公开(公告)号：US4943334A

公开(公告)日：1990-07-24

申请号：US907863

申请日：1986-09-15

Applicant: Jonas Medney ,  Fred E. Klimpl

Inventor： Jonas Medney ,  Fred E. Klimpl

IPC: B32B15/08 ,  B29B15/10 ,  B29B15/12 ,  B29C53/56 ,  B29C53/58 ,  B29C53/76 ,  B29C53/80 ,  B29C70/06 ,  B29C70/10 ,  B29C70/16 ,  B29C70/20 ,  B29C70/34 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B5/12 ,  B32B5/28 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C70/202 ,  H05K1/0366 ,  H05K3/4626 ,  B29C2793/009 ,  B29C53/821 ,  B29L2031/3425 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  H05K3/0047 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.

Abstract translation: 通过在第一组横向缠绕第二组股线的情况下围绕扁平心轴缠绕第一组股线或细丝来生产无翘曲的层压体。 两组可以彼此垂直。 将长丝保持在可控制的张力下，同时用树脂浸渍并在随后的树脂固化期间。 为了允许形成无翘曲的产品，卷绕图案使得其形成关于中性轴或对称平面的镜像。 卷绕图案可以被选择成以预定图案提供间隙，允许冲孔或高速钻孔用于随后的印刷电路应用。

公开(公告)号：EP1206171A2

公开(公告)日：2002-05-15

申请号：EP01126238.3

申请日：2001-11-05

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Suzuki, Takeshi ,  Nishi, Toshihiro ,  Tomekawa, Satoru ,  Echigo, Fumio

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/094 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249953

Abstract: A circuit board includes an electrical insulator layer formed of a reinforcer sheet (101) with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes (104) provided in a high-density portion of the reinforcer sheet (101) are formed to have a smaller cross-section than the inner via holes (103) provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass cloth formed of warps (102b) and wefts (102a) is used for an insulator layer.

Abstract translation: 电路板包括：由其面内方向密度分布的加强片（101）形成的电绝缘体层，填充在电绝缘体层的厚度方向上的多个内部通孔中的电导体，以及 布线层连接到电导体。 设置在加强片（101）的高密度部分中的内部通孔（104）形成为具有比设置在加强片的低密度部分中的内部通孔（103）更小的横截面。 以这种方式，可以提供一种能够实现高密度布线的电路板和具有较小变化的内部通孔连接电阻，当包括在其面内方向上具有密度分布的增强片的基材 用于经线（102b）和纬纱（102a）形成的玻璃布用于绝缘体层。

公开(公告)号：EP0655183B1

公开(公告)日：1997-07-09

申请号：EP93917736.6

申请日：1993-08-03

Applicant: AMP-Akzo LinLam VOF

Inventor： MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

IPC: H05K3/46

CPC classification number: B32B37/12 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/0287

Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

公开(公告)号：EP0326577B1

公开(公告)日：1996-12-11

申请号：EP87907042.3

申请日：1987-09-10

Applicant: COMPOSITECH LTD.

Inventor： MEDNEY, Jonas ,  KLIMPL, Fred E.

IPC: B32B5/12 ,  B32B31/00 ,  B31C13/00 ,  H05K3/46

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C53/821 ,  B29C70/202 ,  B29C2793/009 ,  B29L2031/3425 ,  H05K1/0366 ,  H05K3/0047 ,  H05K3/4626 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments (34) about a flat mandrel with a second set of strands (36) being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings (106, 108, 110, 112, 114) for subsequent printed circuit applications.

公开(公告)号：EP0651696A1

公开(公告)日：1995-05-10

申请号：EP93915962.0

申请日：1993-07-20

Applicant: Akzo Nobel N.V.

Inventor： MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrick

IPC: B32B15 ,  B29C70 ,  B32B5 ,  B32B17 ,  B32B37 ,  H05K1 ,  H05K3

CPC classification number: B32B37/02 ,  B29C70/083 ,  B29C70/202 ,  B29C70/504 ,  B29K2105/0845 ,  B29K2105/108 ,  B29L2031/3425 ,  B32B37/1027 ,  B32B37/226 ,  B32B2305/10 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0287 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24074 ,  Y10T428/24132 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The invention relates to a method of manufacturing a composite laminate, preferably a cross-ply laminate, in which process unidirectionally oriented (UD) fibres (3) are provided with matrix material (7) and, together with a pre-formed non-flowing UD composite or cross-ply laminate, passed through a laminating zone (13) in layers of at least two different orientational directions. More particularly, the invention relates to the manufacture of composite material which is pre-eminently suited to be used as a supporting substrate for printed wire boards. The method according to the invention is directed in particular to the utilisation of a double belt press, both for making the pre-formed non-flowing UD composite and for the manufacture of the final laminate. The invention also comprises printed wire boards (PWBs) and multilayer PWBs.

公开(公告)号：JP2009164582A

公开(公告)日：2009-07-23

申请号：JP2008297101

申请日：2008-11-20

Applicant: C-Core Technologies Inc ,  シー−コア テクノロジーズ インコーポレイティド

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  H05K3/46 ,  B32B5/26 ,  B32B7/02 ,  B32B27/04 ,  B32B27/18 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: PROBLEM TO BE SOLVED: To provide prepregs, laminates, printed wiring board structures and materials and printed wiring boards that make it possible to construct printed wiring boards with improved thermal properties. SOLUTION: In one embodiment, prepregs 124 include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs 124 have substrate materials that include carbon. In other embodiments, the prepregs 124 include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates 120 and 122 that can act as ground and/or power planes. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供预浸料，层压板，印刷线路板结构和材料以及印刷线路板，使得可以构造具有改善的热性能的印刷线路板。 解决方案：在一个实施例中，预浸料124包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料124具有包括碳的基底材料。 在其它实施例中，预浸料124包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电源平面的导电和导热的层压板120和122。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2004515610A

公开(公告)日：2004-05-27

申请号：JP2002549457

申请日：2001-12-11

Applicant: シュリ ディクシャ コーポレイション

Inventor： イー． デービス，ウィリアム ,  ケー． バソヤ，カルー ,  エー． ボーナー，リチャード ,  エム． マングロリア，バラット

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: 熱特性が改良されたプリント配線板の構築を可能にするプリプレグ（１２４）、積層品（１２０、１２２）、プリント配線板構造及び材料及びプリント配線板を構築するための方法。 １実施形態においては、プリプレグは、導電性及び熱伝導性をもつ樹脂（１３２）で含浸された基材を含む。 その他の実施形態では、プリプレグは、炭素を含む基材材料を有する。 その他の実施形態では、プリプレグは、熱伝導性樹脂が含浸された基材を含む。 その他の実施形態では、プリント配線板構造は、グラウンド及び／又はパワー面として作用できる導電性及び熱伝導性をもつ積層品を含む。

公开(公告)号：KR1019960006294B1

公开(公告)日：1996-05-13

申请号：KR1019880700546

申请日：1987-09-10

Applicant: 캄퍼지테크리미티드

Inventor： 죠나스메드네이 ,  프레드이.클림플

IPC: B32B5/12

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C53/821 ,  B29C70/202 ,  B29C2793/009 ,  B29L2031/3425 ,  H05K1/0366 ,  H05K3/0047 ,  H05K3/4626 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments (34) about a flat mandrel with a second set of strands (36) being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings (106, 108, 110, 112, 114) for subsequent printed circuit applications.

公开(公告)号：KR1020170025415A

公开(公告)日：2017-03-08

申请号：KR1020150121826

申请日：2015-08-28

Applicant: 삼성전자주식회사

Inventor： 김진규 ,  이현 ,  김동한

IPC: H01L23/373 ,  H01L23/14

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: 본발명의기술적사상에의한기판은, 회로층; 및상기회로층과적층구조를형성하고, 제1 방향으로연장되는부직조(non-woven) 형태의제1 섬유(fiber)를포함하는섬유층;을포함할수 있다. 또한, 본발명의기술적사상에의한프리프레그(prepreg)는, 일방향으로연장되는중심축을가지는부직조형태의제1 섬유; 상기제1 섬유와이격되어배치되고, 직조형태를갖는복수의제2 섬유들; 및상기제1 섬유및 복수의제2 섬유들사이를채우는절연층;을포함할수 있다.

Abstract translation: 封装板包括包括电路层和纤维层的堆叠结构。 纤维层包括至少一个沿第一方向延伸并且是无纺纤维的第一纤维。 此外，预浸料坯包括作为无纺纤维的第一纤维; 与第一纤维间隔开并且是编织纤维的多个第二纤维; 以及填充第一纤维和多个第二纤维之间的间隙的绝缘层。

公开(公告)号：JPWO2008056500A1

公开(公告)日：2010-02-25

申请号：JP2008543015

申请日：2007-10-09

Applicant: 日本電気株式会社

Inventor： 俊亘 小勝 ,  俊亘 小勝

IPC: H05K3/46 ,  B32B5/12 ,  B32B9/00

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  H05K2201/09018 ,  H05K2203/302 ,  Y10T428/24917 ,  Y10T442/3065 ,  Y10T442/3195 ,  Y10T442/3236

Abstract: 携帯される電子機器の多層配線基板において、高強度であり、なおかつ従来構造よりも弾性変形領域が大きく柔軟性があり、曲面化が可能である多層配線基板を提供する。この多層配線基板は、1層以上の絶縁層を有する多層配線基板である。そして、該基板の少なくとも1層の絶縁層が、面内方向成分の機械特性が異方性を示す材料で構成されている。