Abstract:
A printed circuit board is provided to suppress the generation of electromagnetic wave more efficiently by differentiating a signal layer and a ground layer according to a switching speed of a signal to process an electronic element. A printed circuit board(10) includes an external ground layer(11), an insulating material(12), a power layer(13), and at least one signal layer(15). The external ground layer is placed at any one layer among two most external layers. The signal layer is placed at the other layer among the two most external layers. The power layer is formed between the signal layer and the external ground layer. An electronic component having a relatively slow clock signal speed among the mounted electronic components is connected to the external ground layer and an electronic component having a relatively rapid clock signal speed is connected to an intermediate ground layer.
Abstract:
본 발명은 방열기판으로, 금속 플레이트; 상기 금속 플레이트의 표면에 형성된 절연막; 상기 절연막 상에 형성된 회로패턴; 및 상기 금속 플레이트를 적어도 일부 관통하여 상기 금속 플레이트와 상기 회로패턴을 전기적으로 연결하는 제1 비아를 포함하여, 방열효과가 뛰어나고 그라운드층과 전원층을 별도로 구비할 필요가 없어 회로기판의 구조가 단순하다. 방열기판, 비아, 전원층, 그라운드층, 알루미늄, 아노다이징 처리
Abstract:
본 발명은 전원부와 그라운드부를 기판 내의 각 층에 효율적으로 배치하여, 일반 신호선과 차동 신호선의 양방에 대하여 최적의 임피던스 특성을 달성할 수 있는 다층 배선 기판 및 반도체 장치를 제공하는 것을 과제로 한다. 일반 신호선(1-1, 1-2, 1-3, 1-4)과 차동 신호선(4-1, 4-1)을 다른 면에 배치한다. 차동 신호선이 배치되는 면에 있어서 차동 신호선을 제1영역에 배치하고, 제2영역에 전원 플레인(12-1, 12-3)과 그라운드 플레인 중의 어느 한쪽을 배치한다. 일반 신호선을 제2영역의 수직 방향으로 적층된 상태에서 배치함으로써, 일반 신호선 및 차동 신호선의 양방을 전원 플레인과 그라운드 플레인 사이에 배치한다. 그라운드 플레인, 전원 플레인
Abstract:
According to some embodiments, a device includes a first conductive plane electrically coupled to a first terminal associated with a first polarity and a second terminal associated with the first polarity, a second conductive plane electrically coupled to a third terminal associated with a second polarity, and a dielectric disposed between the first conductive plane and the second conductive; plane. A first capacitance is present between the first terminal and the third terminal, a second capacitance is present between the second terminal and the third terminal, and the first capacitance and the second capacitance may be substantially dissimilar.
Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Abstract:
A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Abstract:
A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference ("EMI"). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.
Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Abstract:
A printed circuit board intended for mounting at least one integrated circuit (1) and associated decoupling capacitors (21, 22) on the same surface of the printed circuit board. The printed circuit board comprises a stack of alternate conductive and insulating layers (81-87). One of the conductive layers (81) is arranged as a first power plane. The other conductive layers (83, 85, 87) are patterned and provided with signal tracks (831, 851, 871, 872). The stack of layers includes contact holes (91, 92) connected to the first power plane (81), which are arranged for being connected to decoupling capacitors (21, 22). At least one (83) of the patterned conductive layers locally provides at least one second power plane (833) under that part of the aforesaid surface of the printed circuit board which is arranged for mounting an integrated circuit (1) thereon, and furthermore it includes power tracks (832), which form part of connecting means which are arranged for being connected to decoupling capacitors (21, 22) or which make up the connecting means (93, 94). The integrated circuit (1) can be a BGA-type integrated circuit, and the printed circuit board comprising components mounted thereon can be used advantageously in a single-chip cabel modem.
Abstract:
Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the signal conductor can include a first part routed over the major surface of a first side of the reference plane structure on a first side of the void and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of the reference plane structure on a second side of the void and that approaches a second edge of the reference plane structure with a second trajectory, and a third portion connecting the first portion with the second portion, the third portion spanning the void, and having a plurality of spurs extending from a body of the third portion.