公开(公告)号：DE102008018353A1

公开(公告)日：2009-08-06

申请号：DE102008018353

申请日：2008-04-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BARCHMANN BERND ,  STATH NORBERT ,  WEGLEITER WALTER ,  WUTZ OLIVER ,  WEIDNER KARL ,  REBHAN MATTHIAS ,  WEINKE ROBERT

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/50

公开(公告)号：DE102005041099A1

公开(公告)日：2007-03-29

申请号：DE102005041099

申请日：2005-08-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WEIDNER KARL

IPC: H01L21/56 ,  H01L21/60 ,  H01L33/44 ,  H01L33/62

Abstract: In a method for producing a semiconductor component, in particular a semiconductor structure having a surface structure or topography which is produced by means of electronic components (2) on a substrate (1), at least one electronic component (2) is applied to a substrate (1), and an isolation layer (3) is applied to the topography which is produced by means of the at least one component (2) on the substrate (1). Contact-making openings (5) are then produced in the isolation layer (3) at contact points (8, 9) for the at least one electronic component, the isolation layer (3) and the contact points (8, 9) in the contact-making openings (5) are planar-metallized, and the metallization is structured in order to produce electrical connections (4), with the isolation layer (3) having a glass coating.