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    Deflectable micromirrors with stopping mechanisms
    41.
    发明申请
    Deflectable micromirrors with stopping mechanisms 有权
    具有停止机构的偏转微镜

    公开(公告)号：US20020196524A1

    公开(公告)日：2002-12-26

    申请号：US10155744

    申请日：2002-05-24

    Applicant: REFLECTIVITY, INC.

    Inventor： Andrew G. Huibers ,  Peter J. Heureux ,  Satyadev R. Patel

    IPC: G02B026/00

    CPC classification number: G02B26/0841

    Abstract: A spatial light modulator having a micromirror and one or more deflection limiting mechanisms, and a process for fabrication therefor. In one embodiment, the mirror support structure has a deflection stopping mechanism that limits the tilt angle of the reflective plate. Alternatively, a deflection stopping mechanism can be provided separate from the mirror support structure. The deflection stopping mechanism can be used in conjunction with one or more additional stopping mechanisms such as the abutment of a portion of the reflective plate against the substrate upon which it was constructed and/or abutment of the micromirror on a surface or structure of the circuit substrate.

    Abstract translation: 具有微反射镜和一个或多个偏转限制机构的空间光调制器及其制造方法。 在一个实施例中，反射镜支撑结构具有限制反射板的倾斜角度的偏转停止机构。 或者，偏转止动机构可以与镜支撑结构分开设置。 偏转止动机构可以与一个或多个附加止动机构结合使用，例如反射板的一部分抵靠其上构造的基板和/或微镜在电路的表面或结构上的邻接 基质。

    Method for vapor phase etching of silicon
    42.
    发明申请
    Method for vapor phase etching of silicon 有权
    硅的气相蚀刻方法

    公开(公告)号：US20020195423A1

    公开(公告)日：2002-12-26

    申请号：US10104109

    申请日：2002-03-22

    Applicant: REFLECTIVITY, INC.

    Inventor： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Hongqin Shi ,  Andrew G. Huibers ,  Peter Heureux

    IPC: C23F001/00 ,  B44C001/22 ,  C03C015/00 ,  C03C025/68

    CPC classification number: B81C1/00 ,  B81B2201/045 ,  B81C1/00476 ,  B81C1/00531 ,  B81C1/00595 ,  B81C99/0025 ,  B81C2201/0138 ,  B82Y30/00 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/32135

    Abstract: The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber. A first plasma or wet chemical etch (or both) can be performed prior to the vapor phase etch.

    Abstract translation: 公开了在气相蚀刻剂中的材料的蚀刻，其中气蚀刻蚀刻剂以10托或更大，优选20托或甚至200托或更大的总气体压力提供给蚀刻室。 气相蚀刻剂可以是气态酸蚀刻剂，惰性气体卤化物或中间卤素。 被蚀刻的样品/工件可以是例如半导体器件或MEMS器件等。通过气相蚀刻剂蚀刻/去除的材料优选为硅，并且气相蚀刻剂优选与一个或多个 稀释剂。 蚀刻系统的另一特征包括能够精确地确定蚀刻步骤的终点，例如通过在蚀刻室的出口处（或其下游）处产生阻抗，使得当气相蚀刻剂从蚀刻室 ，监测蚀刻反应的气体产物，并且可以确定除去过程的终点。 气相蚀刻工艺可以流过，流过和脉冲的组合，或再循环回蚀刻室。 可以在气相蚀刻之前执行第一等离子体或湿化学蚀刻（或两者）。

    MEMS with flexible portions made of novel materials
    43.
    发明申请
    MEMS with flexible portions made of novel materials 有权
    具有由新材料制成的柔性部分的MEMS

    公开(公告)号：US20020185699A1

    公开(公告)日：2002-12-12

    申请号：US10176478

    申请日：2002-06-21

    Applicant: REFLECTIVITY, INC., a Delaware corporation

    Inventor： Jason S. Reid

    IPC: H01L027/14 ,  H01L021/00

    CPC classification number: B81B3/0078 ,  B81B2201/045 ,  B81B2203/0118

    Abstract: MEMS devices are provided that are capable of movement due to a flexible portion formed of unique materials for this purpose. The MEMS device can have a flexible portion formed of a nitride or oxynitride of at least one transition metal, and formed of a nitride or oxynitride of at least one metalloid or near metalloid; a flexible portion formed of a single transition metal nitride or oxynitride and in the absence of any other metal or metalloid nitrides; a flexible portion formed of one or more late transition metal nitrides or oxynitrides; a flexible portion formed of a single transition metal in nitride form, and an additional metal substantially in elemental form; or a flexible portion formed of at least one metalloid nitride or oxynitride. The MEMS devices can be any device, though preferably one with a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or micromirror arrays for direct view and projection displays. The flexible portion (e.g. the hinge of the micromirror) is preferably formed by sputtering a metal and/or metalloid target in nitrogen ambient so as to result in a sputtered hinge. It is also possible to form other parts of the MEMS device (e.g structural parts that do not flex).

    Abstract translation: 提供了由于为此目的而由独特材料形成的柔性部分能够移动的MEMS装置。 MEMS器件可以具有由至少一种过渡金属的氮化物或氮氧化物形成的柔性部分，并且由至少一种准金属或近乎准金属的氮化物或氧氮化物形成; 由单一过渡金属氮化物或氮氧化物形成并且不存在任何其它金属或准金属氮化物的柔性部分; 由一个或多个后过渡金属氮化物或氮氧化物形成的柔性部分; 由氮化物形式的单一过渡金属形成的柔性部分和基本上为元素形式的附加金属; 或由至少一种准金属氮化物或氧氮化物形成的柔性部分。 MEMS器件可以是任何器件，尽管优选地具有诸如加速度计，DC继电器或RF开关，光学交叉连接或光学开关的柔性部分或用于直视和投影显示器的微镜阵列。 柔性部分（例如微镜的铰链）优选通过在氮气环境中溅射金属和/或准金属靶以形成溅射铰链来形成。 也可以形成MEMS器件的其他部分（例如，不弯曲的结构部件）。

    47.
    发明专利
    未知

    公开(公告)号：DE69834847D1

    公开(公告)日：2006-07-20

    申请号：DE69834847

    申请日：1998-09-24

    Applicant: REFLECTIVITY INC

    Inventor： HUIBER GERRIT

    IPC: G02B26/00 ,  B81B3/00 ,  G02B26/08

    Abstract: A spatial light modulator (12) includes an upper optically transmissive substrate (20) held above a lower substrate (34) containing addressing circuitry (36). One or more electrostatically deflectable elements (48) are suspended by hinges (50) from the upper substrate (20). In operation, individual mirrors (48) are selectively deflected and serve to spatially modulate light (56) that is incident to, and then reflected back through, the upper substrate (20). Motion stops (49) may be attached to the reflective deflectable elements so that the mirror (48) does not snap to the bottom substrate (34). Instead, the motion stop (49) rests against the upper substrate (20) thus limiting the deflection angle of the reflective deflectable elements (48).

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