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公开(公告)号：JPWO2005085334A1
公开(公告)日：2007-12-13
申请号：JP2006510636
申请日：2005-02-18
Applicant: ポリマテック株式会社
Inventor： 飛田 雅之 , 雅之 飛田 , 木村 亨 , 木村 亨 , 青木 恒 , 恒 青木 , 下山 直之 , 直之 下山 , 石垣 司 , 司 石垣 , 越智 光一 , 光一 越智 , 原田 美由紀 , 美由紀 原田
IPC: C08J5/04 , B32B15/08 , B32B27/04 , B32B27/38 , C08G59/28 , C08G59/50 , C08J5/24 , C08K7/02 , C08L63/00 , H05K1/03 , H05K3/00
CPC classification number: C08G59/28 , B32B15/08 , B32B15/092 , B32B15/20 , B32B27/04 , B32B27/18 , B32B27/38 , B32B2250/03 , B32B2250/40 , B32B2274/00 , B32B2307/202 , B32B2307/206 , B32B2457/08 , C08G59/5033 , C08J5/24 , C08J2363/00 , C08K7/02 , H05K1/0366 , H05K2201/0129 , H05K2201/0141 , H05K2201/0287 , H05K2201/029 , H05K2201/068 , Y10T428/249924 , C08L63/00
Abstract: エポキシ樹脂または熱可塑性高分子と、繊維とから形成されるエポキシ樹脂複合成形体または熱可塑性高分子複合成形体。該成形体中において、前記繊維が第1の平面に沿って配置されており、前記エポキシ樹脂または熱可塑性高分子の分子鎖は第1の平面に交わる方向に配向されている。前記エポキシ樹脂または熱可塑性高分子の分子鎖の配向度αが、0.5以上1.0未満の範囲である。第1の平面に沿った方向および第1の平面に交わる方向における該成形体の熱膨張係数は、いずれも5×10−6〜50×10−6(/K)であり、かつ第1の平面に沿った方向における熱膨張係数と第1の平面に交わる方向における熱膨張係数との差が30×10−6(/K)以下である。
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公开(公告)号：KR1020010015861A
公开(公告)日：2001-02-26
申请号：KR1020007005978
申请日：1998-11-27
Applicant: 폴리에이탄 콤포지트스 리미티드
CPC classification number: H05K1/0366 , B32B27/02 , C08J5/04 , H05K1/028 , H05K1/032 , H05K1/0393 , H05K2201/0129 , H05K2201/0158 , H05K2201/0278 , H05K2201/0287 , H05K2201/0293 , H05K2203/1105 , Y10S428/901 , Y10T428/24917 , Y10T428/249941 , Y10T428/249942 , Y10T428/31681 , Y10T442/3415 , Y10T442/656
Abstract: 본발명은인쇄회로판또는안테나기재에서사용하기위한초고분자량폴리에틸렌(UHMWPE) 복합체(12)에관한것이다. 기재는초고분자량폴리에틸렌복합체(12)로구성되는하나이상의유전층및 전기전도성물질로구성되는하나이상의전기전도층(16)을포함하며; 상기유전층과전기전도층은서로친밀하게결합된다.
Abstract translation: 本发明涉及用于印刷电路板或天线基底的超高分子量聚乙烯（UHMWPE）复合材料（12）。 该基材包括至少一个由超高分子量聚乙烯复合材料（12）组成的介电层和至少一个由导电材料组成的导电层（16） 介电层和导电层彼此紧密结合。
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公开(公告)号：US09872383B1
公开(公告)日：2018-01-16
申请号：US14266636
申请日：2014-04-30
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Zhen Feng
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.
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公开(公告)号：US20120097431A1
公开(公告)日：2012-04-26
申请号：US13339244
申请日：2011-12-28
Applicant: Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
Inventor： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。
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公开(公告)号：US20100136284A1
公开(公告)日：2010-06-03
申请号：US12594165
申请日：2008-03-26
Applicant: Masaaki Harazono , Masaharu Shirai , Katsura Hayashi
Inventor： Masaaki Harazono , Masaharu Shirai , Katsura Hayashi
CPC classification number: C08J5/04 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , H05K2201/0296 , Y10T428/24099 , Y10T428/24149 , Y10T428/24994
Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.
Abstract translation: 提供了一种纤维增强树脂，其包括层叠多个单丝层20,21和22的纤维束2，每个单丝层包括沿一个方向布置的多根单丝23和粘合剂3 纤维束2的单丝23一起，纤维束2具有蜂窝状的截面。
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Patent Agency Ranking
公开(公告)号：US07667142B2
公开(公告)日：2010-02-23
申请号：US10921616
申请日：2004-08-18
Applicant: Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
Inventor： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
IPC: H05K1/09
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。
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公开(公告)号：US07635815B2
公开(公告)日：2009-12-22
申请号：US10921649
申请日：2004-08-18
Applicant: Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
Inventor： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
IPC: H05K1/03
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
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48.发明申请Polymer composite formed article, printed wiring board using the formed article, and methods of producing them 审中-公开高分子复合成型体，使用成形体的印刷线路板及其制造方法公开(公告)号：US20070116938A1
公开(公告)日：2007-05-24
申请号：US10582558
申请日：2005-02-18
Applicant: Masayuki Tobita , Toru Kimura , Hisashi Aoki , Naoyuki Shimoyama , Tsukasa Ishigaki , Mitsukazu Ochi , Miyuki Harada
Inventor： Masayuki Tobita , Toru Kimura , Hisashi Aoki , Naoyuki Shimoyama , Tsukasa Ishigaki , Mitsukazu Ochi , Miyuki Harada
IPC: D04H13/00
CPC classification number: C08G59/28 , B32B15/08 , B32B15/092 , B32B15/20 , B32B27/04 , B32B27/18 , B32B27/38 , B32B2250/03 , B32B2250/40 , B32B2274/00 , B32B2307/202 , B32B2307/206 , B32B2457/08 , C08G59/5033 , C08J5/24 , C08J2363/00 , C08K7/02 , H05K1/0366 , H05K2201/0129 , H05K2201/0141 , H05K2201/0287 , H05K2201/029 , H05K2201/068 , Y10T428/249924 , C08L63/00
Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (a) of orientation in a range of 0.5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5×10−6 to 50×10−6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30×10−6 (/K) or less.
Abstract translation: 由热塑性聚合物或热塑性聚合物和纤维形成的热塑性聚合物复合成型制品或热塑性聚合物复合成型制品，其中纤维沿着第一平面布置，热塑性聚合物或热塑性聚合物的分子链定向于 方向与第一平面相交，并且热塑性聚合物或热塑性聚合物的分子链具有在0.5以上且小于1.0的范围内的取向度（a），并且其中所述成型制品的热膨胀系数在 沿着第一平面和与第一平面相交的方向的方向均为5×10 -6〜50×10 -6（/ K），热膨胀系数 沿着第一平面的方向和与第一平面相交的方向的热膨胀系数为30×10 -6（/ K）以下。
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公开(公告)号：US06869664B2
公开(公告)日：2005-03-22
申请号：US10020506
申请日：2001-12-11
Applicant: Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
Inventor： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
IPC: C08J5/24 , B32B5/26 , B32B27/04 , C08K3/38 , C08K9/08 , H05K1/02 , H05K1/03 , H05K3/42 , H05K3/44 , H05K3/46 , B32B15/00
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
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公开(公告)号：US20020157859A1
公开(公告)日：2002-10-31
申请号：US10020506
申请日：2001-12-11
Inventor： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
IPC: H05K001/00
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。
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