公开(公告)号：US20010044198A1

公开(公告)日：2001-11-22

申请号：US09847607

申请日：2001-05-02

Inventor： Tomohiro Kawashima

IPC: H01L021/44 ,  H01L023/48

CPC classification number: H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/68377 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H05K3/062 ,  H05K3/3436 ,  H05K2201/0338 ,  H05K2201/1025 ,  H05K2201/10977 ,  H05K2203/0384 ,  Y02P70/613

Abstract: First, there are prepared a semiconductor chip with a group of solder bumps disposed on and joined to a surface thereof in a predetermined pattern, and a multilayer plate including a second layer as an electrically conductive layer and first and third layers disposed on respective opposite surfaces of the second layer and comprising metal layers of one metal. Then, the first layer and the third layer of the multilayer plate are etched in a predetermined pattern to form a first group of posts and a second group of posts which have a pattern identical to the pattern of the group of solder bumps. Then, semiconductor chip is positioned to hold the solder bumps in contact with the posts of the first group, and the solder bumps are melted to join the solder bumps to the posts of the first group. Thereafter, the second layer is cut between the posts of the first and second groups, producing separate multilayer posts.

Abstract translation: 首先，准备具有以规定图案配置在其表面上并与其接合的一组焊料凸块的半导体芯片，以及包括作为导电层的第二层的多层板和设置在相应的相对表面上的第一和第三层 的第二层并且包括一种金属的金属层。 然后，以预定图案蚀刻多层板的第一层和第三层，以形成具有与该组焊料组的图案相同的图案的第一组柱和第二组柱。 然后，将半导体芯片定位成保持与第一组的柱接触的焊料凸块，并且焊料凸块熔化以将焊料凸块接合到第一组的柱。 此后，在第一组和第二组的柱之间切割第二层，产生单独的多层柱。

公开(公告)号：US06281041B1

公开(公告)日：2001-08-28

申请号：US09450545

申请日：1999-11-30

Applicant: Chung W Ho ,  Tsing-Chow Wang

Inventor： Chung W Ho ,  Tsing-Chow Wang

IPC: H01L2144

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13583 ,  H01L2224/136 ,  H01L2224/13647 ,  H01L2224/13671 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/1025 ,  H05K2201/2081 ,  H05K2203/0315 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.

Abstract translation: 在用于形成在微电子制造中使用的焊料互连结构的方法中，首先提供了在接合焊盘之上形成的衬底。 然后在接合焊盘上形成第一焊料互连层。 然后在第一焊料互连层上形成不覆盖第一焊料互连层的上部圆顶部分的环形焊料不可湿性氧化铜层。 然后形成在第一焊料互连层的上部圆顶部分上，而不是在环形焊料不可湿性氧化铜层上形成第二焊料互连层。

公开(公告)号：US06253986B1

公开(公告)日：2001-07-03

申请号：US09400784

申请日：1999-09-22

Applicant: Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

Inventor： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC: B23K3514

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Abstract translation: 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

公开(公告)号：US5010388A

公开(公告)日：1991-04-23

申请号：US212944

申请日：1988-06-28

Applicant: Akira Sasame ,  Hitoyuki Sakanoue ,  Hisao Takeuchi ,  Masaya Miyake ,  Akira Yamakawa ,  Yasuhisa Yushio ,  Hitoshi Akazawa

Inventor： Akira Sasame ,  Hitoyuki Sakanoue ,  Hisao Takeuchi ,  Masaya Miyake ,  Akira Yamakawa ,  Yasuhisa Yushio ,  Hitoshi Akazawa

IPC: H01L21/48 ,  H01L23/10 ,  H01L23/495 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K3/246 ,  H05K3/3421 ,  Y10T428/12576

Abstract: A connection structure between lead frames and a base plate of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus, has a base plate made of a sintered body of aluminum nitride on which a semiconductor device is to be mounted. The lead frames are made of iron alloy containing nickel in 29 wt. % and cobalt in 17 wt. %. A silver solder is used for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is clad with a stress relief layer of oxygen-free copper of a high plastic deformability to relieve, by its plastic deformation, a thermal stress caused by a difference between a thermal expansion coefficient of the aluminum nitride base plate and that of the lead frame in a cooling process at the time of soldering. Preferably, only a portion of each lead frame to be joined to the base plate comprises an inner layer of an iron alloy containing 29 wt. % of nickel and 17 wt. % of cobalt, and an outer layer portion of oxygen-free copper.

公开(公告)号：US3205299A

公开(公告)日：1965-09-07

申请号：US9312961

申请日：1961-03-03

Applicant: HI SHEAR CORP

Inventor： DICKIE WILLIAM R

IPC: H01R4/04 ,  H05K3/32

CPC classification number: H05K3/321 ,  H01R4/04 ,  H05K2201/0355 ,  H05K2201/1025

公开(公告)号：US12041406B2

公开(公告)日：2024-07-16

申请号：US17605821

申请日：2020-04-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Qingqiu Liu ,  Baoxia Li ,  Lin Lu ,  Guofei Diao

IPC: H04R1/10 ,  H02J7/00 ,  H05K1/14

CPC classification number: H04R1/1025 ,  H02J7/0029 ,  H02J7/0042 ,  H04R1/1016 ,  H04R1/1041 ,  H04R1/1058 ,  H05K1/148 ,  H04R2420/07 ,  H05K2201/1025

Abstract: A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.

公开(公告)号：US20140138821A1

公开(公告)日：2014-05-22

申请号：US14164908

申请日：2014-01-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hueng Jae OH ,  Tae Joon CHUNG ,  Dong Gyu LEE ,  Seon Jae MUN ,  Jin Won CHOI

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract translation: 这里公开了用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US20130333935A1

公开(公告)日：2013-12-19

申请号：US13527180

申请日：2012-06-19

Applicant: Stephen Gonya ,  Jim Patterson ,  Kenn Twigg

Inventor： Stephen Gonya ,  Jim Patterson ,  Kenn Twigg

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0061 ,  H05K2201/1025

Abstract: A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.

Abstract translation: 公开了一种用于在基板和框架之间形成框架安装互连的方法。 该方法可以包括将复合材料（例如，环氧玻璃预浸料坯）施加到基材的表面。 复合材料可以具有设置成基本上与衬底的表面上的相应衬垫对准的一个或多个孔。 金属盘被放置在复合材料的每个孔中，在相应的垫的顶部。 框架构件可以放置在复合材料和金属盘的顶部上。 框架构件可以具有设置成基本上与金属盘对准的一个或多个垫。 衬底，复合材料，金属盘和框架组合可以在可包括真空和预定温度的受控气氛中固化，以在相邻焊盘之间形成离散的电连接，但是每个密封和电隔离。

公开(公告)号：US20090195933A1

公开(公告)日：2009-08-06

申请号：US12361233

申请日：2009-01-28

Applicant: Takuma Kido ,  Atsushi Koga ,  Satoshi Emoto ,  Kenrou Yamamoto ,  Takeshi Ohwe

Inventor： Takuma Kido ,  Atsushi Koga ,  Satoshi Emoto ,  Kenrou Yamamoto ,  Takeshi Ohwe

IPC: G11B5/48

CPC classification number: G11B5/4826 ,  G11B5/455 ,  G11B5/4853 ,  H05K3/305 ,  H05K3/326 ,  H05K3/3442 ,  H05K3/4015 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/1025 ,  H05K2201/10727 ,  Y02P70/613

Abstract: A head assembly for writing or reading information to or from a recording medium. The head assembly includes a suspension having an electrode pad; a mounting member placed on the suspension; a head mounted on the mounting member and having an electrode, for writing or reading information; and a first bonding member made of a hot-melt adhesive and fixing the electrode to the electrode pad.

Abstract translation: 用于向或从记录介质读取信息的头组件。 头组件包括具有电极垫的悬架; 放置在悬架上的安装构件; 安装在所述安装构件上并具有用于写入或读取信息的电极的头部; 以及由热熔粘合剂制成的第一粘接部件，并将该电极固定在电极焊盘上。

公开(公告)号：US07442878B2

公开(公告)日：2008-10-28

申请号：US11538823

申请日：2006-10-05

Applicant: William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

Inventor： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

IPC: H05K1/16

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。