公开(公告)号：JPH07242799A

公开(公告)日：1995-09-19

申请号：JP22306294

申请日：1994-09-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08K5/54 ,  C08K5/544 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain an epoxy resin compsn. for semiconductor sealing which has excellent reliability (soldering-heat resistance, moisture resistance, etc.) and moldability (high-temp. hardness, burr-preventing properties, etc.) in a good balance by compounding a biphenyl epoxy resin as the base resin with an aminosilane coupling agent together with a curative, a filler, etc. CONSTITUTION:The title compsn. contains 5-25wt.% epoxy resin having a backbone of the formula (wherein R to R are each H, 1-4C alkyl, or halogen) as the essential component, 2-15wt.% curative (e.g. a phenol novolac resin), 75-90wt.% filler comprising 40-90wt.% crushed fused silica having an average particle size of 12mum or lower and 10-60wt.% spherical fused silica having an average particle size of 40mum or lower, and an aminosilane compd. as a coupling agent in an amt. of 0.3-1.5wt.% of the filler. The compsn. may further contain a cure catalyst.

公开(公告)号：JPH0733429B2

公开(公告)日：1995-04-12

申请号：JP7088791

申请日：1991-04-03

Applicant: TORAY INDUSTRIES

Inventor： HONDA SHIRO ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08G59/20 ,  C08G59/00 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JPH0672202B2

公开(公告)日：1994-09-14

申请号：JP25358088

申请日：1988-10-06

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08K3/36 ,  C08G59/00 ,  C08K7/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JPH0625294B2

公开(公告)日：1994-04-06

申请号：JP3092786

申请日：1986-02-17

Applicant: TORAY INDUSTRIES

Inventor： KONDO MAKOTO ,  KAYABA KEIJI ,  YAMAMOTO YOSHUKI

IPC: C08L53/02 ,  C08L53/00 ,  C08L77/00 ,  C08L77/12

公开(公告)号：JPH04264155A

公开(公告)日：1992-09-18

申请号：JP2601891

申请日：1991-02-20

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  SAWAMURA TAIJI ,  TANAKA MASAYUKI

IPC: C08G59/20 ,  C08G59/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain the title composition excellent in soldering-heat resistance, flame retardancy and high-temperature reliability by mixing a specified epoxy resin with a specified amount of a filler, a specified amount of hydrotalcite compound, a curing agent, a Br compound and an Sb compound. CONSTITUTION:This composition comprises an epoxy resin essentially consisting of an epoxy resin of the formula (wherein two of R to R are each a glycidyl ether group, and the other are each H, halogen or 1-4C alkyl), a curing agent (e.g. phenolic novolac resin), 75-95wt.%, based on the total composition, filler (e.g. fused silica), 0.01-10wt.%, based on the total composition, hydrotalcite compound [e.g. Mg4.5Al2(OH)13CO3.3.5 H2O], a Br compound (e.g. brominated bisphenol A epoxy resin),and an Sb compound (e.g. Sb2O3).

公开(公告)号：JPH04226123A

公开(公告)日：1992-08-14

申请号：JP14514791

申请日：1991-06-18

Applicant: TORAY INDUSTRIES

Inventor： HONDA SHIRO ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08G59/20 ,  C08G59/00 ,  C08G59/62 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To prevent the occurrence of package crack in the surface-mounting step of a semiconductor device and to improve the reliability under humid conditions. CONSTITUTION:An epoxy resin compsn. which comprises an epoxy resin, a phenolic curing agent, a polystyrene block copolymer, and a fused silica as essential components. The silica comprises 97-60wt.% irregular-shaped fused silica and 3-40wt.% spherical fused silica having a mean particle diameter of 4mum which is smaller than that of the irregular-shaped fused silica, and the amt. of the fillers including the fused silica accounts for 70-88wt.% of the compsn. The compsn. is excellent in resistance to soldering heat and reliability under humid conditions and useful for sealing a semiconductor.

公开(公告)号：JPH0459862A

公开(公告)日：1992-02-26

申请号：JP17351390

申请日：1990-06-29

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08G59/00 ,  C08G59/20 ,  C08K5/54 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To provide an epoxy resin composition having excellent soldering heat resistance, moisture resistant reliability and moldability free of burr and having good thermal hardness and useful for sealing semiconductors by compounding an epoxy resin, a curing agent, a filler and a polyfunctional silane coupling agent. CONSTITUTION:An epoxy resin preferably containing biphenyl epoxy resin having a skeleton of the formula (R -R are H, 1-4C alkyl or halogen) in an amount of >=30wt.% based on the whole epoxy resin, (B) a curing agent (preferably a novolak resin) in a A:B chemical equivalent ratio of 1:(0.5-0.6), especially 0.8-1.3, (C) 5-90wt.% or a filler (preferably molted silica), (D) a polyfunctional silane coupling agent in an amount of 0.1-5 pts.wt., preferably 0.2-3 pts.wt., per 100 pts.wt. of the component C and, if necessary, a curing agent, a flame retardant, etc., the component C being surface-treated with the component D, are melted and kneaded with each other to provide the objective resin composition.

公开(公告)号：JPH0314868B2

公开(公告)日：1991-02-27

申请号：JP2043085

申请日：1985-02-05

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  KONDO MAKOTO ,  YAMAMOTO YOSHUKI

IPC: C08L71/00 ,  C08L67/00 ,  C08L71/02 ,  C08L75/00 ,  C08L75/04 ,  C08L77/00 ,  C08L77/12

公开(公告)号：JPH02218735A

公开(公告)日：1990-08-31

申请号：JP4105789

申请日：1989-02-20

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08G59/00 ,  C08K5/54 ,  C08K5/544 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain the title composition which has excellent moldability and prevents the sealing resin from cracking in the soldering process by using a specific epoxy resin, a curing agent, a filler and an amino group-containing silane coupling agent. CONSTITUTION:The subject composition comprises (A) an epoxy resin containing, as an essential component, an epoxy resin having a skeleton of the formula (R to R are 1-4C alkyl, halogen) such as 4,4'-bis(2,3-epoxypropoxy) biphenyl, (B) a curing agent such as a phenol novolak resin, (C) a filler, preferably a fused silica which is composed of 90 to 40wt.% of fused and crushed silica of less than 12mum average particle size and 10 to 80wt.% of spherical fused silica of less than 40mum average particle size, and (D) an amino group, preferably secondary amino group-containing silane coupling agent.

公开(公告)号：JPH02113024A

公开(公告)日：1990-04-25

申请号：JP26506788

申请日：1988-10-20

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  TABATA KENICHI

IPC: C08G63/60

Abstract: PURPOSE:To provide the subject polymer containing a reduced amount of foreign matters and having excellent heat resistance, strength, etc., by copolymerizing specific structural units. CONSTITUTION:(A) p-Hydroxybenzoic acid giving a structural unit of formula I is is reacted with polyethylene terephthalate, etc., giving a structural unit of formula II at 100-250 deg.C and the reaction product is polycondensed with a compound of formula III [X is R CO (R is alkyl) or H; R is phenyl, alkyl, etc.], such as p-acetoxybenzoic acid preferably at 250-350 deg.C under vacuum to provide the objective polyester having an intrinsic viscosity of 0.5-5.0dl/g.