公开(公告)号：DE102005024431B4

公开(公告)日：2009-08-06

申请号：DE102005024431

申请日：2005-05-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  FUERGUT EDWARD ,  BEER GOTTFRIED ,  ESCHER-POEPPEL IRMGARD

IPC: H01L21/50 ,  C09J7/02 ,  H01L21/301 ,  H01L21/56 ,  H01L21/58 ,  H01L21/67

Abstract: A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

公开(公告)号：DE102006058010B9

公开(公告)日：2009-06-10

申请号：DE102006058010

申请日：2006-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  BEER GOTTFRIED

IPC: H01L21/50 ,  H01L23/053 ,  H01L23/48

Abstract: A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

公开(公告)号：DE102006058010B4

公开(公告)日：2009-01-02

申请号：DE102006058010

申请日：2006-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  BEER GOTTFRIED

IPC: H01L21/50 ,  H01L23/053 ,  H01L23/48

Abstract: A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

公开(公告)号：DE102006058010A1

公开(公告)日：2008-06-26

申请号：DE102006058010

申请日：2006-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  BEER GOTTFRIED

IPC: H01L21/50 ,  H01L23/053 ,  H01L23/48

Abstract: A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

公开(公告)号：DE102006014795A1

公开(公告)日：2007-10-18

申请号：DE102006014795

申请日：2006-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  GHAHREMANI CYRUS ,  SCHMITT JEAN

IPC: H04B10/00 ,  H04B10/02 ,  H04B10/12 ,  H04M1/02

公开(公告)号：DE102005049977B3

公开(公告)日：2007-04-05

申请号：DE102005049977

申请日：2005-10-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  FUERGUT EDWARD ,  BEER GOTTFRIED

IPC: H01L21/52 ,  H01L21/48

Abstract: The tempering process involves fixing the compound plate (1) which has a plastics housing (2) and embedded semi conductor chips (3) by its underneath (9) on a holder (10) and generating a temperature gradient between the top side (11) and the underneath side (9) of the plate. The temperature gradient is maintained for at least a defined time interval and the compound plate is then cooled down to room temperature. The compound plate can be fixed on the holder by contact pressure plates. An independent claim describes a device for carrying out tempering process which has an under-pressure holder (12) with several plate positions (15) on the top side with cooling ducts. A heat radiator (17) is set up on the top side of the holder and a control device produces and maintains the temperature gradient between the top and underneath sides of the compound plates.

公开(公告)号：DE102005023947B4

公开(公告)日：2007-04-05

申请号：DE102005023947

申请日：2005-05-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  BEER GOTTFRIED ,  BRUNNBAUER MARKUS

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: An optoelectronic semiconductor assembly includes at least the following components: a semiconductor chip with an optical sensor region on its active topside, a wiring substrate on which the semiconductor chip is arranged, electrical connecting elements extending between the semiconductor chip and the wiring substrate, and an optically transparent cover an optically transparent plastic encapsulation compound that embeds at least the semiconductor chip and electrical connecting elements. The optically transparent encapsulation compound can be formed via a compression molding process.

公开(公告)号：DE102005024431A1

公开(公告)日：2006-11-30

申请号：DE102005024431

申请日：2005-05-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  FUERGUT EDWARD ,  BEER GOTTFRIED ,  ESCHER-POEPPEL IRMGARD

IPC: H01L21/67 ,  C08J5/12 ,  C09J7/02 ,  H01L21/301 ,  H01L21/58

Abstract: A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

公开(公告)号：DE102005023947A1

公开(公告)日：2006-11-30

申请号：DE102005023947

申请日：2005-05-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  BEER GOTTFRIED ,  BRUNNBAUER MARKUS

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: An optoelectronic semiconductor assembly includes at least the following components: a semiconductor chip with an optical sensor region on its active topside, a wiring substrate on which the semiconductor chip is arranged, electrical connecting elements extending between the semiconductor chip and the wiring substrate, and an optically transparent cover an optically transparent plastic encapsulation compound that embeds at least the semiconductor chip and electrical connecting elements. The optically transparent encapsulation compound can be formed via a compression molding process.

公开(公告)号：DE10006968A1

公开(公告)日：2001-09-06

申请号：DE10006968

申请日：2000-02-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  BRENNER WALTER

IPC: H01L23/31 ,  H01L21/60

Abstract: Process for removing adhesion promoters used in the production of semiconductors comprises directing a laser beam onto regions of a surface covered with an adhesion promoter. An Independent claim is also included for a device for applying chips onto a leadframe or for applying bonding wires between a semiconductor chip and a leadframe. Preferred Features: The surface processed with the laser beam is held in a protective gas atmosphere. The laser beam is used in impulses.