公开(公告)号：WO2009016450A2

公开(公告)日：2009-02-05

申请号：PCT/IB2008001888

申请日：2008-07-14

Applicant: ST MICROELECTRONICS ROUSSET ,  STEFFEN FRANCIS ,  ASSAUD GILBERT

Inventor： STEFFEN FRANCIS ,  ASSAUD GILBERT

CPC classification number: H05K1/028 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17559 ,  G06K19/0739 ,  G06K19/07798 ,  H05K1/0283 ,  H05K1/0313 ,  H05K1/118 ,  H05K1/181 ,  H05K3/20 ,  H05K3/30 ,  H05K2201/10007 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: The invention relates to a circuit (1) including a flexible substrate (2) and at least one electric member (3) connected to the substrate. According to the invention, the substrate includes at least one cavity (4a) provided in the vicinity of the electric member and promoting a breakage or a deformation of the electric member in response to a flexion or a stretching of the substrate. The invention is particularly useful for producing tear-protected electronic micro-modules.

Abstract translation: 本发明涉及一种包括柔性基板（2）和连接到基板的至少一个电气部件（3）的电路（1）。 根据本发明，基板包括设置在电气部件附近的至少一个空腔（4a），并且响应于基板的弯曲或拉伸而促进电气部件的断裂或变形。 本发明对于生产防撕裂电子微型模块特别有用。

公开(公告)号：EP3016488A1

公开(公告)日：2016-05-04

申请号：EP15191409.0

申请日：2015-10-26

Applicant: KONE Corporation

Inventor： Raassina, Pasi

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/181 ,  H05K7/209 ,  H05K7/20909 ,  H05K13/00 ,  H05K2201/10007

Abstract: The invention concerns a drive unit (22) for driving a motor. the drive unit has a component assembly (1A, 1B) comprising a main circuit board (2) having a component side (2A) and a solder side (2B), one or more main circuit conductors (4A, 4B) formed in at least one layer of the main circuit board, a power component module (5) including one or more power components (6A, 6B), the power component module (5) having electrical connection terminals (8) for connecting the power component(s) (6A, 6B) to the one or more main circuit conductors (4A, 4B) of the main circuit board (2) and a cooling plate (9) coupled to the power component(s) (6A, 6B) in a manner enabling transfer of heat from the power component(s) (6A, 6B) to the cooling plate (9). The power component module (5) is mounted to the component side (2A) of the main circuit board (2). The component assembly (1A, 1B) further comprises a heat sink (10) mounted on the cooling plate (9) and a fan (11) mounted on the heat sink (10).

Abstract translation: 本发明涉及用于驱动马达的驱动单元（22）。 驱动单元具有包括具有元件侧（2A）和焊料侧（2B）的主电路板（2）的组件组件（1A，1B），至少形成有一个或多个主电路导体（4A，4B） 主电路板的一层，包括一个或多个功率部件（6A，6B）的功率部件模块（5），所述功率部件模块（5）具有用于连接所述功率部件的电连接端子（8） （6A，6B）连接到主电路板（2）的一个或多个主电路导体（4A，4B）和以能够转移的方式耦合到功率部件（6A，6B）的冷却板（9） 的功率部件（6A，6B）到冷却板（9）的热量。 功率元件模块（5）安装在主电路板（2）的元件侧（2A）上。 组件组件（1A，1B）还包括安装在冷却板（9）上的散热器（10）和安装在散热器（10）上的风扇（11）。

公开(公告)号：EP2997524A1

公开(公告)日：2016-03-23

申请号：EP14723707.7

申请日：2014-04-29

Applicant: Giesecke & Devrient GmbH

Inventor： TARANTINO, Thomas

IPC: G06K19/077 ,  B29C67/00 ,  H05K1/00 ,  H05K3/00

CPC classification number: H05K1/186 ,  G06K19/07718 ,  G06K19/07722 ,  G06K19/07732 ,  G06K19/07747 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/14 ,  H05K3/202 ,  H05K3/32 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/033

Abstract: The invention relates to a method for producing a portable data carrier, for example a chip card. The method is characterized in that a spatial structure (6) is printed onto a first foil (2). Electrically conductive lines (12) are first applied to the structure (6), by spraying or casting for example, and components (14), such as a chip and an antenna coil for example, are then inserted into the structure (6), said structure (6) corresponding to the dimensions or the shape and size of the inserted components (14). In the process, the components (14) are connected to the lines (12) in an electrically conductive manner. A cover (16) is printed over the components (14). A second foil (18) can be applied onto the cover (16), and a printed design (4, 20) can be applied onto the two foils (2, 18). Additionally, a recess can be introduced into the structure (6) and the foils (2, 18) in order to insert a chip module (22) for example.

Abstract translation: 制造便携式数据载体的方法包括印刷在第一箔上的空间结构。 首先施加导电线，然后将部件插入结构中，其中该结构对应于插入部件的尺寸或形状和尺寸。 这些部件与其中的线路导电连接。 在组件上打印一个盖子。 第二箔可以应用于盖，其中设计印刷可以应用于两个箔。 为了插入芯片模块，可以在结构和箔中并入间隙。

公开(公告)号：EP2290682A3

公开(公告)日：2011-10-05

申请号：EP10193431.3

申请日：2006-12-12

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Yamano, Takaharu ,  Ilzuka, Hajime ,  Sakaguchi, Hideaki ,  Kobayashi, Toshio ,  Arai, Tadashi ,  Kobayashi, Tsuyoshi ,  Koyama, Tetsuya ,  IIda, Kiyoaki ,  Mashima, Tomoaki ,  Tanaka, Koichi ,  Kunimoto, Yuji ,  Yanagisawa, Takashi

IPC: H01L23/498 ,  H01L23/552 ,  H01L21/56 ,  H01L25/10 ,  H01L25/16

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A method of producing a substrate (300) with an embedded chip (110) is disclosed. This method comprises a first step of mounting a semiconductor chip (110) on a first substrate (100A) on which a first wiring (103A,103B)) is formed; and a second step of joining the first substrate (100A) with a second substrate (200) on which a second wiring (203A,203B) is formed. In the second step, the semiconductor chip (110) is encapsulated between the first substrate (100A) and the second substrate (200) and electrical connection is made between the first wiring (103A) and the second wiring (203B) so as to form multilayered wirings connected to the semiconductor chip (110). The encapsulation may occur by injection moulding. The first and second substrates (100A,200) may contain an electromagnetic shield layer (100P,200P).

Abstract translation: 制造芯片嵌入衬底的方法是游离缺失盘。 该方法包括安装在其上的第一布线形成在第一基板的半导体芯片的第一工序; 和与在其上的第二布线上形成的第二基板接合所述第一基片的第二步骤。 在第二个步骤中，半导体芯片被封装在第一基板和第二基板和电连接之间，在第一布线和第二布线之间形成，以形成连接到半导体芯片的多层布线。

公开(公告)号：EP2171652B1

公开(公告)日：2011-05-11

申请号：EP08776376.9

申请日：2008-07-14

Applicant: STMicroelectronics (Rousset) SAS

Inventor： STEFFEN, Francis ,  ASSAUD, Gilbert

IPC: B41J2/05

CPC classification number: H05K1/028 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17559 ,  G06K19/0739 ,  G06K19/07798 ,  H05K1/0283 ,  H05K1/0313 ,  H05K1/118 ,  H05K1/181 ,  H05K3/20 ,  H05K3/30 ,  H05K2201/10007 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: The invention relates to a circuit (1) including a flexible substrate (2) and at least one electric member (3) connected to the substrate. According to the invention, the substrate includes at least one cavity (4a) provided in the vicinity of the electric member and promoting a breakage or a deformation of the electric member in response to a flexion or a stretching of the substrate. The invention is particularly useful for producing tear-protected electronic micro-modules.

公开(公告)号：EP3043382B1

公开(公告)日：2017-08-02

申请号：EP15200529.4

申请日：2015-12-16

Applicant: Delphi Technologies, Inc.

Inventor： ZIMMERMAN, David W. ,  SEARCY, James F. ,  DELHEIMER, Charles I.

IPC: H05K1/14 ,  H05K1/02 ,  H01Q21/06 ,  H01L23/66 ,  H05K1/18 ,  H05K3/36 ,  H01P5/02

CPC classification number: H01Q1/50 ,  H01L23/66 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q21/065 ,  H05K1/02 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/184 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10007 ,  H05K2201/10098 ,  H05K2203/049 ,  H01L2924/00

公开(公告)号：EP2897216B1

公开(公告)日：2017-06-21

申请号：EP15150542.7

申请日：2015-01-08

Applicant: Honeywell International Inc.

Inventor： Wang, Nan ,  Nyhus, Orville ,  Wang, Chao

IPC: H01P3/08 ,  H01P5/08

CPC classification number: H05K1/144 ,  H01L2224/00 ,  H01P3/084 ,  H01Q1/002 ,  H01Q1/246 ,  H01Q1/50 ,  H01Q21/0081 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K3/10 ,  H05K3/46 ,  H05K2201/10007 ,  Y10T29/49126 ,  Y10T29/49155

公开(公告)号：EP2897216A1

公开(公告)日：2015-07-22

申请号：EP15150542.7

申请日：2015-01-08

Applicant: Honeywell International Inc.

Inventor： Wang, Nan ,  Nyhus, Orville ,  Wang, Chao

IPC: H01P3/08 ,  H01P5/08

CPC classification number: H05K1/144 ,  H01L2224/00 ,  H01P3/084 ,  H01Q1/002 ,  H01Q1/246 ,  H01Q1/50 ,  H01Q21/0081 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K3/10 ,  H05K3/46 ,  H05K2201/10007 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: Systems and methods for a feeding structure for an antenna array are provided. In at least one embodiment, the feeding structure for an antenna array comprises one or more circuit boards with one or more circuits formed thereon, one or more conductive layers wherein the one or more circuit boards are mounted to the one or more conductive layers, and one or more connectors coupled to the one or more circuits through an opening in the one or more conductive layers. Furthermore, the one or more conductive layers are separated by a dielectric from the one or more circuits and the one or more conductive layers contact the one or more circuit boards such that the one or more circuits are isolated from the one or more conductive layers.

Abstract translation: 提供了一种用于天线阵列馈电结构的系统和方法。 在至少一个实施例中，天线阵列的馈电结构包括一个或多个电路板，其上形成有一个或多个电路，一个或多个导电层，其中一个或多个电路板安装到一个或多个导电层，以及 一个或多个连接器，通过所述一个或多个导电层中的开口耦合到所述一个或多个电路。 此外，所述一个或多个导电层由电介质与所述一个或多个电路隔开，并且所述一个或多个导电层接触所述一个或多个电路板，使得所述一个或多个电路与所述一个或多个导电层隔离。

公开(公告)号：EP1962342A1

公开(公告)日：2008-08-27

申请号：EP06834519.8

申请日：2006-12-12

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： YAMANO, Takaharu ,  IIZUKA, Hajime ,  SAKAGUCHI, Hideaki ,  KOBAYASHI, Toshio ,  ARAI, Tadashi ,  KOBAYASHI, Tsuyoshi ,  KOYAMA, Tetsuya ,  IIDA, Kiyoaki ,  MASHIMA, Tomoaki ,  TANAKA, Koichi ,  KUNIMOTO, Yuji ,  YANAGISAWA, Takashi

IPC: H01L23/12 ,  H01L23/52 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/14 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

公开(公告)号：JPWO2014171225A1

公开(公告)日：2017-02-16

申请号：JP2015512354

申请日：2014-03-10

Applicant: 株式会社村田製作所

Inventor： 清文 高井 ,  清文 高井 ,  秀典 帯屋 ,  秀典 帯屋 ,  伸也 人見 ,  伸也 人見

IPC: H04B1/40 ,  H01L23/12 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/02

CPC classification number: H05K1/147 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/10007 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: 寄生インダクタンスや寄生容量による影響が無い状態で所望の周波数特性が得られるようにフィルタ回路部品を搭載することができると共に、部品集積度の向上を図ることができる技術を提供する。実装用電極108aに接続されたフィルタ回路部品109の接地用端子109aがビア導体105a,106aにより最短距離で接地用電極103に接続されているので、不要な寄生インダクタンスや寄生容量が生じるのを抑制することができる。したがって、寄生インダクタンスや寄生容量による影響が無い状態で所望の周波数特性が得られるようにフィルタ回路部品109を高周波部品100に搭載することができる。また、支持枠体101の内周面に囲まれる内側の空間に部品3を配置することができるので、部品集積度の向上を図ることができる。

Abstract translation: 与寄生电感的期望的频率特性和受寄生电容的情况下可以安装一个过滤器的电路部件，以便获得，以提供能够提高元件集成度的技术。 接地端子109A是一个通过连接到所述安装电极108a中的滤波器电路组件109的导体105A，因为它是由106A连接到接地电极103以最短距离，防止不想要的寄生电感，并且产生的寄生电容 它可以。 因此，寄生电感和所期望的状态，以没有滤波器电路组件109的寄生电容的影响，从而能够得到频率特性可被安装到该高频成分100。 此外，也能够由支撑框架101的内周面包围的放置部3的空间的内部，所以能够提高部件的集成。