公开(公告)号：EP2172089A1

公开(公告)日：2010-04-07

申请号：EP08779797.3

申请日：2008-06-23

Applicant: Tessera, Inc.

Inventor： HABA, Belgacem

IPC: H05K3/46

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0384 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming contacts for an interconnection element, includes (a) joining a conductive element to an interconnection element having multiple wiring layers, (b) patterning the conductive element to form conductive pins, and (c) electrically interconnecting the conductive pins with conductive features of the interconnection element. A multiple wiring layer interconnection element having an exposed pin interface, includes an interconnection element having multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the interconnection element, a plurality of conductive pins protruding in a direction away from the first face, and metal features electrically interconnecting the conductive features with the conductive pins.

公开(公告)号：EP1830611A4

公开(公告)日：2009-06-24

申请号：EP05807092

申请日：2005-11-18

Applicant: MULTI INC ,  TOYO KOHAN CO LTD

Inventor： WATANABE MITSUHIRO ,  SAIJO KINJI ,  OHSAWA SHINJI ,  YOSHIDA KAZUO ,  NANBU KOJI

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/06 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/427 ,  H05K1/0265 ,  H05K1/116 ,  H05K3/062 ,  H05K3/20 ,  H05K3/4658 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/1476 ,  Y10T156/10

Abstract: A printed wiring board which can equalize as much as possible the circuit widths of a signal transmission circuit and a power supplying circuit or the like that have required designs of circuit widths to be different significantly and which can be substantially downsized, and a production method therefor, wherein the printed wiring board can be obtained by etching a metal clad laminate plate containing a conductive layer and an insulation layer, and the printed wiring board, where a first circuit and a second circuit formed on the same reference flat surface and being different in thickness coexist, is used. The printed wiring board is characterized in that the first circuit or the second circuit, whichever is thicker, has a clad form where three layers, a first copper layer/a metal-of-different-kind layer/a second copper layer, are sequentially laminated one upon another. The production method for the printed wiring board is characterized by using as a starting material a clad composite material in which three layers, a first copper layer/a metal-of-different-kind layer/a second copper layer, are sequentially laminated one upon another, and by effectively using etching characteristics selecting between the metal-of-different-kind layer and a copper layer.

公开(公告)号：EP1111975A4

公开(公告)日：2005-10-26

申请号：EP99931469

申请日：1999-07-22

Applicant: TOYO KOHAN CO LTD

Inventor： SAIJO KINJI ,  YOSHIDA KAZUO ,  OHSAWA SHINJI

IPC: H05K3/06 ,  H05K3/20 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/062 ,  H05K3/20 ,  H05K3/44 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10S428/901 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/24917

Abstract: A method of manufacturing a multilayered printed-circuit board and a low-cost clad board. Copper foil layers (19, 24, 33) for forming conductor layers (10, 17, 18) and nickel plating layers (20, 21) for forming etch stop layers (11, 12) are alternately stacked and compressed to form a clad board (34) for a printed-circuit board. The clad board (34) for the printed-circuit board is selectively etched to manufacture a base. External conductor layers (15, 16) are formed on the surface of the base and patterned. The conductor layers (10, 15, 16) are interconnected electrically through conductors blocks (17, 18) formed by etching the copper foil layers (19, 24, 33) and the nickel plating layers (20, 21) to complete the manufacture of multilayered printed-circuit board.

Abstract translation: 在本发明中，其产生用于多层印刷电路板能够被经济地制造，并具有优良性能的包覆板，使用它们的多层印刷电路板及其制造方法，多层印刷电路板是通过形成包层板制造 为通过层叠铜箔19，24，33将被形成为导体层10，17，18和镀镍20，21，它们将被蚀刻停止层，并同时压接二者的多层印刷电路板34， 通过选择性地蚀刻用于多层印刷电路板34包层板，所述基体的表面上形成外导体层15,16，同时使这种图案化和电通过插入柱状导体17之间的导体层10，15，16连接产生一个基 通过蚀刻铜箔19，24，33和镀镍20 18形成，21

公开(公告)号：EP1204304B1

公开(公告)日：2004-12-29

申请号：EP01125895.1

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Achari, Achyuta ,  Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R.

IPC: H05K1/09 ,  H05K3/02 ,  B23K35/00 ,  B23K20/233

CPC classification number: B32B15/018 ,  B32B15/017 ,  C23C2/26 ,  C23C2/28 ,  C23C26/00 ,  H05K3/022 ,  H05K2201/0361

公开(公告)号：EP1377145A1

公开(公告)日：2004-01-02

申请号：EP02707177.8

申请日：2002-03-27

Applicant: North Corporation

Inventor： IIJIMA, Tomoo, c/o NORTH CORPORATION ,  KATO, Yoshiro, c/o NORTH CORPORATION ,  ODAIRA, Hiroshi, c/o NORTH CORPORATION ,  OHSAWA, Masayuki, c/o NORTH CORPORATION ,  KUROSAWA, Inetaro, c/o NORTH CORPORATION ,  SAKUMA, Kazuo, c/o NORTH CORPORATION ,  ASANO, Toshihiko, c/o NORTH CORPORATION ,  ENDO, Kimitaka, c/o NORTH CORPORATION

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4647 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/025 ,  H05K3/06 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1157

Abstract: A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.

Abstract translation: 多层金属板的多个（1）各包括一个凸块的形成金属层（2）的蚀刻停止层（3），和布线的成膜金属层（4），和（其中的布线成膜 图4a）从布线膜形成金属层形成，并且凸块2a从凸点形成金属层形成的准备，并在凸点形成多层金属板，另一种多层金属板的布线电影的表面 重叠。 搜索层压工艺接连重复了多层次感。 此外，抛光机进行多层布线基板（11A），其包括金属板保持装置（13）用于保持金属板（1a）中，刀具保持装置（25），用于保持一个切割器（26）的金属板的上方 ，高度调节机构（20），用于调节刀具保持装置的高度，以及用于平行移动切割器相对保持装置在金属板的表面平行刀具移动机构（15）被用来进行抛光。

公开(公告)号：EP1026928A3

公开(公告)日：2003-02-05

申请号：EP00300553.5

申请日：2000-01-26

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandial

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/062 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  Y02P70/611

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface (10), a plurality of tri-metal-layer bond pads (12) arranged in a generally straight row on the substrate surface (10) wherein the row defines a width direction therealong, and a circuit trace (20) arranged on the substrate surface (10), wherein the circuit trace (20) runs between two adjacent ones (22) of the plurality of tri-metal-layer bond pads (12). Each bond pad (12) comprises: (1) a bottom layer (14) attached to the substrate surface (10), the bottom layer (14) being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer (18) disposed above and generally concentric with the bottom layer (14), the top layer (18) being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer (16) made of a second metal connecting the bottom layer (14) and the top layer (18). The bond pads (12) are specially shaped such that W2 > W1 for at least the two adjacent bond pads (12), thus enabling the circuit trace (20) to be spaced closely to the bottom layers (14) of the two adjacent bond pads (12), while allowing the top layers (18) of the pads (12) to be made much larger so as to avoid delamination thereof from their associated middle layers (16).

公开(公告)号：EP0926266B1

公开(公告)日：2002-10-16

申请号：EP98310448.0

申请日：1998-12-18

Applicant: Ford Motor Company

Inventor： Paruchuri, Mohan R. ,  Achari, Achyuta

IPC: C23F1/36

CPC classification number: C23F1/36 ,  H05K3/062 ,  H05K3/067 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: An etchant useful for chemically milling aluminium from tri-metal layers of copper-aluminium-copper being copper circuit patterns present on opposing surfaces of an aluminium foil, one of the copper patterns being laminated onto a substrate, the etchant comprising an aqueous solution of: (1) 60 to 500 g/l base selected from (a) sodium hydroxide, (b) potassium hydroxide, and (c) their mixture; and (2) 30 to 500 g/l of a nitrite salt, borate salt, a bromate salt, or a mixture of any of them.

公开(公告)号：EP1342564A4

公开(公告)日：2010-03-03

申请号：EP01972690

申请日：2001-10-04

Applicant: TOYO KOHAN CO LTD

Inventor： SAIJO KINJI ,  YOSHIDA KAZUO ,  OKAMOTO HIROAKI ,  OHSAWA SHINJI

IPC: B23K20/00 ,  B23K20/04 ,  B23K20/14 ,  B32B15/01 ,  H05K3/02 ,  H05K3/06 ,  B23K20/16 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/025 ,  B23K20/04 ,  B32B15/01 ,  H05K3/062 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0384 ,  H05K2203/068 ,  Y10T428/12 ,  Y10T428/12438 ,  Y10T428/12896 ,  Y10T428/12979

公开(公告)号：EP1342564A1

公开(公告)日：2003-09-10

申请号：EP01972690.0

申请日：2001-10-04

Applicant: Toyo Kohan Co., Ltd.

Inventor： SAIJO, Kinji, TOYO KOHAN CO., LTD ,  YOSHIDA, Kazuo, TOYO KOHAN CO. LTD. ,  OKAMOTO, Hiroaki, TOYO KOHAN CO., LTD. ,  OHSAWA, Shinji, TOYO KOHAN CO., LTD.

IPC: B32B15/01 ,  B23K20/04 ,  B23K20/16 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/025 ,  B23K20/04 ,  B32B15/01 ,  H05K3/062 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0384 ,  H05K2203/068 ,  Y10T428/12 ,  Y10T428/12438 ,  Y10T428/12896 ,  Y10T428/12979

Abstract: An adhesive-free multilayered metal laminate having a g iven thickness which is obtained by bonding a metal sheet ha ving a thin metal film on a surface thereof to a metal foil w ithout using an adhesive; and a process for continuously pro ducing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; se tting a metal foil on a reel for metal foil unwinding; unwin ding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a fi rst thin metal film on the metal sheet surface; unwinding th e metal foil from the metal foil-unwinding reel and activati ng a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of th e second thin metal film so that the first thin metal film fo rmed on the metal sheet is in contact with the second thin me tal film formed on the metal foil.

Abstract translation: 一种无粘合剂的多层金属层压板，其具有通过使用粘合剂将金属薄片在其表面上的薄金属薄膜粘合到金属箔而获得的厚度; 以及连续地生产层压板的方法。 该方法包括以下步骤： 在金属板退绕卷轴上设置金属片; 在金属箔退绕的卷轴上放置金属箔; 从金属板退绕卷轴上取下金属片并激活金属片的表面，从而在金属片表面上形成第一薄金属膜; 从金属箔退绕卷轴展开金属箔并活动金属箔的表面，从而在金属箔表面上形成第二薄金属膜; 并且将第一薄金属膜的活化表面压接到第二薄金属膜的活化表面，使得在金属片上形成的第一薄金属膜与形成在金属箔上的第二薄膜接触 。

公开(公告)号：EP1204304A3

公开(公告)日：2002-12-11

申请号：EP01125895.1

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Achari, Achyuta ,  Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R.

IPC: H05K1/09 ,  H05K3/02 ,  B23K35/00 ,  B23K20/233

CPC classification number: B32B15/018 ,  B32B15/017 ,  C23C2/26 ,  C23C2/28 ,  C23C26/00 ,  H05K3/022 ,  H05K2201/0361

Abstract: A tri-metallic material (10) for use in the manufacture of printed circuit boards is described and the process for its manufacture is described. The tri-metallic material (10) is a sandwich wherein a copper layer (18,20) is essential the "bread" of the sandwich and an aluminum layer (12) is the filling between both slices of bread. A metallic bonding and/or barrier layer (30,32) is spread on the aluminum (12) and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.