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公开(公告)号：KR1020090118218A
公开(公告)日：2009-11-18
申请号：KR1020080043885
申请日：2008-05-13
Applicant: 전자부품연구원
CPC classification number: H01L31/125 , H01L31/02002 , H01L31/18 , H01L33/62
Abstract: PURPOSE: A photoelectric conversion module and a manufacturing method thereof are provided to easily form a pad in a side surface of a substrate by forming wall pads in the side surface of the substrate. CONSTITUTION: The photoelectric conversion module includes a substrate, a driving circuit chip, and a light emitting device. A plurality of electrode lines is formed on a top part of the substrate(100). A plurality of wall pads(120) of a semi cylindrical shape is formed in a side surface of the substrate. In the substrate, the wall pads are connected to partial electrode lines among the electrode lines. The driving circuit chip is bonded in the electrode lines. The light emitting device(150) is bonded in the wall pads.
Abstract translation: 目的：提供光电转换模块及其制造方法，通过在基板的侧面形成壁垫，容易地在基板的侧面形成焊盘。 构成：光电转换模块包括衬底，驱动电路芯片和发光器件。 多个电极线形成在基板（100）的顶部上。 在基板的侧面形成有多个半圆柱形的壁垫（120）。 在基板中，壁焊片与电极线中的部分电极线连接。 驱动电路芯片接合在电极线中。 发光器件（150）接合在壁焊盘中。
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公开(公告)号：KR100909698B1
公开(公告)日：2009-07-29
申请号：KR1020070062663
申请日：2007-06-26
Applicant: 전자부품연구원
IPC: G02B6/43
Abstract: A fabrication method for fiber array device is provided to reduce manufacturing time and cost since there is no need to polish the optical fiber array throughout. A fabrication method for fiber array device is comprised of steps: forming V-shape to mount optical fiber on the top of a substrate of which one side is cut by the angle of Œ5 -15‹ to a horizontal plane; preparing the optical fiber of which end is cut by the angle of Œ5~15‹ to the horizontal plane and mounting it in the groove; injecting the adhesive(140) into the top surface of the substrate; covering a cover(130) on the top of the optical fiber mounted on the top of substrate.
Abstract translation: 提供一种用于光纤阵列装置的制造方法，以减少制造时间和成本，因为不需要对光纤阵列进行整个抛光。 一种用于光纤阵列器件的制造方法，包括以下步骤：形成V形以将光纤安装在基板的顶部上，该基板的一侧被切割成与水平面成5°-15°的角度; 准备将光纤末端切割成与水平面成5°〜15°角并安装在槽内的光纤; 将粘合剂（140）注入衬底的顶部表面; 覆盖安装在基板顶部的光纤顶部上的盖（130）。
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公开(公告)号：KR100813919B1
公开(公告)日：2008-03-18
申请号：KR1020050134928
申请日：2005-12-30
Applicant: 전자부품연구원
IPC: G02B6/24
Abstract: 본 발명은 인쇄회로기판용 광연결블럭 및 그 제조방법에 관한 것으로, 보다자세하게는 평면 기판층, 하부클래드층, 코어층, 상부클래드 층으로 구성된 곡선구간으로 이루어진 광연결블럭의 구조 및 그 제조방법에 관한 것이다.
본 발명은 평면 기판층; 상기 평면 기판층 위에 놓이며, 소정의 파장에 대해 광투명성을 가진 물질로 된 하부 클래드층; 상기 하부 클래드층 위에 놓이며, 상기 하부 클래드층의 굴절률보다 큰 굴절율을 가진 광학 폴리머로 된 곡선구간을 포함하는 광도파로가 형성된 코아층; 및 상기 하부 클래드층 위에 놓이며, 상기 광학 폴리머의 굴절률보다 낮은 굴절률을 갖는 물질로 형성되어, 상기 코아층의 광도파로를 감싸는 상부 클래드층을 포함하는 인쇄회로기판용 광연결블럭으로 이루어짐에 기술적인 특징이 있다.
따라서, 상기 광 PCB의 광연결블럭을 구조를 통한 다채널 및/또는 다층의 광연결블럭을 제조하여 VCSEL과 도파로, 그리고 PD사이의 광결합을 효과적으로 연결할 수 있고, 다채널의 광 PCB, 다층의 광 PCB에 적용가능하다. 또 광연결블럭을 광PCB에 붙여 커넥터형식으로 사용이 가능하여 광PCB와 광PCB의 연결을 쉽게 할 수 있다. 또한 이러한 광연결 블럭은 집적화 기술을 이용하기 때문에 대량생산과 저가격화에 유용한 효과가 있다.
광연결블럭, 광도파로, 테이퍼 형, 광연결구조, 광 PCB구조-
公开(公告)号：KR1020050110328A
公开(公告)日：2005-11-23
申请号：KR1020040035291
申请日：2004-05-18
Applicant: 전자부품연구원
CPC classification number: H05K1/0274 , G02B6/25 , H05K2201/10121
Abstract: 본 발명은 광 인쇄회로기판의 광도파로 연마 장치 및 방법에 관한 것으로, 광 도파로를 개재하고 있고, 홈 또는 관통홀이 형성되어 있으며, 상기 홈 또는 관통홀 내벽으로 상기 광 도파로 단면이 노출된 광 인쇄회로 기판을 준비하는 제 1 단계와; 타면이 모터의 축 선단에 고정되어 있고, 일면에 연마패드가 부착된 휠을 상기 광 인쇄회로 기판의 홈 또는 관통홀 내부에 삽입시키는 제 2 단계와; 상기 휠의 일면에 부착된 연마패드를 상기 홈 또는 관통홀 내벽으로 노출된 광 도파로 단면에 밀착시키는 제 3 단계와; 상기 모터를 동작시켜 상기 휠을 회전시켜 연마패드로 광 도파로 단면을 연마하는 제 4 단계로 이루어진다.
따라서, 본 발명은 광 도파로를 개재하고 있는 광 인쇄회로 기판의 홈 또는 관통홀에 모터와 연결된 휠을 삽입시키고, 모터로 휠에 고정된 연마패드를 회전시켜 광 인쇄회로기판의 홈 또는 관통홀에 노출된 광 도파로 단면을 연마함으로써, 광 인쇄회로기판의 광 전송 특성을 우수히 할 수 있는 효과가 있다.-
公开(公告)号：KR100458549B1
公开(公告)日：2004-12-03
申请号：KR1020020035359
申请日：2002-06-24
Applicant: 전자부품연구원
IPC: H01S3/098
Abstract: PURPOSE: A multi-channel wavelength locker and a locking method thereof are provided to perform a wavelength locking operation of multi-channel without accurately control environmental factor, such as temperature. CONSTITUTION: A multi-channel wavelength locker includes a polarization beam splitter(110), a wavelength filter(120), a linear polarizer(130), a plurality of detectors(141,143), and a stabilizer circuit(150). The polarization beam splitter(110) is used for splitting an optical signal into two linear-polarized beams when receiving the optical signal. The wavelength filter(120) is used for transmitting the beams having different polarization according to the wavelengths. The linear polarizer(130) is used for transmitting selectively only the linear-polarized beams from the wavelength filter(120) to a desired optical axis. The detectors(141,143) are used for measuring the intensity of the beams the polarization beam splitter(110) and the linear polarizer(130). The stabilizer circuit(150) is used for comparing the intensity of the beams detected by the detectors(141,143) and outputting a feedback signal to a light source according to the compared result.
Abstract translation: 目的：提供一种多通道波长锁定器及其锁定方法，用于在不精确控制温度等环境因素的情况下执行多通道波长锁定操作。 构成：多通道波长锁定器包括偏振分束器（110），波长滤波器（120），线性偏振器（130），多个检测器（141,143）和稳定器电路（150）。 偏振分束器（110）用于在接收光信号时将光信号分成两个线偏振光束。 波长滤波器（120）用于根据波长传输具有不同偏振的光束。 线性偏振器（130）用于选择性地仅将来自波长滤波器（120）的线性偏振光束传输到期望的光轴。 检测器（141,143）用于测量偏振分束器（110）和线性偏振器（130）的光束强度。 稳定器电路（150）用于比较由检测器（141,143）检测到的光束的强度，并根据比较结果向光源输出反馈信号。
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Patent Agency Ranking
公开(公告)号：KR100440765B1
公开(公告)日：2004-07-21
申请号：KR1020020064960
申请日：2002-10-23
Applicant: 전자부품연구원
IPC: G02B6/12
Abstract: PURPOSE: A waveguide type all optical logic device using multi mode interference is provided to reduce light loss and to increase an operation speed and to realize a stable operation. CONSTITUTION: The waveguide type all optical logic device comprises a substrate, and a bottom clad layer formed on the substrate, and a top clad layer formed on an upper part of the bottom clad layer. And an optical waveguide is formed in the top clad layer to be adjacent to the bottom clad layer. The optical waveguide comprises a light isolation multi mode waveguide(121,122) connected to two pairs of single mode input waveguides(111,112,113,114) respectively, and a light coupling multi mode waveguide(141,142) connected to the light isolation waveguide by a single mode waveguide and connected to two pairs of single mode output waveguides(151,152,153,154).
Abstract translation: 目的：提供一种使用多模干涉的波导型全光逻辑器件，以减少光损失并提高操作速度并实现稳定的操作。 本发明的波导型全光逻辑器件包括衬底和形成在衬底上的底部包层以及形成在底部包层上部的顶部包层。 并且在顶部包层中形成光波导以与底部包层邻接。 光波导包括分别连接到两对单模输入波导（111,112,113,114）的光隔离多模波导（121,122）和通过单模波导连接到光隔离波导的光耦合多模波导（141,142） 到两对单模输出波导（151,152,153,154）。
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公开(公告)号：KR100437188B1
公开(公告)日：2004-06-23
申请号：KR1020020041180
申请日：2002-07-15
Applicant: 전자부품연구원
IPC: G02B6/42
CPC classification number: G02B6/2937 , G02B6/29398 , G02B6/327
Abstract: The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.
Abstract translation: 本发明涉及一种封装用于光通信的光学部件的方法。 根据本发明的方法，具有以下优点：用于光学部件的封装工艺被自动化以提高生产率并且获得价格竞争力和质量的均匀性，并且用于局部地将热量局部传递到焊料预制件的高频加热器是 用于最小化除焊接区域以外的区域的热变形，从而实现光学部件的高度可靠的封装。
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公开(公告)号：KR1020040049925A
公开(公告)日：2004-06-14
申请号：KR1020020076901
申请日：2002-12-05
Applicant: 전자부품연구원
IPC: G02B6/42
Abstract: PURPOSE: A method for hardening an epoxy used in package an optical component and a soldering method are provided to reduce a hardening period and simplify an automation process by removing a process for inserting the optical component into a chamber. CONSTITUTION: An optical component is formed with a fiber pigtail(103), a glass tube(101), and a fiber(104). A thermosetting epoxy(102) is adhered to the optical component by heating and hardening the thermosetting epoxy within a chamber. The fiber pigtail is arranged to adhere the fiber pigtail to a green lens(107) coated by a metal material(106). The thermosetting epoxy is coated on the optical component. The optical component coated with the thermosetting epoxy is located at a high-frequency coil by using a high-frequency device(105).
Abstract translation: 目的：提供一种用于硬化用于封装光学部件的环氧树脂的方法和焊接方法，以通过去除将光学部件插入室中的过程来减少硬化时间并简化自动化过程。 构成：光纤部件由纤维尾纤（103），玻璃管（101）和纤维（104）形成。 热固性环氧树脂（102）通过在室内加热和固化热固性环氧树脂而粘附到光学部件上。 纤维尾纤被布置成将纤维尾纤粘附到由金属材料（106）涂覆的绿色透镜（107）上。 热固性环氧树脂涂在光学部件上。 涂覆有热固性环氧树脂的光学部件通过使用高频装置（105）位于高频线圈。
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公开(公告)号：KR1020030083212A
公开(公告)日：2003-10-30
申请号：KR1020020021653
申请日：2002-04-19
Applicant: 전자부품연구원
IPC: G02B6/12
Abstract: PURPOSE: A light-wave circuit type gain flattening filter device and a fabricating method thereof are provided to fabricate plural elements on one wafer and enhance the productivity by using a PLC(Planar Light-wave Circuit) fabrication method. CONSTITUTION: A light-wave circuit type gain flattening filter device includes a substrate(20), a bottom clad layer(21), an upper clad layer(26), and a core layer(22'). The bottom clad layer(21) is formed on an upper portion of the substrate(20). The upper clad layer(26) is formed on an upper portion of the bottom clad layer(21). The core layer(22') is formed between the bottom clad layer(21) and the upper clad layer(26). A grating pattern is formed on the core layer(22'). The bottom clad layer(21) and the upper clad layer(26) are formed with high density SiO2 layers. The core layer(22') is formed with SiO2-GeO2 layer.
Abstract translation: 目的：提供一种光波电路式增益平坦化滤波器件及其制造方法，以在一个晶片上制造多个元件，并通过使用PLC（平面光波电路）制造方法提高生产率。 构成：光波电路型增益平坦化滤波器件包括衬底（20），底部包层（21），上覆层（26）和芯层（22'）。 底部覆层（21）形成在基板（20）的上部。 上覆盖层（26）形成在下包层（21）的上部。 芯层（22'）形成在底部包层（21）和上部包层（26）之间。 在芯层（22'）上形成光栅图案。 底部覆层（21）和上覆盖层（26）形成有高密度SiO 2层。 芯层（22'）由SiO2-GeO2层形成。
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公开(公告)号：KR100395302B1
公开(公告)日：2003-08-21
申请号：KR1020010055293
申请日：2001-09-08
Applicant: 전자부품연구원
IPC: G02B6/26
Abstract: PURPOSE: An optical fiber fabrication using an asymmetric refractive index of a multi-mode coupler is provided to have more simple using asymmetric refractive index at a multi-mode interference coupler. CONSTITUTION: An input waveguide(11) is connected to the first side of a multi-mode interference coupler(10). An output waveguide(12) is connected to the second side opposite to the first side of the multi-mode interference coupler. A thin film heater(20,21,22) heats a predetermined portion of the multi-mode interference coupler. An optical path is changed as an index of refraction of the coupler becomes asymmetric when the predetermined portion of the multi-mode interference coupler is heated. The thin film heater is overlapped with the predetermined portion of the third side of the coupler, which is one of two corners of the third side which is not adjacent to the first and second sides.
Abstract translation: 目的：提供一种使用多模耦合器的非对称折射率的光纤制造，以在多模干涉耦合器处使用非对称折射率更简单。 构成：输入波导（11）连接到多模干涉耦合器（10）的第一侧。 输出波导（12）连接到与多模干涉耦合器的第一侧相对的第二侧。 薄膜加热器（20,21,22）加热多模干涉耦合器的预定部分。 当多模干涉耦合器的预定部分被加热时，随着耦合器的折射率变得不对称，光路改变。 薄膜加热器与耦合器的第三侧的预定部分重叠，该预定部分是不与第一和第二侧相邻的第三侧的两个角中的一个。
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