公开(公告)号：US5741430A

公开(公告)日：1998-04-21

申请号：US638003

申请日：1996-04-25

Applicant: Donald William Dahringer ,  Alan Michael Lyons

Inventor： Donald William Dahringer ,  Alan Michael Lyons

IPC: C09J5/02 ,  C09J5/06 ,  C09J9/02 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38 ,  B44C1/22

CPC classification number: H05K3/0061 ,  C09J5/02 ,  H05K3/323 ,  H05K2201/023 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K3/321 ,  H05K3/382 ,  H05K3/383

Abstract: A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength of the bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.

Abstract translation: 一种用导电粘合剂将导电表面电连接和机械结合的方法，其中至少一个导电表面是易于形成不稳定氧化物的类型。 导电粘合剂具有预定量的导电颗粒。 导电粒子的刚性至少与组成导电表面的材料和形成在其上的任何氧化物一样硬。 该接合方法包括制备导电表面以在其上形成微观粗糙化的氧化物表面的步骤。 该方法还包括同时施加预定量的热和压力以固化导电表面导电粘合导电表面接头的步骤，使得导电粘合剂中的导电颗粒穿透氧化物以与其之下的导电表面直接接触 。 该方法控制键的机械强度和接合点的电气特性。 电气特性包括对高温和/或湿度条件的联合电阻率和接头灵敏度。

公开(公告)号：US5686703A

公开(公告)日：1997-11-11

申请号：US357416

申请日：1994-12-16

Applicant: Hiroaki Yamaguchi

Inventor： Hiroaki Yamaguchi

IPC: H01R4/04 ,  H05K3/32 ,  H05K1/02

CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K2201/023 ,  Y10T428/2857

Abstract: An anisotropic, electrically conductive adhesive film includes an insulating adhesive, electrically conductive particles dispersed in the electrically insulating adhesive, and transparent, spherical glass particles dispersed in the insulating adhesive.

Abstract translation: 各向异性导电粘合剂膜包括绝缘粘合剂，分散在电绝缘粘合剂中的导电颗粒和分散在绝缘粘合剂中的透明球形玻璃颗粒。

公开(公告)号：US5283949A

公开(公告)日：1994-02-08

申请号：US971079

申请日：1992-11-03

Applicant: Peter L. Jurisich

Inventor： Peter L. Jurisich

IPC: H05K1/03 ,  H05K3/04 ,  H05K3/10 ,  H05K3/14 ,  H05K3/38 ,  H05K3/02

CPC classification number: H05K3/04 ,  H05K1/0373 ,  H05K3/102 ,  H05K3/14 ,  H05K1/0306 ,  H05K2201/0215 ,  H05K2201/023 ,  H05K2201/0347 ,  H05K2201/09045 ,  H05K2201/2072 ,  H05K2203/025 ,  H05K2203/0271 ,  H05K2203/1344 ,  H05K3/386 ,  Y10T156/107 ,  Y10T29/49155

Abstract: Methods of producing a printed circuit board having a desired conductive pattern thereon provide the upper surface of a substrate board with raised portions having trenches therebetween. The raised portions, which define a desired conductive pattern, are then treated to form conductors thereon. In a first method, the resin used in the laminant forming the substrate board includes a hard particulate filler such as glass beads that are exposed at the raised portions of the substrate surface following grinding. Conductive metal is then welded onto the exposed filler to form a desired conductive layer over the raised portions. In a second method, the resin of the laminant forming the substrate board includes conductive metallic powder, such that burnishing of the raised portions forms conductors at the raised portions. In a third method, a conductive layer is laminated to the upper surface of the substrate board using adhesive and hot pressing, following which the unbonded portions of the conductive layer at the trenches are removed, such as by shot peening. The remaining portions of the conductive layer form the desired conductive pattern.

Abstract translation: 制造具有所需导电图案的印刷电路板的方法为衬底板的上表面提供了在其间具有沟槽的凸起部分。 然后将限定所需导电图案的隆起部分处理以在其上形成导体。 在第一种方法中，形成基板的层压体中使用的树脂包括在研磨后在基板表面的凸起部分露出的硬质颗粒填料如玻璃珠。 然后将导电金属焊接到暴露的填料上，以在凸起部分上形成所需的导电层。 在第二种方法中，形成基板的层压体的树脂包括导电金属粉末，使得凸起部分的抛光在凸起部分形成导体。 在第三种方法中，使用粘合剂和热压将导电层层压到基板的上表面，然后通过喷丸硬化等方式去除沟槽处的导电层的未结合部分。 导电层的剩余部分形成所需的导电图案。

公开(公告)号：US5155301A

公开(公告)日：1992-10-13

申请号：US567648

申请日：1990-08-15

Applicant: Akira Mase

Inventor： Akira Mase

IPC: H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/2036 ,  H05K3/361

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

公开(公告)号：US20230422405A1

公开(公告)日：2023-12-28

申请号：US18318267

申请日：2023-05-16

Applicant: SUPERC-TOUCH CORPORATION

Inventor： Hsiang-Yu LEE ,  Shang CHIN ,  Ping-Tsun LIN

IPC: H05K3/32 ,  H05K1/02

CPC classification number: H05K3/323 ,  H05K1/0278 ,  H05K1/028 ,  H05K2201/023 ,  H05K2201/0335 ,  H05K2201/095 ,  H05K2203/068

Abstract: A circuit structure for hot-press bonding includes a first substrate, a second substrate and a conductive adhesive layer. The circuit structure further includes a first conductive layer having a plurality of connection electrodes arranged on the first substrate, a second conductive layer including a plurality of backup electrodes respectively corresponding to the connection electrodes, an insulating layer arranged between the first conductive layer and the second conductive layer, and a plurality of conductive via arranged in the insulating layer and connected to corresponding connection electrodes and backup electrodes to provide current conduction paths therebetween, thus provide additional conduction path for the connection electrodes even the connection electrodes have fracture and enhance yield and connection reliability.

公开(公告)号：US09226406B2

公开(公告)日：2015-12-29

申请号：US13377998

申请日：2010-06-04

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC: B32B9/04 ,  H05K3/32 ,  C09J9/02 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K3/323 ,  C09J9/02 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0379 ,  Y10T156/10 ,  H01L2924/00

Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Abstract translation: 通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。 一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤 第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。 在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

公开(公告)号：US08470438B2

公开(公告)日：2013-06-25

申请号：US13139926

申请日：2010-06-04

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC: B32B5/16

CPC classification number: H05K3/323 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/361 ,  H05K2201/023 ,  H05K2203/104 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/268 ,  H01L2924/00 ,  H01L2224/0401

Abstract: There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

Abstract translation: 通过使用导电性粘合剂将各自包括作为防氧化膜的有机膜彼此连接的连接电极简化为生产工艺，提供了以低成本生产的高可靠性产生的高可靠性的连接结构。 其中第一连接电极2和第二连接电极10之间的导电粘合剂层9彼此连接的电极连接结构包括形成在至少第一连接电极上的有机膜6和11以及包含的导电颗粒8 颗粒的长轴在导电粘合剂层的厚度方向上定向，并且长轴的平均长度大于至少有机膜和导电粘合剂层的总厚度，其中导电颗粒刺穿有机物 并与第一连接电极和第二连接电极接触。

公开(公告)号：US20120085580A1

公开(公告)日：2012-04-12

申请号：US13377998

申请日：2010-06-04

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC: H01R4/00 ,  B23K1/00 ,  C09J9/02 ,  B32B37/12

CPC classification number: H05K3/323 ,  C09J9/02 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0379 ,  Y10T156/10 ,  H01L2924/00

Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Abstract translation: 通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。 一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤 第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。 在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

公开(公告)号：US06528343B1

公开(公告)日：2003-03-04

申请号：US09646711

申请日：2000-11-29

Applicant: Hiroshi Kikuchi ,  Yoshiyuki Kado ,  Ikuo Yoshida

Inventor： Hiroshi Kikuchi ,  Yoshiyuki Kado ,  Ikuo Yoshida

IPC: H01L2144

CPC classification number: H01L24/94 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/11 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/323 ,  H05K2201/023 ,  H05K2201/091 ,  H05K2201/10719 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Disclosed herein is a semiconductor device, which comprises a semiconductor chip including, over one main surface thereof, first wirings, protective films formed so as to cover other portions excluding parts of the first wirings, flexible layers respectively formed on the protective films so as to exclude the parts of the first wirings, and second wirings having first portions respectively electrically connected to the parts of the first wirings, and second portions respectively drawn onto the flexible layers; a wiring board having third wirings over one main surface thereof; and an adhesive comprising a large number of conductive particles contained in an insulative resin, and wherein the semiconductor chip is bonded to the wiring board with the adhesive interposed therebetween in a state in which the one main surface thereof is face to face with the one main surface of the wiring board, and the second portions of the second wirings are respectively electrically connected to the third wirings with some of the large number of conductive particles interposed therebetween.

Abstract translation: 这里公开了一种半导体器件，其包括在其一个主表面上包括第一布线的半导体芯片，形成为覆盖除了第一布线的部分以外的其它部分的保护膜，分别形成在保护膜上的柔性层，以便 排除第一布线的部分，第二布线具有分别电连接到第一布线的部分的第一部分和分别拉到柔性层上的第二部分; 布线板，其一个主表面上具有第三布线; 以及包含绝缘树脂中所含的大量导电性粒子的粘合剂，其中，所述半导体芯片在其一个主面与所述一个主体面对的状态下与所述配线基板接合， 布线板的表面和第二布线的第二部分分别电连接到第三布线，其中一些导电颗粒被插入其间。

公开(公告)号：US6101708A

公开(公告)日：2000-08-15

申请号：US859258

申请日：1997-05-20

Applicant: Akihiko Okano ,  Terutaka Okano

Inventor： Akihiko Okano ,  Terutaka Okano

IPC: H01R43/02 ,  G02F1/13 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/30

CPC classification number: H01R4/04 ,  H05K3/323 ,  G02F1/13452 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2203/0425 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connection terminal portion of a substrate and a terminal portion of an external circuit substrate or a terminal portion of a part are electrically connected together using an anisotropic electrically conducting film. A structure in which a first substrate having a connection terminal portion and a second substrate having a connection terminal portion or a connection terminal portion of a part are connected together with an anisotropic electrically conducting adhesive containing electrically conducting particles, wherein the thickness of the electrically conducting film provided for the connection terminal of the first substrate, the second substrate or the part is smaller than the diameter of the electrically conducting particles. The invention is further concerned with a method of accomplishing the electrical connection.

Abstract translation: 基板的连接端子部分和外部电路基板的端子部分或部分的端子部分使用各向异性导电膜电连接在一起。 一种结构，其中具有连接端子部分的第一基板和具有连接端子部分或部分的连接端子部分的第二基板与包含导电颗粒的各向异性导电粘合剂连接在一起，其中导电 提供给第一基板，第二基板或部分的连接端子的薄膜小于导电颗粒的直径。 本发明还涉及一种完成电连接的方法。