公开(公告)号：DE102008015709A1

公开(公告)日：2008-11-06

申请号：DE102008015709

申请日：2008-03-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  SCHMITT JEAN ,  SKOG TERJE

IPC: H01L23/08 ,  B81B7/02 ,  B81C3/00 ,  H01L21/56 ,  H01L23/28

Abstract: The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.

公开(公告)号：DE102006014795A1

公开(公告)日：2007-10-18

申请号：DE102006014795

申请日：2006-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  GHAHREMANI CYRUS ,  SCHMITT JEAN

IPC: H04B10/00 ,  H04B10/02 ,  H04B10/12 ,  H04M1/02

公开(公告)号：DE102006012780B3

公开(公告)日：2007-06-06

申请号：DE102006012780

申请日：2006-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WIETSCHORKE HELMUT ,  PAULUS STEFAN ,  THEUSS HORST ,  AUBURGER ALBERT ,  GHAHREMANI CYRUS ,  SCHMITT JEAN ,  DANGELMAIER JOCHEN ,  LICHTENEGGER THOMAS

IPC: H01L31/12 ,  G02B6/42 ,  H01L31/0232

Abstract: An optical coupler for interconverting optical and electrical signals comprises a housing (4) with plug connection (5) to a light conductor (6) and a mountable external contact (8) on a conductive film (9). An optical semiconductor chip (12) and an application-specific integrated circuit chip (13) lie on the optical axis (10) and the conductive film has a curved region (14) between the mounting position and external contact that is completely embedded in the housing material so that only the underside contact (25) is accessible. Independent claims are also included for the following: (A) A mobile phone; (B) A digital camera;and (C) A camcorder comprising the above.

公开(公告)号：DE102006035876A1

公开(公告)日：2008-02-07

申请号：DE102006035876

申请日：2006-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DANGELMAIER JOCHEN ,  MUELLER THOMAS ,  SCHMITT JEAN ,  PAULUS STEFAN

IPC: H01L23/42 ,  H01L21/54

Abstract: The module has electrical conductors (2) with appropriate number of connection pins outside of housing, where the conductors have electrical contact surfaces (2.2) within the housing. A heat conductor (3) has a connection pin outside of the housing and a thermal contact surface (3.2) within the housing. A chip e.g. sensor chip, is connected with one of main surfaces with the surface (3.2) and has electrical connections that are connected with the surfaces (2.2). A layer system contains the layers deposited on the contact surfaces (2.2) and the thermal contact surface (3.2). An independent claim is also included for a method for the production of a chip module.

公开(公告)号：DE102006011753A1

公开(公告)日：2007-09-20

申请号：DE102006011753

申请日：2006-03-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHMITT JEAN

IPC: H01L23/04 ,  B81B1/00 ,  B81C1/00 ,  B81C3/00 ,  G01D11/24 ,  H01L23/18

Abstract: An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.