Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist, e.g. sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a low molecular compound obtained by preparing a compound having one or more amino groups with at least one hydrogen atom bonding to a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of such hydrogen atoms bonding to a nitrogen atom, (B) a radiation sensitive acid generating agent and (C) an alkali-insoluble or slightly alkali-soluble acid dissociable group- containing resin having an alicyclic structure in the principal chain and/or a side chain and a carboxylic acid anhydride structure in a side chain and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including dry etching resistance, sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) an abietic acid derivative of formula 1 [where R1-R4 are each H, hydroxyl, a 1-4C linear or branched alkyl or a 1-4C linear or branched alkoxyl and R5 is H, an optionally substituted 1-20C alkyl or -CH2COO6 (R6 is a 1-18C alkyl)].
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) a compound of formula 1 [where Z is an n-valent hydrocarbon group having an alicyclic carbon ring in which the total number of ring forming carbon atoms is 4-20 or its derivative and (n) is an integer of 1-4].
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in basic physical resist properties such as sensitivity and resolution and showing only a small sensitivity change due to long-term storage. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin having a 3-30C alicyclic skeleton substituted by a group of formula 1 [where R1 is a group of formula 2 (where R2 and R3 are each a 1-4C alkyl or combine to each other to form a 3- to 8-membered cyclic structure) or formula 3 (where R4 is a 1-4C alkyl)] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin compsn. excellent particularly in preservable stability, transparency to radiation, resolution and dry etching resistance as a chemical amplification type resist and excellent also in sensitivity, developability and a pattern shape. SOLUTION: This radiation sensitive resin compsn. contains an alkali-insoluble or slightly alkali-soluble resin having repeating units represented by formula and a radiation sensitive acid generating agent. In the formula R -R are each independently H, 1-6C linear or branched alkyl or 5- to 8-membered cycloalkyl, R and R may bond to each other to form 5- to 8-membered cycloalkyl or R and R may bond to each other to form 5- to 8-membered cycloalkyl and (n) is an integer of 0-3.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition superior in transparency to radiation and resolution, and also the balance of characteristics including sensitivity and developability, and pattern forms, and dry etching resistance, and the like. SOLUTION: The radiation sensitive resin composition comprises (A) an alkali-insoluble or hardly soluble resin having, as acid dissociable groups, repeating units each represented by the formula and solubilizable in alkali, when these acid-dissociable groups and/or lactone rings in these groups are dissociated, and (B) a radiation-sensitive acid-generator. In the formula, each of R -R is, independently, an H atom or a 1-6C straight or branched alkyl or 5- to 8-membered cycloalkyl group and R and R , or R and R may combine with each other to form a 5- to 8-membered cycloalkyl group; and (n) is an integer of 1-4.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is superior in various properties, including film thickness, resolution, pattern shape, transparency, heat resistance and solvent resistance, in particular, in the heat resistance, and which is able to form a microlens that is superior in balance of the various properties. SOLUTION: The radiation-sensitive resin composition comprises: a polymerizable unsaturated compound having an acidic functional group; an alkali-soluble copolymer obtained by polymerizing a polymerizable unsaturated compound having an alicyclic hydrocarbon group and another polymerizable unsaturated compound; a polymerizable unsaturated compound; a photopolymerization initiator; and a compound represented by a specific chemical formula and having monovalent groups, each of which independently has a hydrogen atom or a (meth)acryloyl group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can be forming a highly flat cured film on a substrate, even on a substrate with low surface flatness, and be suitably used for manufacturing a protective film of a color filter which is highly transparent and enables good patterning of a wiring electrode. SOLUTION: The thermosetting resin composition includes [A] a polymer having a bicyclo-orthoester structure and [B] a thermosensitive acid generator. The thermosetting resin composition optionally further includes [C] a copolymer of a polymerizable unsaturated compound comprising (c1) at least one chosen from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride and (c2) at least one chosen from the group consisting of a polymerizable unsaturated compound having an oxiranyl group and a polymerizable unsaturated compound having an oxetanyl group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiosensitive resin composition capable of manufacturing a spacer or a protective film for a liquid display element excellent in heat resistance, and to provide a radiosensitive resin composition capable of manufacturing a spacer excellent in various performances such as elastic recovery, rubbing resistance and adhesion property when used for manufacturing a spacer for a liquid display element. SOLUTION: The radiosensitive resin composition comprises [A] (a1) a polymer of an unsaturated compound comprising at least one chosen from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride, [B] a calixarene compound having a particular structure and [C] a radiosensitive polymerization initiator. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having a sufficient process margin and good storage stability and giving a cured product having heat and solvent resistances, transparency and adhesion to a substrate required as an interlayer insulation film or a microlens. SOLUTION: The radiation-sensitive resin composition comprises: a copolymer of an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, a (meth)acryloyloxyalkyloxetane and another olefinically unsaturated compound; a 1,2-quinonediazide compound; and an epoxy group-containing compound and/or another oxetanyl group-containing compound. COPYRIGHT: (C)2008,JPO&INPIT