Abstract:
A technique for and structures for camouflaging an integrated circuit structure. A layer of conductive material having a controlled outline is disposed to provide artifact edges of the conductive material that resemble an operable device when in fact the device is not operable.
Abstract:
A technique for and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed by a plurality of layers of material having a controlled outline. A layer of conductive material having a controlled outline is disposed among said plurality of layers to provide artifact edges of the conductive material that resemble one type of transistor (operable vs. non-operable), when in fact another type of transistor was used.
Abstract:
Semiconducting devices, including integrated circuits, protected from reverse engineering comprising metal traces leading to field oxide. Metallization usually leads to the gate, source or drain areas of the circuit, but not to the insulating field oxide, thus misleading a reverse engineer. A method for fabricating such devices.
Abstract:
A device adapted to protect integrated circuits from reverse engineering comprising a part looking like a via connecting two metal layers, but in fact attached only to one metal layer and spaced from the other. Having such "trick" via would force a reverse engineer to think there is a connection where there is none. A method for fabricating such device.
Abstract:
A technique for and structres for camouflaging an integrated circuit structure. A layer ofconductive material having a controlled outline is disposed to provide artifact edges of the conductive material that resemble an operable device when in fact the device is not operable.
Abstract:
Semiconducting devices, including integrated circuits, protected from reverse engineering comprisingmetal traces leading to field oxide. Metallization usually leads to the gate, source or drain areas of thecircuit, but not to the insulating field oxide, thus misleading a reverse engineer. A method for fabricatingsuch devices.
Abstract:
Semiconducting devices, including integrated circuits, protected from reverse engineering comprisingmetal traces leading to field oxide. Metallization usually leads to the gate, source or drain areas of thecircuit, but not to the insulating field oxide, thus misleading a reverse engineer. A method for fabricatingsuch devices.
Abstract:
A technique for and structures for camouflaging an integrated circuit structure and strengthen its resistance to reverse engineering. A plurality of transistors are formed in a semiconductor substrate, at least some of the transistors being of the type having sidewall spacers with LDD regions formed under the sidewall spacers. Transistors are programmably interconnected with ambiguous interconnection features, the ambiguous interconnection features each comprising a channel formed in the semiconductor substrate with preferably the same dopant density as the LDD regions, with selected ones of the channels being formed of a conductivity type supporting electrical communication between interconnected active regions and with other selected ones of the channels being formed of a conductivity type inhibiting electrical communication but ambiguously appearing to a reverse engineer as supporting electrical communication.
Abstract:
An apparatus and method for preventing information leakage attacks through a polarized cryptographic bus architecture. The polarized cryptographic bus architecture randomly changes the polarity of the target bit such that the leaked information cannot be consistently averaged to yield statistical key material. Further, to increase the prevention of information leakage attacks, a set of dual rails is used to write data to a given register bit.