公开(公告)号：EP0868777B1

公开(公告)日：2000-06-14

申请号：EP96946081.5

申请日：1996-12-16

Applicant: EPCOS AG

Inventor： PAHL, Wolfgang ,  STELZL, Alois ,  KRÜGER, Hans ,  MACHUI, Jürgen

IPC: H03H9/05 ,  H03H9/02

CPC classification number: H03H9/1092 ,  H03H9/02929 ,  H03H9/02937 ,  Y10T29/42

Abstract: In an electronic component, especially an SW component with a conductive structure (2) on a substrate (1) and and encapsulation (4) enclosing them on the substrate (1), at least the conductive structures (2) are covered by a gas-diffusion-preventing or inert protective layer (3).

公开(公告)号：EP1055285B1

公开(公告)日：2002-10-09

申请号：EP99913068.5

申请日：1999-02-05

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  DEMMER, Peter

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC classification number: H01L24/97 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3025 ,  H03H3/08 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  H01L2224/81

Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.

公开(公告)号：EP0900477B1

公开(公告)日：2001-07-18

申请号：EP97925867.0

申请日：1997-05-23

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  PAHL, Wolfgang

IPC: H03H9/05 ,  H03H9/10

CPC classification number: H03H9/1085 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3025 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1078 ,  H01L2924/00014

Abstract: An electronic component, in particular a component using surface acoustic waves, with a system of components (1, 2) mounted on a base plate (3) and with electrical contacts made, where a protective layer (8) is provided on the components side, facing away from the connecting zone between the components system (1, 2) and the base plate (3); the protective layer (8) forms a tight seal against environmental influences to the base plate (3) for the components system (1, 2).

公开(公告)号：EP1412974A2

公开(公告)日：2004-04-28

申请号：EP02747220.8

申请日：2002-06-14

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  FEIERTAG, Gregor ,  CHRISTL, Ernst

IPC: H01L21/50 ,  H01L23/10

CPC classification number: H01L24/97 ,  H01L21/50 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49789 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method for hermetically encapsulating a component (1) that is mounted in flip-chip design on a support (4). The inventive method is characterized by first covering the component with a film (8) that closely rests on the component and the support, then structuring the film, and providing thereon a hermetically sealing layer (14), especially a metal layer, which seals up with the support.

公开(公告)号：EP1356518A2

公开(公告)日：2003-10-29

申请号：EP02701213.7

申请日：2002-01-21

Applicant: EPCOS AG

Inventor： FEIERTAG, Gregor ,  STELZL, Alois ,  KRÜGER, Hans

IPC: H01L23/498

CPC classification number: H03H9/059 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H03H9/1078 ,  H03H9/1092 ,  H05K1/0306 ,  H05K1/114 ,  H05K2201/10674 ,  H01L2224/0401

Abstract: The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon by metal deposition. The bumps can also be produced by self-adjusting metal deposition.

公开(公告)号：EP1080615A1

公开(公告)日：2001-03-07

申请号：EP99930999.0

申请日：1999-05-03

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  WEIDNER, Karl ,  WOSSLER, Manfred

IPC: H05K3/18 ,  H05K3/24 ,  H05K3/42

CPC classification number: H05K3/403 ,  H01L21/4853 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H03H3/00 ,  H05K1/0243 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/245 ,  H05K3/3442 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10083 ,  H05K2203/043 ,  H05K2203/1572 ,  H01L2224/81

Abstract: The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) with external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces (5).

公开(公告)号：EP1078451A1

公开(公告)日：2001-02-28

申请号：EP99920557.8

申请日：1999-03-25

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans

IPC: H03H3/08 ,  H03H9/10 ,  H03H9/05

CPC classification number: H03H9/1078 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

Abstract: The invention relates to a surface wave component and to a method for the production of the same, comprising a chip (2) with a piezoelectric substrate, electronic conductive structures arranged on said chip (IDT converters, contact strips and the like), a base plate (3) with external contact elements contacting the electric conductive structures of the chip and a hermetically sealed frame (4) mounted on the base plate, the chip being arranged inside and at a distance from said frame. The area between the chip (2) and the base plate (3) is sealed off with a foil (5), the area between the frame (4) and the foil (5) is filled with a sealing compound (6) and the chip (2) along with the sealing compound (6) and the frame (4) are protected by a cover (7) or a protective cap made of galvanic material, the edges (8) of which rest on the base plate (3) hermetically sealing the latter.

公开(公告)号：EP1057258A1

公开(公告)日：2000-12-06

申请号：EP99915480.0

申请日：1999-02-16

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  WEIDNER, Karl ,  WOSSLER, Manfred

IPC: H03H9/05

CPC classification number: H03H9/1092 ,  H01L2924/0002 ,  H03H9/058 ,  Y10T29/42 ,  H01L2924/00

Abstract: The invention relates to an OFW component working with acoustic surface waves. Said component comprises a chip (1), a piezoelectric substrate (1a), electrically conductive structures (2, 3, 4) arranged on the substrate and a base plate (15) with external electrical connections lines which are in contact with the electrical conductive structures of the chip (1). A protective film (5, 6) is applied on the surface of the chip supporting the electrically conductive structures (2, 3, 4), which has electrical contact elements (7, 11) on the surface opposite to their piezoelectric substrate (1a). Said elements are connected directly to the structures (2, 3, 4) of the chip (1) by through contacts (8) in the protective film (5, 6) and/or through bumps (10) and to the electrical connection elements of the base plate (15) using SMT technology.

公开(公告)号：EP1055285A1

公开(公告)日：2000-11-29

申请号：EP99913068.5

申请日：1999-02-05

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  DEMMER, Peter

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC classification number: H01L24/97 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3025 ,  H03H3/08 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  H01L2224/81

Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.