Abstract:
A solid state sub-nanometer-scale electron beam emitter comprising a multi-layered structure having a nano-tip electron emitter and tunnel emission junction formed on substrate, an initial electron beam extraction electrode, a “nano-sandwich Einzel” electrode, and a topmost protective layer.
Abstract:
There is disclosed an improved field emission device (30) which finds use in display devices, such as a flat panel displays. Known devices and displays suffer from problems such as complexity of fabrication and limited colour gamut. The device (30) therefore provides a field emission backplate (38) which is made from a substantially semiconductor based material and comprises a plurality of grown tips (32), the device (30) further comprising at least one electro-luminescent and/or photo-luminescent material (34) having a fluorescent material chemically attached thereto, i.e. a fluorescent dye doped material.
Abstract:
A field emission device (FED) and a method for fabricating the FED are provided. The FED includes micro-tips with nano-sized surface features. Due to the micro-tips as a collection of a large number of nano-tips, the FED is operable at low gate turn-on voltages with high emission current densities, thereby lowering power consumption.
Abstract:
PROBLEM TO BE SOLVED: To provide an electron emission element which achieves both a stable electron emission characteristic and a low work function.SOLUTION: The field emission type electron emission element is provided with a cathode in which lanthanum oxide and molybdenum oxide are mixed.
Abstract:
PROBLEM TO BE SOLVED: To provide a stable field emission type electron source without lowering a current even if operated for a long time under a high current density. SOLUTION: A field emission type electron source 100 comprises a substrate 6; insulating layers 4 formed on the substrate 6 so as to have a plurality of openings 5; cathodes 2 disposed at each opening 5 respectively, so as to discharge electron beams; lead out electrodes 3 formed on the insulating layers 4 so as to control the discharge of the electrons from each cathode 2; and a surface reformation layers 1 formed on the surface of the cathodes 2, discharging electron by chemical bonding between a cathode material composing the cathodes 2 and a material different from the cathode material. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method and system for manufacturing a field emission display, in which a regularly arranged sharp emitter is manufactured with high precision and a high level of productivity without need of complicated manufacturing steps and complicated optical systems. SOLUTION: The method and system comprises a first step for forming a conductive film 16 for forming a cathode electrode on a glass substrate 15 as a base plate, a second step for applying a positive resist 17 as a photosensitive material on the conductive film 16, a third step for exposing the resist to form an opening 20 corresponding to the shape of the emitter 22 by applying the light from a light source as a parallel light having a homogeneous light intensity distribution into a micro lens array 18 and converging the applied light into the positive resist 17 with the micro lens array 18, and a fourth step for forming an emitter 22 in each opening 20. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
An electron source emitter is made from transition metal carbide materials, including hafnium carbide (HfC), zirconium carbide (ZrC), titanium carbide (TiC), vanadium carbide (VC), niobium carbide (NbC), and tantalum carbide (TaC), which are of high refractory nature. Preferential evaporating and subsequent development of different crystallographic planes of the transition metal carbide emitter having initially at its apex a small radius (50 nm-300 nm) develop over time an on-axis, sharp end-form or tip that is uniformly accentuated circumferentially to an extreme angular form and persists over time. An emitter manufactured to the (110) crystallographic plane and operating at high electron beam current and high temperature for about 20 hours to 40 hours results in the (110) plane, while initially not a high emission crystallographic orientation, developing into a very high field emission orientation because of the geometrical change. This geometrical change allows for a very high electric field and hence high on-axis electron emission.