-
31.发明申请公开(公告)号：US20150003020A1
公开(公告)日：2015-01-01
申请号：US14490425
申请日：2014-09-18
Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Chang HONG , Kwang Seop YOUM , Bong Kyu CHOI
CPC classification number: H05K1/0203 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05548 , H01L2224/05569 , H01L2224/12105 , H01L2224/24227 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K1/0207 , H05K1/111 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/1028 , H05K2201/10439 , H05K2201/10674 , Y10T29/4913 , H01L2924/00 , H01L2224/05599
Abstract: An electronic component-embedded printed circuit board includes: a core substrate having a cavity; an electronic component in the cavity; an inner circuit layer formed on the core substrate; a cooling member provided on the first surface of the core substrate at a position over the cavity; and an outer insulating layer on the core substrate. In one embodiment, the cooling member is covering over a portion of the outer surface of the inner circuit layer, and is adhered to the electronic component and to the outer surface of the inner circuit layer through a conductive material.
Abstract translation: 电子元件嵌入式印刷电路板包括：具有空腔的芯基板; 空腔中的电子部件; 形成在所述芯基板上的内电路层; 设置在所述芯基板的所述第一表面上的空腔上方的位置的冷却部件; 和芯基板上的外绝缘层。 在一个实施例中，冷却构件覆盖在内部电路层的外表面的一部分上，并且通过导电材料粘附到电子部件和内部电路层的外表面。
-
公开(公告)号：US20130170147A1
公开(公告)日：2013-07-04
申请号：US13339817
申请日：2011-12-29
Applicant: Thong Dang , Mohsen Haji-Rahim , Mark Charles Held
Inventor： Thong Dang , Mohsen Haji-Rahim , Mark Charles Held
CPC classification number: H05K1/111 , H01L23/3135 , H01L23/3171 , H01L23/552 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/97 , H01L2224/24051 , H01L2224/24226 , H01L2224/245 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8201 , H01L2224/82031 , H01L2224/82101 , H01L2224/82136 , H01L2224/92244 , H01L2224/97 , H01L2924/1421 , H01L2924/1434 , H01L2924/1443 , H01L2924/1461 , H01L2924/15159 , H01L2924/15787 , H01L2924/19105 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0715 , H05K2201/10439 , Y10T29/49016 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82 , H01L2924/014 , H01L2924/00
Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.
Abstract translation: 在一个实施例中，屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。
-
33.发明申请METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD 有权制造陶瓷电子元件，陶瓷电子元器件和接线板的方法公开(公告)号：US20120018205A1
公开(公告)日：2012-01-26
申请号：US13184607
申请日：2011-07-18
Applicant: Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
Inventor： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
CPC classification number: H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。
-
公开(公告)号：JP2018186214A
公开(公告)日：2018-11-22
申请号：JP2017087983
申请日：2017-04-27
Applicant: セイコーエプソン株式会社
CPC classification number: H05K1/0283 , G01B7/20 , H05K1/181 , H05K1/189 , H05K2201/10151 , H05K2201/10439 , H05K2201/2009
Abstract: 【課題】配線となる伸縮性導電膜が被覆部の外周で分断されるのを抑制できる伸縮性回路基板を提供する。 【解決手段】伸縮性基板2と、伸縮性基板2の一方の面に設置され、第1方向6に長い伸縮性導電膜5と、伸縮性基板2の一方の面に設置されている電気素子8と、伸縮性導電膜5の一部及び電気素子8の少なくとも一部を覆う被覆部9と、を備え、伸縮性導電膜5における被覆部9の外周に沿う断面である第1断面11の面積を第1面積とし、被覆部9の外周より外側に離れた場所の伸縮性導電膜5の第1方向6と直交する断面である第2断面12の面積を第2面積とするとき、第1面積は前記第2面積より広くなっている。 【選択図】図1
-
公开(公告)号：JP2016208000A
公开(公告)日：2016-12-08
申请号：JP2015193797
申请日：2015-09-30
Applicant: サムソン エレクトロ−メカニックス カンパニーリミテッド.
Inventor： ジョン−ホ リー , ヤン−ドゥ クェオン , ヒョウン−ジョーン キム , キョウン−モー ハール , キュン−セオブ オー
IPC: H01L25/065 , H01L25/07 , H01L25/18 , H01L23/12 , H05K3/46
CPC classification number: H05K1/11 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K3/0094 , H05K3/46 , H05K3/4644 , H01L2224/16225 , H05K2201/04 , H05K2201/10439
Abstract: 【課題】モバイル機器及びタブレットPCなどの高性能化、高集積化に伴ってCPU、GPU、APなどの核心部品も高性能、高集積化されている。これらに適用可能な印刷回路基板、その製造方法及び電子部品モジュールを提供する。 【解決手段】キャビティを有する回路基板100と、金属パターン15a,15b25a,25bを有し、金属パターンが回路基板の上下方向に配置されるようにキャビティに収容される連結基板10Aを含む印刷回路基板。 【選択図】図1
Abstract translation: 高性能诸如移动设备和平板PC，具有高度集成的，GPU沿着CPU，核心部件，如AP也高性能，是高度集成。 适用印刷电路板，其制造方法和电子部件模块。 一种电路板，具有与空腔100具有金属图案15a中，15B25a，一25b中，印刷电路板包括其中金属图案被容纳在空腔中，以便被布置在所述电路板的垂直方向上的连接基板10A 。 点域1
-
Patent Agency Ranking
公开(公告)号：KR101452126B1
公开(公告)日：2014-10-16
申请号：KR1020130093947
申请日：2013-08-08
Applicant: 삼성전기주식회사
CPC classification number: H01G4/30 , H01G2/06 , H01G4/005 , H01G4/232 , H05K1/185 , H05K2201/10015 , H05K2201/10439 , H05K2201/10636 , Y02P70/611
Abstract: The present invention includes: a dielectric layer; a ceramic body which has first and second main surfaces which face with each other, first and second side surfaces which face each other, and first and second cross-sectional areas which face with each other; first and second internal electrodes which are stacked by having the dielectric layer therebetween, and have first and second leads which are exposed to the first and second sides of the ceramic body; first and second dummy electrodes which are separated apart the same plane as the first and second electrodes, respectively; first and second external electrodes which are extended from the first and second cross-sections of the ceramic body toward the first, second main surfaces and first and second sides. A substrate-embedded type multilayer ceramic electronic part which satisfies 30 μm
Abstract translation: 本发明包括：介电层; 陶瓷体，其具有彼此面对的第一和第二主表面，彼此面对的第一和第二侧表面以及彼此面对的第一和第二横截面区域; 第一和第二内部电极，其间具有电介质层，并且具有暴露于陶瓷体的第一和第二侧的第一和第二引线; 分别与第一和第二电极分开与第一和第二电极相同的平面的第一和第二虚拟电极; 第一和第二外部电极，其从陶瓷体的第一和第二横截面向第一，第二主表面和第一和第二侧延伸。 满足30μm<= G
-
公开(公告)号：KR1020150017124A
公开(公告)日：2015-02-16
申请号：KR1020130093006
申请日：2013-08-06
Applicant: 삼성디스플레이 주식회사
Inventor： 안형철
IPC: G09F9/00
CPC classification number: H05K1/028 , H05K1/189 , H05K2201/10439
Abstract: The embodiment of the present invention relates to a circuit board and a display device including the same, capable of preventing a crack on a mounted integrated circuit chip even though the circuit board is bent. The display device according to the embodiment of the present invention includes a display panel which has a curved surface which is bent in a first direction and the circuit board which is connected to the display panel and is bent to correspond to the curved surface of the display panel. The circuit board includes the mounted integrated circuit chip to arrange a short side in the first direction.
Abstract translation: 本发明的实施例涉及一种电路板和包括该电路板的显示装置，即使电路板弯曲也能够防止安装的集成电路芯片上的裂纹。 根据本发明的实施例的显示装置包括：显示面板，其具有沿第一方向弯曲的曲面，并且连接到显示面板并弯曲以对应于显示器的曲面的电路板 面板。 电路板包括安装的集成电路芯片，以在第一方向上布置短边。
-
公开(公告)号：JP5614484B1
公开(公告)日：2014-10-29
申请号：JP2013195877
申请日：2013-09-20
Applicant: 第一精工株式会社
CPC classification number: H05K1/181 , H01R4/02 , H01R12/707 , H01R12/724 , H01R43/0256 , H01R43/16 , H05K3/303 , H05K2201/10439 , H05K2201/10613 , Y10T29/49149 , Y10T29/49204
Abstract: 【課題】プリント基板との剥離強度を、更に向上させることで、接続信頼性を向上させることができる電気コネクタの接合部材およびその製造方法を提供する。【解決手段】表面実装用の電気コネクタ10では、相手側の電気コネクタと接続するコネクタ端子30やプリント基板に接合して固定するための固定用部材40などの接合部材を備えている。この接合部材(コネクタ端子30,固定用部材40)は、プリント基板の金属パッドと接合する接合部34,43を有している。接合部34,43には、金属パッドと向き合う対向面51,61が形成されている。接合部34,43は、その端部の厚みを薄くして、半田が充填される接合用空間S1,S2が設けられることで、接合用空間S1,S2に、金属パッドから離れる方向に対向面51,61から立ち上がった傾斜面である起立面52,62と、起立面52,62から外側に張り出した天井面53,63とが形成されている。【選択図】図2
Abstract translation: 在印刷电路板的剥离强度，通过进一步改进，并提供一个接合构件和它们的能够提高连接可靠性的电连接器的制造方法。 甲在用于表面安装的电连接器10，接合构件，例如用于通过结合到连接器端子30和印刷电路板，用于连接到配合电连接器固定的固定部件40。 接合部件（连接器端子30，固定构件40）包括用于接合所述印刷电路板的金属焊盘的接合部分34，43。 接合件34，43，面对表面51,61面对金属焊盘形成。 接头34，43是通过接合的空间S1，S2焊料填充设置，接合空间S1，S2，相对表面从金属焊盘远离，以减少端部的厚度， 上升表面52和62为倾斜面，其从51,61上升，并且顶面53和63从直立表面52向外突出，62形成。 .The
-
公开(公告)号：JP2013045796A
公开(公告)日：2013-03-04
申请号：JP2011180422
申请日：2011-08-22
Applicant: Yazaki Corp , 矢崎総業株式会社
Inventor： TAKAGI YUSUKE
CPC classification number: H05K1/183 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/182 , H05K2201/09472 , H05K2201/09745 , H05K2201/09972 , H05K2201/10439 , H05K2203/0169 , H05K2203/0323
Abstract: PROBLEM TO BE SOLVED: To provide a technique capable of reducing the substrate thickness in a wiring substrate using a metal core substrate as a base substrate.SOLUTION: A wiring substrate 1 having an electronic component 80 which is disposed on a base substrate 10 having a metal core 31 as an inner-layer component includes: a component arrangement opening 15 which is formed in an area where the electronic component 80 is disposed; and a terminal arrangement part which is formed around the component arrangement opening 15 while being recessed from the surface of the base substrate 10 to the substrate inner side and in which first through third terminals 81 to 83 of the electronic component 80 are disposed. A component body 85 of the electronic component 80 is housed inside the component arrangement opening 15.
Abstract translation: 要解决的问题：提供一种能够使用金属芯基板作为基底来减少布线基板中的基板厚度的技术。 ＆lt; P＆gt;解决方案：具有设置在具有金属芯31作为内层部件的基底基板10上的电子部件80的布线基板1包括：部件布置开口15，其形成在电子部件 80处理; 以及在从基底基板10的表面凹陷到基板内侧并且配置有电子部件80的第一至第三端子81〜83的同时，在部件安装开口部15周围形成的端子排列部。 电子部件80的部件主体85容纳在部件安装开口15的内部。版权所有（C）2013，JPO＆INPIT
-
公开(公告)号：KR1020150032803A
公开(公告)日：2015-03-30
申请号：KR1020140124302
申请日：2014-09-18
Applicant: 다이-이치 세이코 가부시키가이샤
CPC classification number: H05K1/181 , H01R4/02 , H01R12/707 , H01R12/724 , H01R43/0256 , H01R43/16 , H05K3/303 , H05K2201/10439 , H05K2201/10613 , Y10T29/49149 , Y10T29/49204
Abstract: 인쇄회로기판 상에 장착된 금속 패드로 납땜되는 전기 부품은 상기 금속 패드에 면하는 제1 표면, 상기 금속 패드로부터 멀어지는 방향으로 상기 제1 표면으로부터 뻗어있는 제2 표면, 및 상기 제2 표면으로부터 외측을 향해 뻗어있는 제3 표면을 포함하고, 상기 제2 표면과 제3 표면은 땜납이 수용되는 공간을 형성한다.
Abstract translation: 本发明涉及焊接到印刷电路板上的电气部件。 本发明包括：与金属垫接触的第一表面; 第二表面，其从远离所述金属垫的方向从所述第一表面延伸; 以及从所述第二表面向外延伸的第三焊盘，其中所述第二和第三表面形成在接受焊接的空间中。
-
-
-
-
-
-
-
-
-
Search Results
49
records
(took 0.018 seconds)
