公开(公告)号：US20230240014A1

公开(公告)日：2023-07-27

申请号：US17685404

申请日：2022-03-03

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Shih-Lian Cheng

IPC: H05K3/00 ,  H05K3/42 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K3/0094 ,  H05K3/429 ,  H05K1/144 ,  H05K1/111

Abstract: A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

公开(公告)号：US11545412B2

公开(公告)日：2023-01-03

申请号：US16952080

申请日：2020-11-19

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Ching Sheng Chen ,  Ra-Min Tain ,  Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/498

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

公开(公告)号：US10356901B2

公开(公告)日：2019-07-16

申请号：US16008060

申请日：2018-06-14

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Wen-Fang Liu

IPC: H05K1/11 ,  H05K3/00 ,  H01L21/32 ,  H01L23/48 ,  H05K3/46 ,  H05K3/34

Abstract: A manufacturing method of a circuit board structure includes the following steps: providing an inner circuit structure which includes a core layer; performing a build-up process to laminate a first build-up circuit structure on a first patterned circuit layer of the inner circuit structure, wherein the first build-up circuit structure includes an inner dielectric layer, and the inner dielectric layer directly covers an upper surface of the core layer and the first patterned circuit layer; removing a portion of the first build-up circuit structure to form an opening extending from a first surface of the first build-up circuit structure relatively far away from the inner circuit structure to a portion of the inner dielectric layer; performing a sandblasting process on a first inner surface of the inner dielectric layer exposed by the opening to at least remove the portion of the inner dielectric layer exposed by the opening.

公开(公告)号：US10080284B2

公开(公告)日：2018-09-18

申请号：US15822222

申请日：2017-11-27

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Shu-Sheng Chiang ,  Wei-Ming Cheng

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening communicating the cavity and a pad of the first patterned circuit layer is located in the opening. A hole diameter of the opening is smaller than a hole diameter of cavity. An inner surface of the inner dielectric layer exposed by the cavity and a top surface of the pad are coplanar or have a height difference.

公开(公告)号：US09832873B2

公开(公告)日：2017-11-28

申请号：US15426062

申请日：2017-02-07

Applicant: Unimicron Technology Corp.

Inventor： Shu-Sheng Chiang ,  Ming-Hao Wu ,  Wei-Ming Cheng

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening connecting the cavity and exposing a portion of the first patterned circuit layer. A hole diameter of the opening is smaller than a hole diameter of cavity. A height difference is between an inner surface of the inner dielectric layer exposed by the cavity and a top surface of the first patterned circuit layer exposed by the opening.

公开(公告)号：US09609746B1

公开(公告)日：2017-03-28

申请号：US15011649

申请日：2016-01-31

Applicant: Unimicron Technology Corp.

Inventor： Shu-Sheng Chiang ,  Ming-Hao Wu ,  Wei-Ming Cheng

IPC: H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening connecting the cavity and exposing a portion of the first patterned circuit layer. A hole diameter of the opening is smaller than a hole diameter of cavity. A height difference is between an inner surface of the inner dielectric layer exposed by the cavity and a top surface of the first patterned circuit layer exposed by the opening.