Abstract:
A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate with a through-hole penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots, around a metal-less portion of the plated metal, such as a dimple or seam, at positions corresponding to the openings of the through-hole, so that the a part of the plated metal melts to fill the metal-less portion with the molten metal.
Abstract:
First, there are prepared a semiconductor chip with a group of solder bumps disposed on and joined to a surface thereof in a predetermined pattern, and a multilayer plate including a second layer as an electrically conductive layer and first and third layers disposed on respective opposite surfaces of the second layer and comprising metal layers of one metal. Then, the first layer and the third layer of the multilayer plate are etched in a predetermined pattern to form a first group of posts and a second group of posts which have a pattern identical to the pattern of the group of solder bumps. Then, semiconductor chip is positioned to hold the solder bumps in contact with the posts of the first group, and the solder bumps are melted to join the solder bumps to the posts of the first group. Thereafter, the second layer is cut between the posts of the first and second groups, producing separate multilayer posts.
Abstract:
A circuit board includes a first layer of an electrically non-conducting material for carrying circuit components, and a second layer of an electrically conductive material for providing a common ground. At least one spot of a relatively more solderable material than the material of the second layer is in electrical contact with the second layer and is aligned with an opening through the first layer so that electrical connection can be made between the components on the first layer and the second layer by soldering to the spot. These anchor points provide a reliable way to connect circuit components to a common ground, from the top of the circuit board, without having to use backside screws and without having to penetrate the second layer.
Abstract:
An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).
Abstract:
A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.
Abstract:
A connection structure between lead frames (3) and a base plate (1) of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus, comprises the base plate formed of a sintered body of aluminum nitride on which a semiconductor device is to be mounted, the lead frames including, as a main material, iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and silver solder (9) for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is formed of oxygen-free copper of a high plastic deformativity to relieve, by plastic deformation of itself, a thermal stress caused by a difference between a thermal expansion coefficient of the base plate and that of the lead frame in a cooling process at the time of soldering. Preferably, only a portion of each lead frame (3) to be joined to the base plate comprises an inner layer portion of iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and an outer layer portion of oxygen-free copper.
Abstract:
The present invention provides an anisotropic electrically-conductive film connector comprising a conductive layer (2) and an adhesive layer (1) provided on at least one surface of the conductive layer, the conductive layer having a plurality of conductive elements (3) electrically independent of each other, wherein, each of the conductive elements comprises a metal material having a substantially uniform thickness. The present invention also provides an anisotropic electrically-conductive film connector which has a metal material which is uneven on its junction side surface.
Abstract:
Es wird eine Kontakteinrichtung für ein Leistungshalbleitermodul beschrieben, die ein federndes Kontaktelement mit einem Kontaktierungs-Endabschnitt (18) aufweist, der zur Kontaktierung mit einem Anschlusselement (14) eines ebenen Schaltungsträgers (12) des Leistungshalbleitermoduls vorgesehen ist. Der Kontaktierungs-Endabschnitt (18) ist geradlinig stiftförmig ausgebildet und das Anschlusselement (14) weist ein Chipbauteil (10) auf, das mit einer Zentriervertiefung (16) für den Kontaktierungs-Endabschnitt (18) des federnden Kontaktelementes ausgebildet ist.