 결정화하기 위해 레이저 에너지를 방사하고 열처리하는 단계를 가짐에 의해, 적어도 하나의 폴리실리콘 그레인이 패턴된 윈도우 사이드로부터 성장 및 분리되게 하여 파인-그레인 라아지 폴리실리콘 양자 점을 얻는 것을 특징으로 한다.
Abstract:
트렌치 게이트를 갖는 수평형 SOI 바이폴라 모드 전계효과 트랜지스터가 개시되어 있다. 그러한 트랜지스터의 구조는, 에스오아이 층의 표면에서 서로 이격되고 일정깊이로 각기 형성된 제1도전형의 소오스 및 드레인영역과; 상기 소오스 및 드레인영역사이에서 상기 영역들중의 어느 하나의 영역에 더 가까이 위치되어 상기 영역들보다 더 깊이 형성된 게이트 플러그를 상기 영역들과는 절연되게 수용하기 위한 트렌치의 하부근방에 접촉형성된 제2도전형의 게이트 영역을 가짐에 의해 전류이득률과 순방향 전압 저지능력이 개선된다.
Abstract:
The method of manufacturing thin film transistor comprises the steps of : forming an active layer(10) after depositing and patterning a semiconductor material on a transparent substrate; forming a gate electrode pattern after depositing and patterning a gate insulating film(12) and a gate electrode(14) on the active layer(10); forming a source/a drain region(10c,10b) by ion-injection into the exposed active region; and forming an insulating film(20) by oxidizing the exposed active region through thermal oxidation.
Abstract:
본 발명은 액정디스플레이에서 특히 화소(pixel)소자의 구조 및 그 제조방법에 관한 것으로, 본 발명은 소정의 전압이 인가되는 게이트단자와 소정의 데이타신호가 입력되는 드레인단자와 소정의 노드에 접속되는 소오스단자를 가지고 공통의 전류통로를 가지는 2개의 스위칭트랜지스터와, 상기 소오스단자와 소정의 전극 노드사이에 전극의 양단이 접속되고 산화막에 의해 감싸인 구조를 가지는 스토리지캐패시터로 이루어지는 화소소자를 개시하고 있다. 이로부터 본 발명은 LCD에 있어서 TFT 트랜지스터를 채용하는 통상의 화소소 자의 동일한 점유면적을 가지면서도 전류구동능력과 캐패시턴스의 용량이 증가하는 화소소자를 제공함에 의해, 액정노드로 되는 소오스노드에 전류의 차아지시간이 고속으로 되는 장점이 있다. 또한 통상의 모오스공정을 통해 점유면적의 증가없이 종래대비 적어도 2배의 캐패시턴스를 확보할 수 있는 잇점이 발생되며, 아울러 향후 동일기판상의 레이아웃을 용이하게 하는 효과가 발생한다. 또한 이러한 잇점들이 용이한 제조공정을 통해서 달성되는 효과가 있다. 또한 LCD의 틈간비율을 감소시키지 않고서도 기생캐패시턴스의 영향 을 최대 억제할 수 있다.
Abstract:
PURPOSE: A method for manufacturing poly-silicon single electron device via excimer-laser irradiation is provided to obtain poly-silicon islands whose size and location are precisely controlled and to form a single electron memory using the same by applying a lithography technique and an excimer laser annealing. CONSTITUTION: An amorphous silicon layer(4), an insulating layer(2) and a buffer layer(8) are successively formed on a substrate. The buffer layer is photo-etched to pattern a window in tip shape. To crystalize the amorphous silicon, annealing by irradiation of laser energy is carried out so that at least one poly silicon grain grows and is isolated around the center portion of the patterned tip to form a large fine-grain poly silicon quantum dot(40). The substrate consists of silicon material. The excimer laser is irradiated under 250deg.C of substrate temperature and 200mJ/cm¬2 of energy level. The quantum dot is an element of poly silicon single electron device.
Abstract:
PURPOSE: A horizontal-type SOI bipolar mode FET having a trench gate and a method for making the same are provided to achieve an enhanced electric characteristic, reduce a change of an element characteristic as well as an influence of a buried oxide layer. CONSTITUTION: A first conductive source area(40) is separated from a first conductive drain area(41), and they have a predetermined depth. A second conductive gate area is near to one area between the source and drain areas(40,41), insulates a gate plug deeper than the areas, and is contacted with a lower part of the trench. If the first conductive area is made of N-type impurity ion, the second conductive area is made of P-type ion. The gate plug is nearer to the source area, and is made of a polysilicon.