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公开(公告)号:AU6703686A
公开(公告)日:1988-06-30
申请号:AU6703686
申请日:1986-12-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , KAWASIMA SABURO , SONOBE YOSHIHO , OHTA MASAHIRO , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
IPC: C08G73/00 , C08G73/10 , C09J179/08 , C09J3/14
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公开(公告)号:DE3650656T2
公开(公告)日:1998-04-30
申请号:DE3650656
申请日:1986-06-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor: OHTA MASAHIRO , KAWASHIMA SABURO - - , SONOBE YOSHIHO , TAMAI SHOJI , OIKAWA HIDEAKI , OHKOSHI KOUJI - - , YAMAGUCHI AKIHIRO - -
IPC: C08G73/10 , C09J179/08
Abstract: Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
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公开(公告)号:DE69127137D1
公开(公告)日:1997-09-11
申请号:DE69127137
申请日:1991-05-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , YAMAGUCHI AKIHIRO , OHTA MASAHIRO
IPC: C08G73/10
Abstract: A readily melt processable polyimide obtained by reacting diamine represented by the formula: wherein n is an integer of 1 or 2, with 3,3',4,4'-diphenylethertetracarboxylic dianhydride and/or 4,4'-(p-phenylenedioxy)diphthalic dianhydride or a mixture of these tetracarboxylic acid dianhydrides and pyromellitic dianhydride in the presence of phthalic anhydride, is disclosed.
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公开(公告)号:DE69209172T2
公开(公告)日:1996-10-17
申请号:DE69209172
申请日:1992-01-20
Applicant: MITSUI TOATSU CHEMICALS
Inventor: OHTA MASAHIRO , MATSUYAMA AKIO , SENOUE EIJI , KUWANO FUMIAKI , YASUI OSAMU , YOSHIDA YASUNORI , RYU AKINORI , KOBAYASHI TADASHI
IPC: C07D209/48 , C07D209/66 , C07D487/04 , C08G73/10 , C08G73/12 , C08K5/3417 , C08K9/04 , C08L79/08 , C09D179/08
Abstract: A polyimide resin composition for molding, which comprises a polyimide resin and an aromatic bisimide compound and has a melt flowability and an excellent processability in addition to the heat resistance inherent in polyamide; a carbon fiber-reinforced polyimide resin composition which comprises a polyimide resin and carbon fibers coated with an aromatic bisimide compound and has excellent mechanical strengths; and novel bisimide compounds represented by general formula (I), which are very useful as the aromatic bisimide compounds in the above resin compositions, wherein X represents a direct bond, C1 to C10 divalent hydrocarbyl, hexafluoroisopropylidene, carbonyl, thio or sulfonyl; Y1 to Y4 represent each independently hydrogen, lower alkyl, lower alkoxy, chlorine or bromine; and R represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups, and nonfused polycyclic aromatic groups wherein aromatic groups are linked together directly or through cross-linking member(s).
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公开(公告)号:DE69026209T2
公开(公告)日:1996-08-22
申请号:DE69026209
申请日:1990-11-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TSUTSUMI TOSHIHIKO , MORIKAWA SHUICHI , NAKAKURA TOSHIYUKI , SHIMAMURA KATUNORI , TAKAHASHI TOSHIAKI , KOGA NOBUHITO , OHTA MASAHIRO , MORITA ATSUSHI , YAMAGUCHI AKIHIRO
Abstract: A molding resin composition comprising 99.9 to 50 % by weight of polyimide represented by the formula: and 0.1 to 50 % by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420 DEG C or less.
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公开(公告)号:DE69026209D1
公开(公告)日:1996-05-02
申请号:DE69026209
申请日:1990-11-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TSUTSUMI TOSHIHIKO , MORIKAWA SHUICHI , NAKAKURA TOSHIYUKI , SHIMAMURA KATUNORI , TAKAHASHI TOSHIAKI , KOGA NOBUHITO , OHTA MASAHIRO , MORITA ATSUSHI , YAMAGUCHI AKIHIRO
Abstract: A molding resin composition comprising 99.9 to 50 % by weight of polyimide represented by the formula: and 0.1 to 50 % by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420 DEG C or less.
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公开(公告)号:CA2028358C
公开(公告)日:1995-08-22
申请号:CA2028358
申请日:1990-10-23
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
Abstract: A polyimide having a high heat-resistance, good processability and recurring structural units of the formula (I): (I) wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having at least two carbon atoms, alicyclic radical, monocyclic aromatic radical, fused polycyclic aromatic radical and polycyclic aromatic radical bonded through a direct bond or a bridge member.
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公开(公告)号:DE68918397T2
公开(公告)日:1995-03-30
申请号:DE68918397
申请日:1989-10-25
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , KAWASHIMA SABURO , OHTA MASAHIRO , IIYAMA KATSUAKI , OIKAWA HIDEAKI , OHKOSHI KOUJI , YAMAGUCHI AKIHIRO
IPC: C08G73/10
Abstract: The present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carring out condensation of 4,4 min - bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a diamine compound and/or tetracarboxylic acid dianhydride. The polyimides have a non-crystalline structure and exhibit excellent thermal resistance and processability.
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公开(公告)号:DE3850706T2
公开(公告)日:1995-03-23
申请号:DE3850706
申请日:1988-05-17
Applicant: MITSUI TOATSU CHEMICALS , NTN TOYO BEARING CO LTD
Inventor: YOSHIKAWA MASAO , OHTA MASAHIRO
IPC: C08L79/08
Abstract: Heat resistant resin compositions consisting essentially of 5-95 wt.% of polyimide composed of recurring units represented by the formula (I): wherein X and Y are the same as defined in the claims, and 95-5 wt.% of known aromatic polyetherimide are disclosed. The resin compositions of this invention have good thermal stability in the high temperature region, particularly in the temperature range of 300-400 DEG C. The compositions can be injection molded due to the retention of frictional property in aromatic polyetherimide and also have thermal resistance, impact resistance and abrasion resistance. Therefore the compositions can be widely used as the material of parts in any industrial fields such as automotives, business machines, electric and electronic appliances, automatic energy saving devices, aeronautics and space instruments and general purpose industrial machines, which renders this invention very valuable.
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公开(公告)号:CA1333947C
公开(公告)日:1995-01-10
申请号:CA599626
申请日:1989-05-15
Applicant: MITSUI TOATSU CHEMICALS
Inventor: YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/12
Abstract: The present invention relates to thermosetting resin compositions comprising a bismaleimide compound represented by the formula (I) (I) and an aromatic amine resin represented by the general formula (II) (II) and to processes for preparing the same.
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