Abstract:
PROBLEM TO BE SOLVED: To provide a highly reliable surface mount type piezoelectric oscillator capable of preventing solder from being leaked from the piezoelectric oscillator by heat or the like. SOLUTION: The piezoelectric oscillator is provided with a base printed board (10) having a terminal (15) on a first surface and a recessed part (11) on a second surface which is the opposite side of the first surface, a metallic support (50) fixed on the recessed part (11), a sub printed board (40) supported by the metallic support (50) and mounting a piezoelectric vibrator (32) on its surface, and a cover member (48) covering the base printed board (10), the metallic support (50) and the sub printed board (40). COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
The invention relates to a method for mounting connection pins 5 in respective through-holes 3 provided in a component carrier 1 forming a module for an electronic assembly, each pin having an anchoring part 7 for insertion into said through-hole, a contact part 8 adapted to extend outside said through-hole and having a contact end 9 adapted for contact with the surface of another module of the electronic assembly, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The method comprises -providing a die tool having several similar recesses all adapted to receive a contact end of the contact part of a connection pin, and for each pin: - locating the contact end 9 of the contact part of the pin in a recess 32 provided in a die tool 30, said die tool having several similar recesses all adapted to receive a contact end, and the bottom surfaces 34 of all of the recesses having a high level of coplanarity, - inserting the anchoring part 7 of the pin 5 in a through-hole 3 of the component carrier, and - anchoring the pin 5 in the component carrier 1 by exerting a force on a free end of the anchoring part of the pin while an end surface 12 of the contact end 9 abuts the bottom surface 34 of the recess 32 in the die tool 30. Thereby is achieved a high level of co-planarity between end surfaces of connection pins mounted simultaneously in the component carrier. The invention also relates to a die tool, a component carrier and an electronic assembly.
Abstract:
The invention relates to a pin (21) for connecting an electrical conductor (2) to a PCB (4). The pin has a first part (24) thrust into a hole in th PCB and a second part (26), to which the electrical conductor (2) is connected by a sliding contact (8). The cross-sectional dimension (d2) of the second part (26) is greater than the cross-sectional dimension (d1) of the first part (24), and between these parts the pin (21) has a shoulder (27) with sharp edges. The hole in the circuit board is coated with metal which is connected via tabs (22) to electrical conductors (3) of the PCB (4). The pin (21) is soldered in the hole with the aid of soldering metal (25) and flux. When the flux is heated it creeps along the surface of the pin. During soldering, the shoulder (27) with the edges prevents the flux reaching the second part (26) of the pin (21), the second part having contact surfaces (29) on the pin (21) against the sliding contact (8) and where the flux would be a contact resistance. The pin (21) has the advantage that its first part (24) is narrow and that the tabs (22) can have a small outside diameter. There is thus created room for a large number of conductors (3) between two adjacent pins (21).