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公开(公告)号:DE102004033825B4
公开(公告)日:2009-05-14
申请号:DE102004033825
申请日:2004-07-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , BARTH HANS-JOACHIM
IPC: H01L21/822 , H01L21/02 , H01L21/768 , H01L27/08
Abstract: The invention relates to a method for producing a capacitor arrangement, and to a corresponding capacitor arrangement, wherein the first insulating layer is formed at the surface of a carrier substrate and a first capacitor electrode with a multiplicity of interspaced first interconnects is produced in said insulating layer. Using a mask layer, partial regions of the first insulating layer are removed for the purpose of uncovering the multiplicity of first interconnects, and after the formation of a capacitor dielectric at the surface of the uncovered first interconnects, a second capacitor electrode is formed with a multiplicity of interspaced second interconnects lying between the first interconnects coated with capacitor dielectric. This additionally simplified production method enables self-aligning and cost-effective production of capacitors having a high capacitance per unit area and mechanical stability.
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公开(公告)号:DE50015090D1
公开(公告)日:2008-05-21
申请号:DE50015090
申请日:2000-01-05
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SCHREMS MARTIN , DRESCHER DIRK , WURZER HELMUT , TEWS HELMUT
IPC: H01L21/00 , H01L29/78 , H01L21/28 , H01L21/316 , H01L21/8242 , H01L27/108 , H01L29/51
Abstract: A semiconductor element with at least one layer of tungsten oxide, optionally in a structured tungsten oxide layer, is described. The semiconductor element is characterized in that the relative premittivity of the tungsten oxide layer is higher than 50.
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公开(公告)号:DE10348007B4
公开(公告)日:2008-04-17
申请号:DE10348007
申请日:2003-10-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , FEHLHABER RODGER
IPC: H01L21/336 , H01L21/033 , H01L21/308 , H01L29/423 , H01L29/78 , H01L29/786
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公开(公告)号:DE102004044667A1
公开(公告)日:2006-03-16
申请号:DE102004044667
申请日:2004-09-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , HOLZ JUERGEN , SCHRUEFER KLAUS
IPC: H01L29/78 , H01L21/336
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公开(公告)号:DE102004033825A1
公开(公告)日:2006-02-09
申请号:DE102004033825
申请日:2004-07-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , BARTH HANS-JOACHIM
IPC: H01L21/02 , H01L21/768 , H01L21/822 , H01L27/08
Abstract: The invention relates to a method for producing a capacitor arrangement, and to a corresponding capacitor arrangement, wherein the first insulating layer is formed at the surface of a carrier substrate and a first capacitor electrode with a multiplicity of interspaced first interconnects is produced in said insulating layer. Using a mask layer, partial regions of the first insulating layer are removed for the purpose of uncovering the multiplicity of first interconnects, and after the formation of a capacitor dielectric at the surface of the uncovered first interconnects, a second capacitor electrode is formed with a multiplicity of interspaced second interconnects lying between the first interconnects coated with capacitor dielectric. This additionally simplified production method enables self-aligning and cost-effective production of capacitors having a high capacitance per unit area and mechanical stability.
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公开(公告)号:DE10230696B4
公开(公告)日:2005-09-22
申请号:DE10230696
申请日:2002-07-08
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , FEHLHABER RODGER
IPC: H01L29/423 , H01L21/28 , H01L21/336 , H01L21/8234 , H01L27/088 , H01L29/49 , H01L29/78 , H01L29/786
Abstract: A method for fabricating a short channel field-effect transistor is presented. A sublithographic gate sacrificial layer is formed, as are spacers at the side walls of the gate sacrificial layer. The gate sacrificial layer is removed to form a gate recess and a gate dielectric and a control layer are formed in the gate recess. The result is a short channel field-effect transistor with minimal fluctuations in the critical dimensions in a range below 100 nanometers.
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公开(公告)号:DE10348007A1
公开(公告)日:2005-05-25
申请号:DE10348007
申请日:2003-10-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , FEHLHABER RODGER
IPC: H01L21/033 , H01L21/308 , H01L21/336 , H01L29/423 , H01L29/786 , H01L29/78
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公开(公告)号:DE10348006A1
公开(公告)日:2005-05-25
申请号:DE10348006
申请日:2003-10-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT
IPC: H01L21/8242 , H01L27/108
Abstract: A field effect transistor is provided. The field effect transistor includes a channel region, electrically conductive channel connection regions, and a control region. The electrically conductive channel connection regions adjoin the channel region along with a transistor dielectric. The control region is separated from the channel region by the transistor dielectric. In addition, the control region may comprise a monocrystalline material.
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公开(公告)号:DE10260234A1
公开(公告)日:2004-07-15
申请号:DE10260234
申请日:2002-12-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , FEHLHABER RODGER
IPC: H01L21/28 , H01L21/8234 , H01L21/84 , H01L21/336
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公开(公告)号:AU2003289828A1
公开(公告)日:2004-07-14
申请号:AU2003289828
申请日:2003-12-09
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TEWS HELMUT , FEHLHABER RODGER
IPC: H01L21/28 , H01L21/8234 , H01L21/84 , H01L21/336
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