公开(公告)号：JPH08225656A

公开(公告)日：1996-09-03

申请号：JP32595695

申请日：1995-12-14

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  TOKUNAGA ATSUTO ,  SAWAMURA TAIJI

IPC: C08J5/00 ,  B29C45/02 ,  B29K63/00 ,  C08G59/20 ,  C08G59/24 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00

Abstract: PURPOSE: To obtain a precision part which can be mass-produced and has excellent dimensional accuracy in processing. CONSTITUTION: The precision part is a molded article obtained by molding an epoxy resin composition comprising an epoxy resin, a hardener, and an inorganic filler as essential components and curing the molding. The molding shrinkage of the composition is 0.8% or lower. The cured molding has a coefficient of linear expansion of 15×10 / deg.C or lower.

公开(公告)号：JP2501149B2

公开(公告)日：1996-05-29

申请号：JP17703791

申请日：1991-07-17

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  ITO KAZUO ,  TANAKA MASAYUKI

IPC: C08K3/22 ,  C08G59/00 ,  C08K3/24 ,  C08K3/26 ,  C08K5/02 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JP2501143B2

公开(公告)日：1996-05-29

申请号：JP9761991

申请日：1991-04-26

Applicant: TORAY INDUSTRIES

Inventor： HONDA SHIRO ,  TESHIBA TOSHIHIRO ,  TANAKA MASAYUKI

IPC: C08G59/24 ,  C08G59/00 ,  C08G59/20 ,  C08G59/62 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JPH07278272A

公开(公告)日：1995-10-24

申请号：JP7078394

申请日：1994-04-08

Applicant: TORAY INDUSTRIES

Inventor： TSURUMI YUMIKO ,  SAWAMURA TAIJI ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08G59/62 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To prevent the occurrence of package crack in the step of surface mounting of a semiconductor device and to provide an epoxy resin compsn. excellent in resistance to soldering heat, reliability of moisture resistance, and moldability and a resin-sealed semiconductor device with an enhanced reliability. CONSTITUTION:An epoxy resin compsn. contains an epoxy resin, a curative contg. as the essential component a compd. having structural units of formulas I, II, and III (R is H or 1-4C alkyl), and a filler in an amt. of 86-96wt.% of the compsn.

公开(公告)号：JPH0730236B2

公开(公告)日：1995-04-05

申请号：JP4105789

申请日：1989-02-20

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08G59/00 ,  C08K5/54 ,  C08K5/544 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JPH06287273A

公开(公告)日：1994-10-11

申请号：JP7479593

申请日：1993-03-31

Applicant: TORAY INDUSTRIES

Inventor： SHINTANI SHUICHI ,  SAWAMURA TAIJI ,  TANAKA MASAYUKI

IPC: C08G59/24 ,  C08G59/20 ,  C08G59/40 ,  C08K3/00 ,  C08L63/00

Abstract: PURPOSE:To obtain the subject composition useful for electric circuit parts, etc., having excellent moldability, heat resistance of solder, comprising an epoxy resin, a silane compound, a filler, etc., as essential components. CONSTITUTION:The objective composition comprises (A) an uncured epoxy resin composed of an epoxy resin of formula I (R1 to R8 are H, 1-4C alkyl or halogen) or an epoxy resin of formula II (two of R9 to R16 are 2,3- epoxypropoxy and the other is H, 1-4C alkyl or halogen) as an essential component, (B) a silane compound obtained by hydrolyzing a silane coupling agent of formula III (R17 is 1-4C alkyl; R18 is 1-4C alkyl or phenyl; R19 is organic reactive group; m is 1-3; n is 0-2; m+n=3) and subjecting to polycondensation and (C) 85-95wt.% of a filler (preferably amorphous silica) based on the whole composition as essential components to give the objective composition.

公开(公告)号：JPH0668010B2

公开(公告)日：1994-08-31

申请号：JP24507287

申请日：1987-09-28

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  KAYABA KEIJI ,  UENO TOSHIAKI

IPC: H01L23/29 ,  C08G59/20 ,  C08G59/32 ,  C08K3/00 ,  C08L63/00 ,  C08L63/02 ,  H01L23/31

公开(公告)号：JPH0611829B2

公开(公告)日：1994-02-16

申请号：JP1248285

申请日：1985-01-28

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  MORIOKA KATSUJI ,  CHIBA KAZUMASA ,  KISHIMOTO AKIHIKO

IPC: C08L33/00 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L23/02 ,  C08L23/26 ,  C08L25/00 ,  C08L25/08 ,  C08L33/02 ,  C08L33/04 ,  C08L33/08 ,  C08L35/06 ,  C08L51/00 ,  C08L51/02 ,  C08L51/06 ,  C08L67/00 ,  C08L73/00 ,  C08L77/00 ,  C08L101/00

公开(公告)号：JPH0632869A

公开(公告)日：1994-02-08

申请号：JP19033692

申请日：1992-07-17

Applicant: TORAY INDUSTRIES

Inventor： TSUTSUMI YASUAKI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08G59/18 ,  C08G59/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain the subject composition suppressed in crack occurrence and excellent in moldability, heat resistance to soldering and reliability of moisture resistance by containing an epoxy resin, a curing agent, a filling agent a modified styrenic block copolymer and a specified inorganic ion exchanger in a specified ratio. CONSTITUTION:The objective composition consists essentially of (A) preferably 6-18wt.% epoxy resin, (B) preferably 3-10wt.% curing agent such as a phenolic novolak resin, (C) 60-95wt.% filler such as an amorphous silica, (D) preferably 1-6wt.% modified styrenic block copolymer obtained by subjecting a styrene- based block copolymer to copolymerization or graft reaction with an unsaturated carboxylic acid (derivative) and (E) 0.02-30wt.% inorganic ion exchanger having a structure of the formula [M is trivalent to pentavelent transition metal; (x) is 1-5; (y) is 1-7; (z) and (w) are 0.2-3.0; (n) is 0-2].

公开(公告)号：JPH0563115A

公开(公告)日：1993-03-12

申请号：JP876392

申请日：1992-01-21

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  SAWAMURA TAIJI ,  TANAKA MASAYUKI

IPC: C08G59/62 ,  C08G59/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To improve solder heat resistance, reliability on moisture resistance and stress resistance by adding a modified styrene block copolymer to a curing agent having specific structure. CONSTITUTION:A resin composition contains an epoxy resin, a curing agent, fillers and a modified styrene block as essential ingredients. The curing agent contains curing agents shown in formula I (R represents a group selected from a hydrogen atom, an aryl group or an alkyl group) and formula II and a curing agent shown in formula III (R -R represent a group selected from the hydrogen atom, a halogen atom or a 1-4C alkyl group and (n) an integer of 0 or more) as essential ingredients. The ratio of the fillers is 60-90wt.% of the whole, and a modified styrene block copolymer is acquired by copolymerizing or graft- reacting unsaturated carboxylic acid or a derivative thereof with a styrene block copolymer. Accordingly, the composition is improved in soldering temperature resistance, reliability on moisture resistance and low stress property.