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公开(公告)号：KR1020090025923A
公开(公告)日：2009-03-11
申请号：KR1020070091123
申请日：2007-09-07
Applicant: 삼성전자주식회사
CPC classification number: G06F17/30038 , G06Q50/10
Abstract: A multimedia contents adding a filed for a metadata administration in a multimedia content, a metadata processing method and an apparatus thereof are provided to determine metadata update time in a contents regenerating device by adding a field. An A/V contents is comprised of file format of an element unit corresponding to a basic storage unit. A meta data renewal sensitive field is added by an element unit in a file format(420). The validity of corresponding meta data and the point of time when corresponding meta data is updated are recorded in the meta data renewal sensitive field(430). The meta data renewal related information is comprised of last update field recording the time when corresponding meta data is revised and the term of validity field recording the effective time of corresponding meta data.
Abstract translation: 提供了多媒体内容中添加用于多媒体内容中的元数据管理的多媒体内容，元数据处理方法及其装置，以通过添加字段来确定内容再生装置中的元数据更新时间。 A / V内容由对应于基本存储单元的元素单元的文件格式组成。 元数据更新敏感字段由元素单元以文件格式添加（420）。 对应的元数据的有效性和对应的元数据被更新的时间点被记录在元数据更新敏感字段（430）中。 元数据更新相关信息包括记录对应元数据被修改的时间的最后更新字段和记录对应元数据的有效时间的有效期字段。
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公开(公告)号：KR1020080035922A
公开(公告)日：2008-04-24
申请号：KR1020060102594
申请日：2006-10-20
Applicant: 삼성전자주식회사
CPC classification number: H01L25/105 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor device package and a method of fabricating the same are provided to prevent bonding wires from being damaged by external physical stress by containing center bonding pads and bonding wires in a cavity of a cap-type member, thereby manufacturing a physically and electrically reliable and highly integrated semiconductor device package. A semiconductor device package comprises a printed circuit board(130), a semiconductor chip(110), a plurality of bonding wires(145), a cap-type member(150d), and a plurality of solder balls(160). A window is the center of the printed circuit board. The semiconductor chip is mounted onto the printed circuit board, exposing center bonding pads(112) through the window. The center bonding pads and the printed circuit board are electrically connected by the bonding wires through a window. The cap-type member is attached on a peripheral portion of a lower side of the printed circuit board including the window, having a cavity containing the center bonding pads and bonding wires for protection from external physical stress. The solder balls are installed on the lower side of the printed circuit board outside the cap-type member.
Abstract translation: 提供了一种半导体器件封装及其制造方法，以通过将中心接合焊盘和接合线包含在盖型部件的空腔中来防止接合线被外部物理应力损坏，从而制造物理上和电气上可靠的以及 高度集成的半导体器件封装。 半导体器件封装包括印刷电路板（130），半导体芯片（110），多个接合线（145），盖型部件（150d）和多个焊球（160）。 窗口是印刷电路板的中心。 半导体芯片安装在印刷电路板上，使中心焊盘（112）穿过窗户。 中心接合焊盘和印刷电路板通过接合线通过窗口电连接。 盖型构件安装在包括窗口的印刷电路板的下侧的周边部分上，该窗口具有包含中心接合焊盘和接合线的空腔，以防止外部物理应力。 焊球安装在盖型部件外侧的印刷电路板的下侧。
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公开(公告)号：KR1020070011725A
公开(公告)日：2007-01-25
申请号：KR1020050066240
申请日：2005-07-21
Applicant: 삼성전자주식회사
IPC: H01Q1/24
CPC classification number: H01Q1/242
Abstract: An antenna device for a mobile terminal is provided to stabilize a characteristic of the device by installing matching circuits on both ends of a connection line connecting an antenna element with an RF board. An antenna device includes an RF(Radio Frequency) board(101) provided on a mobile terminal, an antenna element(102) connected to the RF board, a connection line(103) connecting the RF board with the antenna element, and matching circuits(111,121) provided on both ends of the connection line. The connection line is a coaxial cable. An antenna base is mounted in the terminal to support the antenna element, and a printed circuit board is mounted on the antenna base.
Abstract translation: 提供了一种用于移动终端的天线装置，用于通过在将天线元件与RF板连接的连接线的两端安装匹配电路来稳定装置的特性。 天线装置包括设置在移动终端上的RF（射频）板（101），连接到RF板的天线元件（102），连接RF板与天线元件的连接线（103）和匹配电路 （111,121），设置在连接线的两端。 连接线是同轴电缆。 天线基座安装在端子中以支撑天线元件，印刷电路板安装在天线基座上。
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公开(公告)号：KR100539265B1
公开(公告)日：2005-12-27
申请号：KR1020040038206
申请日：2004-05-28
Applicant: 삼성전자주식회사
IPC: H01L21/336
CPC classification number: H01L29/66621 , H01L21/823412 , H01L21/823437 , H01L27/10876
Abstract: 리세스 채널 MOSFET 제조방법을 개시한다. 본 발명에 따른 리세스 채널 MOSFET 제조방법에서는, 반도체 기판 상에 절연막 패턴들을 형성한 다음, 그 위로 실리콘 산화막을 증착한다. 절연막 패턴들을 평탄화 종료점으로 삼아 실리콘 산화막을 평탄화시킴으로써, 절연막 패턴들 사이사이에 실리콘 산화막 마스크 패턴들을 형성하고, 절연막 패턴들은 제거한다. 실리콘 산화막 마스크 패턴들을 식각 마스크로 이용하여 기판을 식각함으로써 리세스 트렌치들을 형성한다. 실리콘 산화막 증착시, 기판에 형성되어 있을 수 있는 리세스를 제거하는 효과가 있다.
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Patent Agency Ranking
公开(公告)号：KR1020040104290A
公开(公告)日：2004-12-10
申请号：KR1020030064202
申请日：2003-09-16
Applicant: 삼성전자주식회사
IPC: H01L21/335
Abstract: PURPOSE: A semiconductor device having a trench gate type transistor and a fabricating method thereof are provided to prevent the formation of unnecessary channels by removing a silicon region between an isolation layer and a gate insulating layer. CONSTITUTION: An active region is defined on a cell array region of a semiconductor substrate(100). A plurality of gate insulating layers(130) are formed on inner walls of gate trenches(120) including first inner walls(120a) and second inner walls opposite to the first inner walls. A plurality of gate electrodes(150) include a gate bottom part on the gate insulating layer and a gate top part on the semiconductor substrate. An isolation layer(118) is directly connected to the gate insulating layers. A plurality of sources/drains are formed within the semiconductor substrate of both sides of the gate electrode. A plurality of channel regions are formed around the gate insulating layers.
Abstract translation: 目的：提供一种具有沟槽栅型晶体管及其制造方法的半导体器件，以通过去除隔离层和栅极绝缘层之间的硅区域来防止形成不需要的沟道。 构成：在半导体衬底（100）的单元阵列区域上限定有源区。 多个栅极绝缘层（130）形成在栅极沟槽（120）的内壁上，包括第一内壁（120a）和与第一内壁相对的第二内壁。 多个栅电极（150）包括栅极绝缘层上的栅极底部和半导体衬底上的栅极顶部。 绝缘层（118）直接连接到栅极绝缘层。 在栅电极的两侧的半导体衬底内形成多个源极/漏极。 在栅绝缘层周围形成多个沟道区。
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公开(公告)号：KR102245137B1
公开(公告)日：2021-04-28
申请号：KR1020140123706
申请日：2014-09-17
Applicant: 삼성전자주식회사
IPC: G06T15/04
Abstract: 객체의렌더링정보를포함하는압축된입력데이터로부터제어컴포넌트및 텍스쳐컴포넌트를획득하는데이터파싱부, 복수의제어유닛들을포함하며획득한제어컴포넌트와대응되는제어유닛에획득한제어컴포넌트를할당하고, 제어컴포넌트가할당된제어유닛은제어컴포넌트로부터제어명령을추출하는압축해제제어부및 압축해제제어부로부터수신한제어명령에기초하여, 텍스쳐컴포넌트로부터객체의텍스쳐데이터를복원하는로직연산부를포함하는렌더링데이터의압축을해제하는장치가개시된다.
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公开(公告)号：KR101802436B1
公开(公告)日：2017-11-29
申请号：KR1020110130376
申请日：2011-12-07
Applicant: 삼성전자주식회사
IPC: H01L27/10
CPC classification number: H01L45/1233 , H01L27/1021 , H01L27/2409 , H01L27/2445 , H01L45/06 , H01L45/141
Abstract: 반도체장치및 그제조방법이제공된다. 반도체장치는반도체장치는하부배선들, 상기하부배선들을가로지르는상부배선들, 상기하부배선들과상기상부배선들의교차영역들각각에배치되는선택소자들, 및상기선택소자와상기상부배선사이에배치되는메모리요소를포함하되, 상기선택소자들각각은, 제 1 상부폭과, 상기제 1 상부폭보다큰 제 1 하부폭을갖는제 1 측벽, 및실질적으로동일한제 2 상부폭과제 2 하부폭을갖는제 2 측벽을갖는반도체패턴을포함한다.
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