31.
    发明专利
    未知

    公开(公告)号:DE69123610T2

    公开(公告)日:1997-04-24

    申请号:DE69123610

    申请日:1991-01-31

    Applicant: CANON KK

    Abstract: A method of manufacture of semiconductor devices, includes exposing different portions of a semiconductor substrate (2) with a first exposure apparatus (100) having a first exposure range; placing and aligning the semiconductor substrate with respect to a second exposure range of a second exposure apparatus (200) which range is larger than the first exposure range of the first exposure apparatus; detecting an alignment error of each of the portions of the semiconductor substrate as covered by the second exposure range of the second exposure apparatus; calculating an overall alignment error of those portions of the semiconductor substrate with respect to the whole second exposure range of the second exposure apparatus, on the basis of the detected alignment errors; and controlling the exposure operation of the second exposure apparatus on the basis of the calculated overall alignment error.

    38.
    发明专利
    未知

    公开(公告)号:DE68929187D1

    公开(公告)日:2000-04-27

    申请号:DE68929187

    申请日:1989-08-31

    Applicant: CANON KK

    Abstract: An exposure apparatus usable with synchrotron radiation source (201) wherein the synchrotron radiation (202,204) is generated by electron injection (210) into a ring (201). The exposure apparatus is to transfer a semiconductor element pattern of a mask (208) onto a semiconductor wafer (209) by the synchrotron radiation. The apparatus includes a shutter (207) for controlling the exposure of the wafer (209). The shutter (207) controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined (206,211,216) in response to the electron injection (210), and thereafter, the illuminance distribution is corrected (216,215,213,207) in a predetermined manner. By this, the illuminance distribution data for controlling (213,215) the shutter (207) always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer (209) are exposed with high precision.

    39.
    发明专利
    未知

    公开(公告)号:DE69228465T2

    公开(公告)日:1999-08-05

    申请号:DE69228465

    申请日:1992-10-29

    Applicant: CANON KK

    Inventor: SHIMODA ISAMU

    Abstract: According to the invention, to make the reading operation of an eyesight handicapped person easy, the result of the image pickup of a camera unit to photoelectrically convert the character information is displayed by a pin pattern on a display. When the operator detects the character area from the display result, an area of an object for character recognition for the result of the image pickup is designated by an input unit and the execution of the character recognition is instructed. A processor recognizes the character with respect to the result of the image pickup of the designated area and displays the character so that it can be perceived in a tactile manner. Whether the result of the reading of the character is correct or not can be checked by a tactile perception. The recognition result of the character recognized can be generated by an audio output by an audio output unit.

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