公开(公告)号：JPH10178059A

公开(公告)日：1998-06-30

申请号：JP21651797

申请日：1997-08-11

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J7/00 ,  C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using a thermosplastic resin and an epoxy resin that contains a specific epoxy risen as an essential constituent as an adhesive composition for a semiconductor integrated circuit. SOLUTION: Epoxy resin A that contains, as essential constituents, a thermoplastic resin and an epoxy resin (a) indicated by an expression is used as an adhesive composition for a semiconductor integrated circuit. R1-R8 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. The epoxy resin (a) whose concrete example is terpenediphenoliglycidylether is contained in an epoxy resin A preferably by 60wt.% of higher and the epoxy resin A is contained in the adhesive composition preferably by 20-60wt.%. The thermoplastic resin preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, methylol group, isocyanate group, vinyl group, and silanol group as a functional group that can react with the epoxy resin A to improve heat resistance.

公开(公告)号：JPH10178037A

公开(公告)日：1998-06-30

申请号：JP21511697

申请日：1997-08-08

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  ANDO YOSHIO ,  SAWAMURA TAIJI

IPC: B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  C09J7/00 ,  C09J161/06 ,  C09J163/00 ,  C09J167/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve workability, adhesive strength, insulation reliability and durability by a method wherein at least one or more kinds of resin and thermosetting resin, containing ester coupling in the main chain, are contained as the essential component of an adhesive composition. SOLUTION: A semiconductor integrated circuit connecting board is provided with at least one or more layers of a wiring board layer consisting of an insulative layer and a conductive pattern, a layer having no conductive pattern, and an adhesive layer consisting of an adhesive composition. It is indispensable that the adhesive composition contains at least one or more kinds of resin and thermosetting resin, having an ester coupling in a main chain. The resin, containing ester coupling in a principle chain has adhesive property, alleviation of thermal stress, improved insulating property due to low water absorbing property, and the thermosetting resin is necessary to maintain the balance of the physical properties such as heat resisting property, the insulating property at high temperature, chemical proof property, the strength of adhesive layer, etc.

公开(公告)号：JPH08264595A

公开(公告)日：1996-10-11

申请号：JP6407895

申请日：1995-03-23

Applicant: TORAY INDUSTRIES

Inventor： SUGIURA SEIYA ,  KIGOSHI SHOJI ,  HATANO HIROSHI

IPC: C09J7/02 ,  C09J161/06 ,  C09J161/10 ,  C09J163/00 ,  C09J177/00 ,  H01L21/60

Abstract: PURPOSE: To realize good bonding property and chemical resistance by incorporating naphthol compound and polyamide resin to an adhesive layer as an essential element. CONSTITUTION: The title tape is constituted of a lamination body having an adhesive layer 2 and a protection film layer on a flexible organic insulating film 1 and naphthol compound and polyamide resin are incorporated to the adhesive layer 2 as an essential element. For example, the adhesive layer 2 contains epoxy resin. Naphthol compound has a plurality of OH groups bonded to naphthalene skeleton in one molecule and polyamide resin contains 36C dicarboxylic acid as an essential element. Compounding ratio of naphthol compound and polyamide resin is 5 to 100 pts.wt., desirably, 30 to 80 pts.wt. of naphthol compound to 100 pts.wt. of polyamide resin. An addition amount of epoxy resin is 20 to 100 pts.wt., desirably, 40 to 70 pts.wt. of epoxy resin to 100 pts.wt. of polyamide resin.

公开(公告)号：JPH0223304A

公开(公告)日：1990-01-25

申请号：JP17422788

申请日：1988-07-12

Applicant: TORAY INDUSTRIES

Inventor： KITAURA KOICHI ,  KIGOSHI SHOJI ,  KUKI HISAO

IPC: G02B1/08 ,  G02B5/30

Abstract: PURPOSE:To improve wet heat resistance and polarizability by specifying the component constitution and characteristics of a polarizing element. CONSTITUTION:The polarizing element is constituted by forming 60% thereof of a polarizer consisting of a polyvinyl alcohol system which is iodine and the rest of a protective film layer. The polarizer has at least 3 pieces of absorption peaks in a 210 to 400nm UV region and the UA value at which the UV absorption characteristics is exhibited is >=4.0; in addition, the average transmittance (VT value) of visible light subjected to visible sensitivity correction in the wavelength region from 400 to 700nm is specified to 25-50%. the UA value is the wet heat resistance characteristic value given from the absorption spectra of the UV and visible light wavelength regions of the polarizer and set to attain an optimum value together with the visible polarized light transmittance (VT value). The degree of polarization and the wet heat resistance are improved in this way.

公开(公告)号：JP2002249753A

公开(公告)日：2002-09-06

申请号：JP2001048281

申请日：2001-02-23

Applicant: TORAY INDUSTRIES

Inventor： OSAWA YOKO ,  KIGOSHI SHOJI

IPC: C09J7/02 ,  C09J11/04 ,  C09J133/14 ,  C09J161/04 ,  C09J163/00 ,  C09J201/00 ,  H01L21/52 ,  H01L21/60 ,  H01L23/14

Abstract: PROBLEM TO BE SOLVED: To industrially provide a new adhesive composition for semiconductor device excellent in thermal cycle reliability, reflow resistance and workability, an adhesive sheet for semiconductor device using the above composition, and such a semiconductor device, and to thereby improve both the reliability and easy processability of the semiconductor. SOLUTION: This adhesive composition for semiconductor device is characterized by that the rate of change for the tensile modulus after heat-setting the adhesive composition in a sheet form at 170 deg.C for 2 h and that after left to stand at 150 deg.C for 250 h thereafter is

公开(公告)号：JP2002180017A

公开(公告)日：2002-06-26

申请号：JP2000380056

申请日：2000-12-14

Applicant: TORAY INDUSTRIES

Inventor： KADOTA YOSHIJI ,  SHINOHARA HIDEKI ,  KIGOSHI SHOJI

IPC: C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J201/00 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To industrially provide an adhesive sheet for a semiconductor device having excellent reflow resistance and processability and improve the reliability of the semiconductor device for surface packaging. SOLUTION: This adhesive sheet for the semiconductor is characterized in that (A) a protective film layer satisfies characteristics of the following (1) to (2) in the adhesive sheet comprising at least one layer of the protective film layer (A) and (B) an adhesive layer. (1) >=75 and =0.5 and

公开(公告)号：JP2002076062A

公开(公告)日：2002-03-15

申请号：JP2000255352

申请日：2000-08-25

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SHOJI ,  TOKUNAGA MASAMI

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive applied tape for semiconductor devices, a copper-plated laminate, and a semiconductor device using the same, which can reduce warping in either case of 'with copper foil' or 'after forming circuit pattern'. SOLUTION: This adhesive applied tape for semiconductor devices is constituted of an organic insulation film layer having properties (1) to (3) and one or more layers of half-hardened adhesive layers. (1) Film thickness is 10 to 65 μm. (2) Coefficient of linear expansion of the film in the direction of width (TD) at 50 to 200 deg.C is 17 to 30 ppm/ deg.C. (3) Tensile elastic modulus at 25 deg.C is 6 to 12 GPa.

公开(公告)号：JP2000273430A

公开(公告)日：2000-10-03

申请号：JP8417599

申请日：1999-03-26

Applicant: TORAY INDUSTRIES

Inventor： TABATA AKIHIRO ,  SHINOHARA HIDEKI ,  KIGOSHI SHOJI

IPC: H05K3/28 ,  C09J109/02 ,  C09J163/00 ,  C09J167/00 ,  H05K1/03 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To obtain a new adhesive composition for a flexible printed circuit board having excellent preservation stability, solder heat resistance and adhesiveness, capable of providing a cover lay film and a flexible printed circuit board. SOLUTION: This adhesive composition for a flexible printed circuit board comprises (A) 100 pts.wt. of an epoxy resin, (B) 20-100 pts.wt. of a carboxyl group-containing acrylonitrile butadiene rubber, (C) 2-19 pts.wt. of a thermoplastic saturated copolymer ester, (D) 0.01-50 pts.wt. of a curing agent and (E) 2-50 pts.wt. of an inorganic particle.

公开(公告)号：JPH10178067A

公开(公告)日：1998-06-30

申请号：JP22170697

申请日：1997-08-18

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J7/00 ,  C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance and thermal cycle property by using an epoxy resin, a thermoplastic resin, and a thermocuring type adhesive containing silica powder as an adhesive composition for forming an adhesive layer. SOLUTION: An adhesive layer 23 is constituted of an epoxy resin, a thermoplastic resin, a thermocuring resin, and a thermocuring type adhesive composition containing silica powder. Any epoxy resin with at least two epoxy groups in one molecule may be used. A copolymer with butadiene as an essential copolymer constituent is preferable as the thermoplastic resin. The silica powder has a large reduction effect of a thermal coefficient of expansion and a melted silica that is effective for reducing stress is preferable. In this case, the melted silica indicates an amorphous silica whose true specific gravity is 2.3 or less. An adhesive sheet for semiconductor device is obtained by melting the adhesive composition in a solvent, applying it onto a polyester film with a mold release property, and further laminating a protection sheet 24 with a weak release force onto a dry adhesive layer 23.

公开(公告)号：JPH10178066A

公开(公告)日：1998-06-30

申请号：JP21744897

申请日：1997-08-12

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  ANDO YOSHIO ,  SAWAMURA TAIJI

IPC: C09J7/00 ,  C09J161/06 ,  C09J163/00 ,  C09J175/04 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve processabiltiy, adhesion force, insulation reliability, and durability by using a resin that contains urethane bond and/or urea bond and a thermosetting resin for a main chain as the essential constituent of an adhesive composition for forming an adhesive layer. SOLUTION: A substrate for connecting semiconductor integrated circuit has at least one layer of each of a wiring substrate layer 4 that consists of an insulator layer 3 and a conductor pattern, a layer 7 where no conductor patterns are formed, and an adhesive layer 6. The adhesive a layer 6 contains at least one type of each of a resin that contains urethane bond and/or urea bond and a thermosetting resin for a main chain. Examples of the resin that contains urethane bond and/or urea bond for the main chain are polyurethane, polyurea, a copolymer of polyurethane and polyurea. An epoxy resin and a phenol resin is suitable for the thermosetting resin due to the improved insulation property.