公开(公告)号：US07205230B2

公开(公告)日：2007-04-17

申请号：US10914227

申请日：2004-08-10

Applicant: Naohiro Mashino

Inventor： Naohiro Mashino

IPC: H01L21/44

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate with a through-hole penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots, around a metal-less portion of the plated metal, such as a dimple or seam, at positions corresponding to the openings of the through-hole, so that the a part of the plated metal melts to fill the metal-less portion with the molten metal.

Abstract translation: 一种制造布线板的方法，包括由绝缘材料制成并具有第一和第二表面的基底，分别形成在第一和第二表面上的第一和第二导体图案，以及穿过基板的通孔导体，以将第一导体 图案与第二导体图案; 该方法包括以下步骤：用穿透其的通孔形成基底并分别在第一和第二表面处限定开口; 用金属电镀基板，使得在基板的相应的第一和第二表面上形成具有预定厚度的金属层，并且通孔基本上填充有作为通孔导体的金属; 在对应于通孔的开口的位置处，将激光束作为多个点照射在电镀金属的无金属部分（例如凹坑或接缝）周围，使得电镀金属的一部分 熔化以用熔融金属填充无金属部分。

公开(公告)号：US06569708B2

公开(公告)日：2003-05-27

申请号：US09847607

申请日：2001-05-02

Applicant: Tomohiro Kawashima

Inventor： Tomohiro Kawashima

IPC: H01L2144

CPC classification number: H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/68377 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H05K3/062 ,  H05K3/3436 ,  H05K2201/0338 ,  H05K2201/1025 ,  H05K2201/10977 ,  H05K2203/0384 ,  Y02P70/613

Abstract: First, there are prepared a semiconductor chip with a group of solder bumps disposed on and joined to a surface thereof in a predetermined pattern, and a multilayer plate including a second layer as an electrically conductive layer and first and third layers disposed on respective opposite surfaces of the second layer and comprising metal layers of one metal. Then, the first layer and the third layer of the multilayer plate are etched in a predetermined pattern to form a first group of posts and a second group of posts which have a pattern identical to the pattern of the group of solder bumps. Then, semiconductor chip is positioned to hold the solder bumps in contact with the posts of the first group, and the solder bumps are melted to join the solder bumps to the posts of the first group. Thereafter, the second layer is cut between the posts of the first and second groups, producing separate multilayer posts.

Abstract translation: 首先，准备具有以规定图案配置在其表面上并与其接合的一组焊料凸块的半导体芯片，以及包括作为导电层的第二层的多层板和设置在相应的相对表面上的第一和第三层 的第二层并且包括一种金属的金属层。 然后，以预定图案蚀刻多层板的第一层和第三层，以形成具有与该组焊料组的图案相同的图案的第一组柱和第二组柱。 然后，将半导体芯片定位成保持与第一组的柱接触的焊料凸块，并且焊料凸块熔化以将焊料凸块接合到第一组的柱。 此后，在第一组和第二组的柱之间切割第二层，产生单独的多层柱。

公开(公告)号：US20030062196A1

公开(公告)日：2003-04-03

申请号：US09970170

申请日：2001-10-03

Inventor： Tina Barcley ,  Steven G. McNeal ,  Elias D. Lebbos ,  Keith B. Carle

IPC: H05K001/16

CPC classification number: H05K3/44 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4084 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/10666

Abstract: A circuit board includes a first layer of an electrically non-conducting material for carrying circuit components, and a second layer of an electrically conductive material for providing a common ground. At least one spot of a relatively more solderable material than the material of the second layer is in electrical contact with the second layer and is aligned with an opening through the first layer so that electrical connection can be made between the components on the first layer and the second layer by soldering to the spot. These anchor points provide a reliable way to connect circuit components to a common ground, from the top of the circuit board, without having to use backside screws and without having to penetrate the second layer.

Abstract translation: 电路板包括用于承载电路部件的非导电材料的第一层和用于提供公共地面的导电材料的第二层。 与第二层的材料相比，可焊接材料的至少一个点与第二层电接触并且与通过第一层的开口对准，使得可以在第一层上的部件和 第二层通过焊接到现场。 这些固定点提供了将电路部件从电路板的顶部连接到公共接地的可靠方式，而不必使用背面螺钉，而不必穿透第二层。

公开(公告)号：US20030019664A1

公开(公告)日：2003-01-30

申请号：US10196027

申请日：2002-07-16

Inventor： Kurt Gross ,  Hans Rappl

IPC: H05K007/04 ,  H05K007/02 ,  H05K003/42

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/308 ,  H05K3/44 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/49147 ,  Y10T29/49153 ,  H01L2924/00

Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

Abstract translation: 在布置在导电支撑板（1）的电子电路（S）和支撑板（1）之间通过提供一个孔（4,5）而产生导电接合连接（B） 具有可粘合表面（3）的元件（2）以支撑板（1）和接合元件（2）进入导电和摩擦连接的方式被按压; 随后用接合元件（2）产生接合连接。

公开(公告)号：EP2913584A4

公开(公告)日：2016-07-13

申请号：EP13849558

申请日：2013-09-03

Applicant: TOSHIBA LIGHTING & TECHNOLOGY

Inventor： HINO KIYOKAZU ,  KURIHARA TAKAHIRO

IPC: F21V23/00 ,  F21S8/10 ,  F21V19/00 ,  F21V23/06 ,  F21Y105/00 ,  H01L33/00 ,  H01R4/02 ,  H01R12/58 ,  H01R43/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21S48/212 ,  F21S48/232 ,  F21S48/33 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.

Abstract translation: 根据本实施例的发光器件包括其上设置有布线部分的基板; 发光元件，其设置在所述基板上并与所述布线部电连接; 从外部供给电力的供给部; 第一连接部，其设置在所述基板上并电连接到所述布线部; 第二连接部，其通过焊接接合到第一连接部，并且包括第一开口部，进给部插入该第一开口部; 以及设置在第一开口部和供给部之间的焊接部。

公开(公告)号：EP0297511A3

公开(公告)日：1991-03-13

申请号：EP88110305.5

申请日：1988-06-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LIMITED

Inventor： Sasame, Akira c/o Itami Works of Sumitomo ,  Sakanoue, Hitoyuki c/o Itami works of Sumitomo ,  Tekeuchi, Hisao c/o Itami works of Sumitomo ,  Miyake, Masaya c/o Itami works of Sumitomo ,  Yamakawa, Akira c/o Itami works of Sumitomo ,  Yushio, Yasuhisa c/o Itami works of Sumitomo ,  Akazawa, Hitoshi c/o Itami works of Sumitomo

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/14 ,  H01L23/08 ,  H01L23/10

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  Y10T428/12576 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A connection structure between lead frames (3) and a base plate (1) of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus, comprises the base plate formed of a sintered body of aluminum nitride on which a semiconductor device is to be mounted, the lead frames including, as a main material, iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and silver solder (9) for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is formed of oxygen-free copper of a high plastic deformativity to relieve, by plastic deformation of itself, a thermal stress caused by a difference between a thermal expansion coefficient of the base plate and that of the lead frame in a cooling process at the time of soldering. Preferably, only a portion of each lead frame (3) to be joined to the base plate comprises an inner layer portion of iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and an outer layer portion of oxygen-free copper.

公开(公告)号：EP0083503B1

公开(公告)日：1989-03-01

申请号：EP82306966.1

申请日：1982-12-24

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. ,  Berg, James G.

IPC: H01R4/04

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H01L2924/00

公开(公告)号：EP0232127A2

公开(公告)日：1987-08-12

申请号：EP87300770.2

申请日：1987-01-29

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Hagiwara, Yoshichi c/o Minnesota Mining and ,  Tanaka, Kenji c/o Minnesota Mining and ,  Kimura, Naoya c/o Minnesota Mining and ,  Emori, Kenji c/o Minnesota Mining and ,  Kawamoto, Yoshitaka c/o Minnesota Mining and

IPC: H01R4/04 ,  H01R23/68 ,  H05K3/40

CPC classification number: H01R4/04 ,  H01R12/7076 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/1025

Abstract: The present invention provides an anisotropic electrically-conductive film connector comprising a conductive layer (2) and an adhesive layer (1) provided on at least one surface of the conductive layer, the conductive layer having a plurality of conductive elements (3) electrically independent of each other, wherein, each of the conductive elements comprises a metal material having a substantially uniform thickness.
The present invention also provides an anisotropic electrically-conductive film connector which has a metal material which is uneven on its junction side surface.

Abstract translation: 本发明提供一种各向异性导电膜连接器，其包括导电层（2）和设置在导电层的至少一个表面上的粘合层（1），所述导电层具有多个导电元件（3），电独立 其中，每个导电元件包括​​具有基本均匀厚度的金属材料。 本发明还提供一种各向异性导电膜连接器，其具有在其接合侧表面上不均匀的金属材料。

公开(公告)号：EP1511367B1

公开(公告)日：2011-07-06

申请号：EP04254904.8

申请日：2004-08-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Mashino, Naohiro, c/o Shinko Electric Industries Co., Ltd.

IPC: H05K3/42 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

公开(公告)号：EP2256801A2

公开(公告)日：2010-12-01

申请号：EP10003118.6

申请日：2010-03-24

Applicant: Semikron Elektronik GmbH & Co. KG Patentabteilung

Inventor： Mauer, Peter

IPC: H01L23/48 ,  H05K3/32

CPC classification number: H05K3/4015 ,  H01L23/48 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09745 ,  H05K2201/1025 ,  H01L2924/00

Abstract: Es wird eine Kontakteinrichtung für ein Leistungshalbleitermodul beschrieben, die ein federndes Kontaktelement mit einem Kontaktierungs-Endabschnitt (18) aufweist, der zur Kontaktierung mit einem Anschlusselement (14) eines ebenen Schaltungsträgers (12) des Leistungshalbleitermoduls vorgesehen ist. Der Kontaktierungs-Endabschnitt (18) ist geradlinig stiftförmig ausgebildet und das Anschlusselement (14) weist ein Chipbauteil (10) auf, das mit einer Zentriervertiefung (16) für den Kontaktierungs-Endabschnitt (18) des federnden Kontaktelementes ausgebildet ist.

Abstract translation: 该装置具有弹性接触元件，该弹性接触元件包括接触端部分（18），该接触端部分（18）设置成与互连装置（12）的连接元件（14）连接。 由氧化铝制成的功率半导体模块的衬底，其中连接元件具有用于端部的具有定心凹槽（16）的芯片部件（10）。 芯片组件被设计为自动表面安装的器件组装部件，并完全由金属制成，其中芯片部件设置有电镀（20）。