公开(公告)号：EP0795200B1

公开(公告)日：2007-10-24

申请号：EP95939966.8

申请日：1995-11-13

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  DOZIER, Thomas, H.

IPC: H01R9/00 ,  H01R29/00 ,  B23K31/02 ,  H05K3/30 ,  H01L23/49 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L21/66 ,  H01L21/68 ,  H01L23/32

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。

公开(公告)号：EP0839321B1

公开(公告)日：2006-01-11

申请号：EP97925668.2

申请日：1997-05-15

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  DOZIER, Thomas, H. ,  TAYLOR, Sheldon, A.

IPC: G01R1/067 ,  G01R1/073

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively 'perfect' contact tip structures ('tips') and joining them to relatively 'imperfect' interconnection elements to improve the overall capabilities of resulting 'tipped' interconnection elements.

公开(公告)号：EP0792519B1

公开(公告)日：2003-03-26

申请号：EP95939967.6

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01R9/00 ,  H01R29/00 ,  B23K31/02 ,  H05K3/30 ,  H01L23/49 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L21/66 ,  H01L21/68

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：EP0985231A1

公开(公告)日：2000-03-15

申请号：EP98922344.1

申请日：1998-05-14

Applicant: FORMFACTOR, INC.

Inventor： PEDERSEN, David, V. ,  KHANDROS, Igor, Y.

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/522 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/036 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11426 ,  H01L2224/1143 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11823 ,  H01L2224/119 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/13644 ,  H01L2224/145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2924/381 ,  H05K3/4092 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01108 ,  H01L2924/01104 ,  H01L2924/01022 ,  H01L2924/01079 ,  H01L2224/034 ,  H01L2224/1147 ,  H01L2224/0231 ,  H01L2224/114

Abstract: Microelectronic contact structures (260, 360, 460) are lithographically defined and fabricated by applying a masking layer (220, 320, 420) on a surface of a substrate (202, 302, 402) such as an electronic component, creating an opening (222, 322, 422) in the masking layer, depositing a conductive trace of a seed layer (250, 350, 450) onto the masking layer and into the openings, and building up a mass of conductive material on the conductive trace. The sidewalls of the opening can be sloped (tapered). The conductive trace can be patterned by depositing material through a stencil or shadow mask (240, 340, 440). A protruding feature (230, 430) may be disposed on the masking layer so that a tip end (264, 364, 464) of the contact structure acquires a topography. All of these elements can be constructed as a group to form a plurality of precisely positioned resilient contact structures.

Abstract translation: 微电子接触结构（260,360,460）通过在诸如电子部件的基板（202,302,402）的表面上施加掩模层（220,320,420）而光刻地限定和制造，从而形成开口 222,322,422），将种子层（250,350,450）的导电迹线沉积到所述掩蔽层上并进入所述开口中，并且在所述导电迹线上建立大量导电材料。 开口的侧壁可以是倾斜的（渐缩的）。 导电迹线可以通过沉积材料通过模板或荫罩（240,340,440）进行图案化。 突出特征（230,430）可以设置在掩蔽层上，使得接触结构的尖端（264,364,464）获取形貌。 所有这些元件可以构造成一组以形成多个精确定位的弹性接触结构。

公开(公告)号：EP0886894B1

公开(公告)日：2005-09-28

申请号：EP96926049.6

申请日：1996-05-24

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetean, L. ,  DOZIER, Thomas, H. ,  SMITH, William, D.

IPC: H01R43/20 ,  G01R31/00 ,  H01R9/28 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/4015 ,  H01L2924/00

Abstract: A plurality of contact elements, such as contact bumps or free-standing spring contacts (710) including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates (702) which, in turn, are mounted and connected to a relatively large electronic component substrate (706), thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level bum-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.

公开(公告)号：EP0859686B1

公开(公告)日：2005-08-17

申请号：EP96923204.0

申请日：1996-05-24

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetean L., Apartment 203

IPC: B23K31/02 ,  H01L21/68 ,  H01L23/498 ,  H01L23/49

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C23C18/1605 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electronic components (784) are not 'at risk' during the fabrication process. The sacrificial substrate (702) establishes a predetermined spatial relationship between the interconnection elements (752) which may be composite interconnection elements (752) having a relatively soft elongate element (752) as a core and a relatively hard (springy material) overcoat (754). Interconnection elements (752) may be fabricated upon tip structures (770), or may first be mounted to the electronic component (784) and the tip structures (770) joined to the free-ends of the interconnection elements (752). Tip structures (770) formed as cantilever beams are described.

公开(公告)号：EP0839323B1

公开(公告)日：2004-08-25

申请号：EP97926653.3

申请日：1997-05-15

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  PEDERSEN, David, V.

IPC: G01R1/067 ,  G01R1/073

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

公开(公告)号：EP0898712B1

公开(公告)日：2003-08-06

申请号：EP97925666.6

申请日：1997-05-15

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  PEDERSEN, David, V.

IPC: G01R1/073 ,  G01R1/067 ,  G01R31/316

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact element effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. A significant reduction in interconnect count and consequent simplification of the interconnection substrate is realized because the ASICs are capable of receiving a plurality of signals for testing the DUTs over relatively few signal lines from a host controller and promulgating these signals over the relatively many interconnections between the ASICs and the DUTs. The ASICs can also generate at least a portion of these signals in response to control signals from the host controller. Physical alignment techniques are also described. Micromachined indentations on the front surface of the ASICs ensure capturing free ends of the spring contact elements. Micromachined features on the back surface of the ASICs and the front surface of the interconnection substrate to which they are mounted facilitate precise alignment of a plurality of ASICs on the support substrate.

公开(公告)号：EP1092338A1

公开(公告)日：2001-04-18

申请号：EP99933638.1

申请日：1999-06-30

Applicant: FORMFACTOR, INC.

Inventor： PEDERSEN, David, V. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, Y.

IPC: H05K3/32

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

公开(公告)号：EP0839323A1

公开(公告)日：1998-05-06

申请号：EP97926653.0

申请日：1997-05-15

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  PEDERSEN, David, V.

IPC: G01R31 ,  G01R1 ,  H01L21 ,  H01L23 ,  G01R3 ,  H01H1 ,  H05K3

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.