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公开(公告)号：DE69936072D1
公开(公告)日：2007-06-21
申请号：DE69936072
申请日：1999-12-17
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GUENTHER EWALD KARL MICHAEL
IPC: G02F1/1339 , H05B33/04 , H01L51/50 , H01L51/52
Abstract: The invention provides for the formation of thin devices having an overall thickness which is less than the width of the sealing frame used to mount the cap. The formation of thin devices is facilitated by the use of spacers in the device region to support the cap.
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公开(公告)号：DE102004047727A1
公开(公告)日：2006-04-13
申请号：DE102004047727
申请日：2004-09-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HOLZER PETER , GUENTHER EWALD KARL MICHAEL , EBERHARD FRANZ , RICHTER MARKUS
IPC: H01L33/50
Abstract: The converter layer (2) is made of YAG:Ce material and may radiate in the blue region at a wavelength of e.g. 464 nm. The cone angle (Theta) of the radiation may be increased by having a structured strip (22) around the outside edge of the converter strip. The width (23) of the strip is a tenth of the length of the edges of the strip. Each edge is 300 mu long. The structured strip may be formed by a stamping tool on the edge of a square semiconductor substrate (5).
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公开(公告)号：DE69908194D1
公开(公告)日：2003-06-26
申请号：DE69908194
申请日：1999-12-17
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GUENTHER EWALD KARL MICHAEL , HAGEN KLAUSMANN
IPC: H05B33/04 , C09J201/00 , C09K3/10 , H01L25/04 , H01L51/50 , H01L51/52 , H05B33/10 , H01L27/15 , H01L51/20
Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.
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公开(公告)号：CA2343227A1
公开(公告)日：2001-01-18
申请号：CA2343227
申请日：1999-07-09
Inventor： COTTERELL BRIAN , CHEN ZHONG , GUENTHER EWALD KARL MICHAEL
IPC: H05B33/10 , B81B7/00 , B81C1/00 , H01L27/32 , H01L33/26 , H01L33/42 , H01L51/50 , H01L51/52 , H05B33/02 , H05B33/26 , H01L21/027 , H01L21/308 , H01L21/311 , H01L21/321
Abstract: A method of fabricating a device comprising mechanically patterning a device layer using a stamp containing the desired pattern. The device layer is form ed on a plastic or polymeric substrate. The stamp is pressed against the substrate under a load which patterns the device layer without cracking it i n the non-patterned areas.
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公开(公告)号：CA2342946A1
公开(公告)日：2001-01-18
申请号：CA2342946
申请日：1999-07-09
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GUENTHER EWALD KARL MICHAEL
Abstract: An encapsulation for an electrical device (100) is disclosed. A cap support (130) is provided in the non-active regions (120) of the device (100) to prevent the package from contacting the active components (110) of the devic e due to mechanical stress induced in the package.
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Patent Agency Ranking
公开(公告)号：AT413362T
公开(公告)日：2008-11-15
申请号：AT99933463
申请日：1999-07-09
Inventor： GUENTHER EWALD KARL MICHAEL , CHEN ZHONG , COTTERELL BRIAN
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公开(公告)号：AT376707T
公开(公告)日：2007-11-15
申请号：AT99933462
申请日：1999-07-09
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GUENTHER EWALD KARL MICHAEL
Abstract: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.
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公开(公告)号：DE102004036961B3
公开(公告)日：2006-04-20
申请号：DE102004036961
申请日：2004-07-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： SCHWARZ THOMAS , GUENTHER EWALD KARL MICHAEL , STEEGMUELLER ULRICH
Abstract: The method involves placing a metal foil in between a semiconductor chip and a substrate. The chip is positioned on the substrate, so that a section of a metallic layer (4) on the chip and the substrate contacts the foil. A layer (4) on the chip, metal foil and a layer (3) on the substrate contain the same metal. Ultrasonic is introduced in the chip, and fixed mechanical connection is provided between the chip and substrate.
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公开(公告)号：DE102004050371A1
公开(公告)日：2006-04-13
申请号：DE102004050371
申请日：2004-10-15
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： SORG JOERG ERICH , GUENTHER EWALD KARL MICHAEL , STATH NORBERT
Abstract: An optoelectronic component comprises a semiconductor chip (1) with a lower contact (4) on a support (10) both encapsulated by an electrically insulating transparent material (3) having holes to a contact (6) and connection area (8) that are joined by a conductive layer (14). Radiation emitted (13) is decoupled through the encapsulation. Independent claims are also included for the following: (A) a production process for the above;and (B) a lighting device as above.
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公开(公告)号：DE10339985A1
公开(公告)日：2005-03-31
申请号：DE10339985
申请日：2003-08-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HAERLE VOLKER , GUENTHER EWALD KARL MICHAEL
IPC: H01L31/02 , H01L31/0203 , H01L31/0224 , H01L33/48 , H01L33/62 , H01S5/022 , H01L33/00
Abstract: Optoelectronic component comprises: (i) a semiconductor chip (1) having a first main surface (2); (ii) a first contact surface (4) and a second main surface (5) with a second contact surface (6); and (iii) a support body (10) having connecting regions (7, 8). The second contact surface is connected to a conducting transparent layer (14) of the second connecting region of the support body. An independent claim is also included for a process for the production of an optoelectronic component.
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