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公开(公告)号：JP2009164582A
公开(公告)日：2009-07-23
申请号：JP2008297101
申请日：2008-11-20
Applicant: C-Core Technologies Inc , シー−コア テクノロジーズ インコーポレイティド
Inventor： VASOYA KALU K , MANGROLIA BHARAT M , DAVIS WILLIAM E , BOHNER RICHARD A
IPC: C08J5/24 , H05K3/46 , B32B5/26 , B32B7/02 , B32B27/04 , B32B27/18 , C08K3/38 , C08K9/08 , H05K1/02 , H05K1/03 , H05K3/42 , H05K3/44
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: PROBLEM TO BE SOLVED: To provide prepregs, laminates, printed wiring board structures and materials and printed wiring boards that make it possible to construct printed wiring boards with improved thermal properties. SOLUTION: In one embodiment, prepregs 124 include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs 124 have substrate materials that include carbon. In other embodiments, the prepregs 124 include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates 120 and 122 that can act as ground and/or power planes. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供预浸料，层压板，印刷线路板结构和材料以及印刷线路板，使得可以构造具有改善的热性能的印刷线路板。 解决方案：在一个实施例中，预浸料124包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料124具有包括碳的基底材料。 在其它实施例中，预浸料124包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电源平面的导电和导热的层压板120和122。 版权所有（C）2009，JPO＆INPIT
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2.发明专利含有已含浸導熱樹脂之基材的預漬體,包含該預漬體之積層板,包含該積層板之印刷線路板以及構成該預漬體,積層板及印刷線路板的方法(二) A PREPREG COMPRISING A SUBSTRATE IMPREGNATED WITH A THERMALLY CONDUCTIVE RESIN, A LAMINATE COMPRISING THE PREPREG, A PRINTED WIRING BOARD COMPRISING THE LAMINATE, AND METHODS OF CONSTRUCTING THE PREPREG, THE LAMINATE AND THE PRINTED WIRING BOARD 审中-公开含有已含浸导热树脂之基材的预渍体,包含该预渍体之积层板,包含该积层板之印刷线路板以及构成该预渍体,积层板及印刷线路板的方法(二) A PREPREG COMPRISING A SUBSTRATE IMPREGNATED WITH A THERMALLY CONDUCTIVE RESIN, A LAMINATE COMPRISING THE PREPREG, A PRINTED WIRING BOARD COMPRISING THE LAMINATE, AND METHODS OF CONSTRUCTING THE PREPREG, THE LAMINATE AND THE PRINTED WIRING BOARD
公开(公告)号：TW200927803A
公开(公告)日：2009-07-01
申请号：TW098105098
申请日：2001-12-12
Applicant: C 核心科技股份有限公司 C-CORE TECHNOLOGIES, INC.
Inventor： 瓦蘇亞 卡魯K VASOYA, KALU K. , 戴維斯 威廉E DAVIS, WILLIAM E. , 曼哥里拉 布哈拉特M MANGROLIA, BHARAT M. , 柏納 理查A BOHNER, RICHARD A.
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: 用於構成可以使印刷線路板的構成改善熱性質之材料與印刷線路板的預漬體、積層板、印刷線路板結構與方法。在一實施例中,該些預漬體含有含浸導電且導熱的樹脂之基材。在其他的實施例中,該些預漬體含有包含碳之基材材料。在其它的實施例中,該些預漬體含有含浸導熱的樹脂之基材。在其它的實施例中,該印刷線路板結構包含可以作為接地及/或電力平面的導電且導熱的積層板。
Abstract in simplified Chinese: 用于构成可以使印刷线路板的构成改善热性质之材料与印刷线路板的预渍体、积层板、印刷线路板结构与方法。在一实施例中,该些预渍体含有含浸导电且导热的树脂之基材。在其他的实施例中,该些预渍体含有包含碳之基材材料。在其它的实施例中,该些预渍体含有含浸导热的树脂之基材。在其它的实施例中,该印刷线路板结构包含可以作为接地及/或电力平面的导电且导热的积层板。
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3.发明申请MANUFACTURING PROCESS: HOW TO CONSTRUCT CONSTRAINING CORE MATERIAL INTO PRINTED WIRING BOARD 审中-公开制造工艺：如何将约束核心材料构建成印刷线路板
公开(公告)号：WO2006099554A2
公开(公告)日：2006-09-21
申请号：PCT/US2006/009597
申请日：2006-03-15
Applicant: C-CORE TECHNOLOGIES, INC. , VASOYA, Kalu, K.
Inventor： VASOYA, Kalu, K.
CPC classification number: H05K3/4641 , H05K1/0269 , H05K3/0008 , H05K3/0047 , H05K3/0082 , H05K3/064 , H05K3/4638 , H05K2201/0281 , H05K2201/029 , H05K2201/0323 , H05K2201/068 , H05K2201/09063 , H05K2201/0969 , H05K2201/09718 , H05K2203/056 , H05K2203/166 , H05K2203/167 , Y10T156/1062
Abstract: Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring 'boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.
Abstract translation: 公开了用于制造包括导电约束芯的印刷线路板的工艺。 几个过程使得工具使用的工具孔能够精确地对准用于对用于形成成品印刷线路板的各种面板和子组件进行处理。 还讨论了对Gerber文件的修改，可以提高制造成本并提供检测印刷线路板的面板阵列中的有缺陷的印刷线路板的能力。 本发明的一个实施例包括使用至少一对参考物并使导电材料面板中的工具孔对准编织的导电材料编织板相对于工具表面的织物。
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Patent Agency Ranking4.发明申请
公开(公告)号：WO2005117508A3
公开(公告)日：2005-12-08
申请号：PCT/US2005/017150
申请日：2005-05-16
Applicant: C-CORE TECHNOLOGIES, INC. , VASOYA, Kalu, K.
Inventor： VASOYA, Kalu, K.
Abstract: Printed wiring boards (100) and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores (106) having at least one resin filled channel (116, 118). The resin filled channels perform a variety of functions that can be associated with electrical isolation and increased manufacturing yields.
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公开(公告)号：WO2006024009A2
公开(公告)日：2006-03-02
申请号：PCT/US2005/030277
申请日：2005-08-24
Applicant: C-CORE TECHNOLOGIES, INC. , VASOYA, Kalu, K. , MANGROLIA, Bharat, M. , ROY, Don
Inventor： VASOYA, Kalu, K. , MANGROLIA, Bharat, M. , ROY, Don
IPC: H01B3/47
CPC classification number: H05K9/0039 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/16152 , H05K1/0206 , H05K1/0207 , H05K1/0209 , H05K1/0366 , H05K1/0373 , H05K3/403 , H05K3/4641 , H05K2201/0209 , H05K2201/0281 , H05K2201/0323 , H05K2201/0919 , H01L2224/0401
Abstract: Printed wiring board assemblies are described that include printed wiring boards having at least one thermally conductive plane. In addition, the printed wiring boards can also include edge plating on at least a portion of an edge of the printed wiring board. The printed wiring boards can also include heat spreaders, heat sinks and/or thermally conductive heat paths to dissipate heat from the printed wiring board assembly. In many instances, the heat spreaders include microfoils. In one embodiment, the invention includes at least one circuit layer, at least one dielectric layer, at least one thermally conductive plane and edge plating that conducts the at least one thermally conductive plane.
Abstract translation: 描述了印刷线路板组件，其包括具有至少一个导热平面的印刷线路板。 此外，印刷电路板还可以包括在印刷线路板的边缘的至少一部分上的边缘电镀。 印刷线路板还可以包括散热器，散热器和/或导热热路径，以从印刷线路板组件散发热量。 在许多情况下，散热器包括微型薄片。 在一个实施例中，本发明包括至少一个电路层，至少一个介电层，至少一个导热平面和边缘电镀，其传导至少一个导热平面。
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6.发明公开PRINTED WIRING BOARD WITH CONDUCTIVE CONSTRAINING CORE INCLUDING RESIN FILLED CHANNELS 审中-公开用树脂填充的通道导电性支撑芯电路板
公开(公告)号：EP1754398A2
公开(公告)日：2007-02-21
申请号：EP05763696.1
申请日：2005-05-16
Applicant: C-Core Technologies Inc.
Inventor： Vasoya, Kalu K.
CPC classification number: H05K3/4641 , H05K1/115 , H05K3/0005 , H05K3/0047 , H05K3/429 , H05K3/445 , H05K3/4638 , H05K2201/0281 , H05K2201/0323 , H05K2201/068 , H05K2201/09236 , H05K2201/09636 , H05K2201/09663 , H05K2201/0969 , H05K2201/09718 , Y10T29/49156 , Y10T29/49165
Abstract: Printed wiring boards (100) and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores (106) having at least one resin filled channel (116, 118). The resin filled channels perform a variety of functions that can be associated with electrical isolation and increased manufacturing yields.
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7.发明公开MANUFACTURING PROCESS: HOW TO CONSTRUCT CONSTRAINING CORE MATERIAL INTO PRINTED WIRING BOARD 审中-公开方法：支持核材料的印刷电路板安装
公开(公告)号：EP1862040A2
公开(公告)日：2007-12-05
申请号：EP06738633.4
申请日：2006-03-15
Applicant: C-Core Technologies Inc.
Inventor： VASOYA, Kalu, K.
CPC classification number: H05K3/4641 , H05K1/0269 , H05K3/0008 , H05K3/0047 , H05K3/0082 , H05K3/064 , H05K3/4638 , H05K2201/0281 , H05K2201/029 , H05K2201/0323 , H05K2201/068 , H05K2201/09063 , H05K2201/0969 , H05K2201/09718 , H05K2203/056 , H05K2203/166 , H05K2203/167 , Y10T156/1062
Abstract: Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring 'boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.
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公开(公告)号：EP1360067B1
公开(公告)日：2007-02-21
申请号：EP01990176.8
申请日：2001-12-11
Applicant: C-Core Technologies Inc.
Inventor： VASOYA, Kalu, K. , MANGROLIA, Bharat, M. , DAVIS, William, E. , BOHNER, Richard, A.
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs (124), laminates (120, 122), printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins (132). In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
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