公开(公告)号：DE10021859A1

公开(公告)日：2001-11-15

申请号：DE10021859

申请日：2000-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  NEU ACHIM ,  BAUER MONIKA ,  STRUTZ VOLKER ,  POHL JENS

IPC: H01L23/498 ,  H05K3/40 ,  H05K1/02 ,  H05K3/30

Abstract: Printed circuit board (1) comprises a conductor layer containing a bond window (5) with a conducting pathway (8). The conducting pathway has a conducting region (11) with a conducting body (14) in the region of the bond window. The conducting body has the same bending resistance moments in two directions running vertical to the conducting pathway axis. The conducting pathway has a region (12) for connecting to the bond pad of a semiconductor component. An Independent claim is also included for a process for the production of a printed circuit board. Preferred Features: The conducting body is parallelepiped or cylindrical and has a copper core region, an upper copper casing region and a lower copper casing region.

公开(公告)号：DE10014304A1

公开(公告)日：2001-10-04

申请号：DE10014304

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

IPC: H01L23/31

Abstract: The wire bonding to contact pads (2) in a recess (9) in a semiconductor element (1) is sealed in a two stage filling process in which two separate layers (15,16) are formed. A semiconductor element comprises chip recessed contact pads (2) electrically bonded to neighboring conductor (6) by wiring foil and having a recessed solder connection (17). Each wire bonding is covered with a sealer filler (14), which comprises both first (15) and second (16) layers. An Independent claim also included for a method of production of the above comprising completely covering the wire bonding with the sealant.

公开(公告)号：DE10012882A1

公开(公告)日：2001-09-27

申请号：DE10012882

申请日：2000-03-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  HAUSER CHRISTIAN ,  REISS MARTIN

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/58

Abstract: Process for applying an integrated switching circuit (1) to a support element (6) comprises applying a hardenable compensation layer (5) of pasty consistency either to a lower contact surface of a switching element or on the support element; joining the switching circuit to the support element via the compensation layer; producing an electrical connection between the integrated switching circuit and conducting wires of the support element via electrical lines wound over compensation layer; and hardening the compensation layer with volume enlargement. An Independent claim is also included for a device for applying an integrated switching circuit to a support element. Preferred Features: The electrical lines are fixed between the integrated switching circuit and the support element.

公开(公告)号：DE19908186C2

公开(公告)日：2001-08-09

申请号：DE19908186

申请日：1999-02-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  VIDAL ULRICH

IPC: H01L21/56 ,  H01L23/50

Abstract: A first casting mold region and a second casting mold region are brought together, with the result that a cavity, which is provided for receiving a leadframe and can be filled with a plastic molding compound, is formed. The first and second casting mold regions are brought together in such a way that at least a first contact region of the first casting mold region bears against a second contact region of the second casting mold region. The plastic package of the integrated circuit produced in this way has a smooth, burr-free surface, at least in the region of a centering portion. An integrated circuit having a lead frame and a plastic package and a test method for testing the integrated circuit are also provided.