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    ELECTROLESS COPPER DEPOSITION SOLUTION
    41.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTION 未知

    公开(公告)号：AU4641779A

    公开(公告)日：1979-11-29

    申请号：AU4641779

    申请日：1979-04-24

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

    IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

    42.
    发明专利
    未知

    公开(公告)号：DE2166971A1

    公开(公告)日：1977-02-10

    申请号：DE2166971

    申请日：1971-01-25

    Applicant: MACDERMID INC

    Inventor： RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P ,  MERCEREAU MARK

    IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02 ,  B41M3/08 ,  C25D7/00 ,  H01B5/14

    Abstract: 1343211 Treating plastics; electroless plating MACDERMID Inc 11 Jan 1971 [26 Jan 1970] 1276/71 Heading C7F A moulded polymerised epoxy- or phenolicbase resin reinforced with fibre-glass cloth is prepared for electroless plating, e.g. in printed circuit manufacture, by applying a 0À001 to 0À005 inch thermoset resin coating, treating with a dipolar aprotic organic liquid selected from where R 1 = H or C 1 -C 5 alkyl, R 2 = C 1 -C 5 alkyl where R 3 = H or C 1 - C 3 alkyl, R 4 and R 5 are H or C 1 - C 5 alkyl, and where R 6 = C 1 - C 5 alkyl, treating with an aqueous hexavalent chromium solution, catalysing with an aqueous precious metal solution, and heating the catalysed surface to a temperature above ambient but insufficient to char the resin. Typical process steps are (1) coat the substrate with resin and immerse in said liquid (2) immerse in chromic/ sulphuric acid solution (3) catalyze, either with SnCl 2 / PdCl 2 or Sn - Pd hydrosol, (4) either (a) apply electroless metal and (b) apply negative resist or (c) apply and develop negative resist (5) (further) metal deposition, followed by removal of resist (and unwanted metal, if steps 4(a) and (b) were used), the heating step following any of steps (3), (4) a, b, or c or (5). Examples are given in flow-sheet form; electrolessly deposited metal such as Cu or Ni may be thickened electrolytically with Cu or Ni or protected with electrolytic solder, which may be removed from contact areas to allow plating, e.g. with Au or Ag.

    OXIDIZING ACCELERATOR
    47.
    发明专利
    OXIDIZING ACCELERATOR 未知

    公开(公告)号：CA1222663A

    公开(公告)日：1987-06-09

    申请号：CA456946

    申请日：1984-06-19

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  SAWOSKA DAVID

    IPC: C23C18/18 ,  C23C18/28 ,  H05K3/42 ,  C23C18/30

    Abstract: OXIDIZING ACCELERATOR A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.

    ELECTROLESS COPPER DEPOSITION SOLUTIONS
    50.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTIONS 未知

    公开(公告)号：CA1163056A

    公开(公告)日：1984-03-06

    申请号：CA393444

    申请日：1981-12-30

    Applicant: MACDERMID INC

    Inventor： FERRIER DONALD R ,  RHODENIZER HAROLD L ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

    IPC: C23C3/02

    Abstract: Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a nonformaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140.degree. to 160.degree.F); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.

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