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    광수신소자 어레이를 갖는 내장형 파장안정화 모듈 및 그제조방법
    41.
    发明公开
    광수신소자 어레이를 갖는 내장형 파장안정화 모듈 및 그제조방법 失效
    具有光接收装置阵列的内部波长稳定模块

    公开(公告)号：KR1020040046174A

    公开(公告)日：2004-06-05

    申请号：KR1020020074013

    申请日：2002-11-26

    Applicant: 한국전자통신연구원

    Inventor： 최광성 ,  박흥우 ,  윤호경 ,  최병석 ,  엄용성 ,  이종현 ,  문종태

    IPC: G02B6/42

    CPC classification number: H04B10/572

    Abstract: PURPOSE: An internal wavelength stabilization module having a light receiving device array is provided to reduce the reflective noise of laser beam and stabilize wavelength by tilting a filter and a photo diode to the laser beam. CONSTITUTION: An internal wavelength stabilization module having a light receiving device array includes a collimator, a beam splitter, a first light receiving device, a filter, a second light receiving device, and a controller. The collimator(110) is used for forming a parallel laser beam radiated to a rear side. The beam splitter(112) is used for branching the laser beam of the collimator to two paths. The first light receiving device is used for receiving one of the branched laser beams. The filter(122) is used for passing a particular wavelength of the branched laser beam. The second light receiving device is used for receiving the other of the branched laser beams. The controller is used for controlling an output wavelength of a laser diode. The filter and the second light receiving device are tilted at a predetermined angle to the laser beam.

    Abstract translation: 目的：提供具有光接收装置阵列的内部波长稳定模块，以通过将滤光器和光电二极管倾斜到激光束来减少激光束的反射噪声并稳定波长。 构成：具有光接收装置阵列的内部波长稳定模块包括准直器，分束器，第一光接收装置，滤光器，第二光接收装置和控制器。 准直器（110）用于形成辐射到后侧的平行激光束。 分束器（112）用于将准直器的激光束分支成两条路径。 第一光接收装置用于接收分支激光束之一。 滤光器（122）用于通过分支激光束的特定波长。 第二光接收装置用于接收另一个分支激光束。 控制器用于控制激光二极管的输出波长。 滤光器和第二光接收装置以与激光束成预定角度倾斜。

    광소자 웨이퍼 레벨 패키지 및 그 패키징 방법
    42.
    发明授权
    광소자 웨이퍼 레벨 패키지 및 그 패키징 방법 失效
    광소자웨이퍼레벨패키지및그패키징방법

    公开(公告)号：KR100416503B1

    公开(公告)日：2004-01-31

    申请号：KR1020010073008

    申请日：2001-11-22

    Applicant: 한국전자통신연구원

    Inventor： 엄용성 ,  문종태

    IPC: H01L31/0203

    Abstract: PURPOSE: A wafer level package for an optical device is provided to efficiently deal with an optical device having several hundreds of microns in width, length and thickness and easily perform an optical module packaging process by providing a standardized optical device packaging method not affected by the size of the optical device through a wafer level package process. CONSTITUTION: A wafer(1) is prepared. The optical device(7) exposes a bonding pad(5), attached and fixed to the upper portion of the wafer by using adhesive(3). A passivation layer(9) protects and supports the optical device in parallel with the surface of the optical device, formed on the wafer. A redistribution pad(11) is formed on the passivation layer, electrically connected to the bonding pad.

    Abstract translation: 目的：提供一种用于光学装置的晶片级封装，以有效地处理具有数百微米宽度，长度和厚度的光学装置，并且通过提供不受所述光学装置封装方法影响的标准化光学装置封装方法而容易地执行光学模块封装工艺 通过晶圆级封装工艺来实现光学器件的尺寸。 构成：准备晶片（1）。 光学器件（7）暴露结合垫（5），通过使用粘合剂（3）附着和固定到晶片的上部。 钝化层（9）与形成在晶片上的光学器件的表面平行地保护和支撑光学器件。 再分布焊盘（11）形成在钝化层上，电连接到焊盘。

    플립칩 본딩 광모듈 패키지 및 그 패키징 방법
    43.
    发明公开
    플립칩 본딩 광모듈 패키지 및 그 패키징 방법 无效
    FLIP芯片粘合光学模块封装及其封装方法

    公开(公告)号：KR1020030044255A

    公开(公告)日：2003-06-09

    申请号：KR1020010074952

    申请日：2001-11-29

    Applicant: 한국전자통신연구원

    Inventor： 문종태 ,  엄용성

    IPC: H01L31/10

    CPC classification number: H01L24/73 ,  G02B6/3616 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/4232 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/1532 ,  H01L2924/00

    Abstract: PURPOSE: A flip chip bonding optical module package is provided to reduce an electrical parasitic component generated by the length of a wire in a conventional wire bonding process by fabricating an optical module package through a flip chip bonding method. CONSTITUTION: An input/output pad(102) is formed on a substrate(100). An under bump metal(UBM) layer is formed on the input/output pad. A solder bump(110a) is formed on the UBM layer to transmit an electric signal to the outside so that an optical device chip is formed. An under ball metal layer is formed on a silicon substrate(200). The silicon substrate is flip chip bonded to the optical device chip, having a through hole(202). A solder ball(208) transmits an electric signal from the solder bump to the outside, formed on the under ball metal layer. An optical fiber is inserted into the through hole to be optically connected to the optical device chip.

    Abstract translation: 目的：提供一种倒装芯片结合光学模块封装，以通过倒装芯片接合方法制造光学模块封装来减少常规引线接合工艺中由导线长度产生的电子寄生分量。 构成：在基板（100）上形成输入/输出焊盘（102）。 在输入/输出板上形成凹凸金属（UBM）层。 在UBM层上形成焊料突起（110a），以将电信号传输到外部，从而形成光器件芯片。 在硅衬底（200）上形成球下金属层。 硅衬底被倒装芯片结合到具有通孔（202）的光学器件芯片。 焊球（208）将焊接凸块的电信号传送到外侧，形成在球形金属层的下方。 将光纤插入通孔中以光学连接到光学器件芯片。

    반도체 패키지의 제조 방법
    44.
    发明授权
    반도체 패키지의 제조 방법 有权

    公开(公告)号：KR102246076B1

    公开(公告)日：2021-05-03

    申请号：KR1020150161193

    申请日：2015-11-17

    Applicant: 한국전자통신연구원

    Inventor： 최광성 ,  배현철 ,  엄용성 ,  이진호 ,  이학선

    IPC: H01L25/065 ,  H01L25/07 ,  H01L23/488 ,  H01L23/28 ,  H01L23/495 ,  H01L21/56 ,  H01L21/268

    Abstract: 본발명의반도체패키지의제조방법은패드를포함하는패키지기판을준비하는것, 상기패드상에솔더볼이배치되도록, 상기패키지기판상에상기솔더볼이부착된반도체칩을실장하는것, 상기패키지기판과상기반도체칩 사이에카복실기가포함된환원제를포함하는언더필수지를채우는것, 및상기반도체칩에레이저를조사하여상기솔더볼과상기패드를부착하는것을포함하되, 상기솔더볼과상기패드를부착하는것은조사된상기레이저에의해발생된열로인해상기패드및 상기솔더볼의표면들에형성된금속산화막이금속막으로바뀌는것을포함할수 있다.

    반도체 패키지 제조 방법
    48.
    发明公开
    반도체 패키지 제조 방법 审中-实审
    半导体封装制造方法

    公开(公告)号：KR1020170141108A

    公开(公告)日：2017-12-22

    申请号：KR1020170024973

    申请日：2017-02-24

    Applicant: 한국전자통신연구원

    Inventor： 배현철 ,  엄용성 ,  최광성

    IPC: H01L23/00 ,  H01L21/027 ,  H01L21/288 ,  H01L21/60 ,  H01L23/14

    CPC classification number: H01L2924/15311 ,  H01L2924/3511

    Abstract: 반도체패키지제조방법은하부패키지기판을제공하는것, 하부패키지기판상에제1 메탈로드를형성하는것, 및제1 메탈로드상에상부패키지기판을형성하는것을포함하되, 제1 메탈로드및 상부패키지기판을형성하는것은 3D 프린팅공정을포함하고, 상부패키지기판은제1 메탈로드의직경보다작은직경을갖는제1 도전성라인및 제1 도전성라인을둘러싸는절연층을포함하며, 제1 도전성라인은절연층을관통하여제1 메탈로드에전기적으로연결된다.

    Abstract translation: 一种制造半导体封装的方法包括提供下封装衬底，在下封装衬底上形成第一金属棒，以及在第一金属棒上形成上封装衬底，其中第一金属棒和上封装衬底 成形包括3D打印过程，其中顶部封装衬底包括具有比第一金属棒的直径小的直径的第一导线和围绕第一导线的绝缘层， 并电连接到第一金属棒。

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