Process for manufacturing a wiring board having a via
    41.
    发明授权
    Process for manufacturing a wiring board having a via 失效
    具有通路的布线基板的制造方法

    公开(公告)号:US07205230B2

    公开(公告)日:2007-04-17

    申请号:US10914227

    申请日:2004-08-10

    Inventor: Naohiro Mashino

    Abstract: A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate with a through-hole penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots, around a metal-less portion of the plated metal, such as a dimple or seam, at positions corresponding to the openings of the through-hole, so that the a part of the plated metal melts to fill the metal-less portion with the molten metal.

    Abstract translation: 一种制造布线板的方法,包括由绝缘材料制成并具有第一和第二表面的基底,分别形成在第一和第二表面上的第一和第二导体图案,以及穿过基板的通孔导体,以将第一导体 图案与第二导体图案; 该方法包括以下步骤:用穿透其的通孔形成基底并分别在第一和第二表面处限定开口; 用金属电镀基板,使得在基板的相应的第一和第二表面上形成具有预定厚度的金属层,并且通孔基本上填充有作为通孔导体的金属; 在对应于通孔的开口的位置处,将激光束作为多个点照射在电镀金属的无金属部分(例如凹坑或接缝)周围,使得电镀金属的一部分 熔化以用熔融金属填充无金属部分。

    Anchor point for RF circuit boards and related methods
    43.
    发明申请
    Anchor point for RF circuit boards and related methods 审中-公开
    RF电路板的锚点及相关方法

    公开(公告)号:US20030062196A1

    公开(公告)日:2003-04-03

    申请号:US09970170

    申请日:2001-10-03

    Abstract: A circuit board includes a first layer of an electrically non-conducting material for carrying circuit components, and a second layer of an electrically conductive material for providing a common ground. At least one spot of a relatively more solderable material than the material of the second layer is in electrical contact with the second layer and is aligned with an opening through the first layer so that electrical connection can be made between the components on the first layer and the second layer by soldering to the spot. These anchor points provide a reliable way to connect circuit components to a common ground, from the top of the circuit board, without having to use backside screws and without having to penetrate the second layer.

    Abstract translation: 电路板包括用于承载电路部件的非导电材料的第一层和用于提供公共地面的导电材料的第二层。 与第二层的材料相比,可焊接材料的至少一个点与第二层电接触并且与通过第一层的开口对准,使得可以在第一层上的部件和 第二层通过焊接到现场。 这些固定点提供了将电路部件从电路板的顶部连接到公共接地的可靠方式,而不必使用背面螺钉,而不必穿透第二层。

    Electrically conducting bonding connection
    44.
    发明申请
    Electrically conducting bonding connection 失效
    导电接合连接

    公开(公告)号:US20030019664A1

    公开(公告)日:2003-01-30

    申请号:US10196027

    申请日:2002-07-16

    Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

    Abstract translation: 在布置在导电支撑板(1)的电子电路(S)和支撑板(1)之间通过提供一个孔(4,5)而产生导电接合连接(B) 具有可粘合表面(3)的元件(2)以支撑板(1)和接合元件(2)进入导电和摩擦连接的方式被按压; 随后用接合元件(2)产生接合连接。

    Kontakteinrichtung für ein Leistungshalbleitermodul mit einer Zentriervertiefung
    50.
    发明公开
    Kontakteinrichtung für ein Leistungshalbleitermodul mit einer Zentriervertiefung 审中-公开
    Kontakteinrichtungfürein Leistungshalbleitermodul mit einer Zentriervertiefung

    公开(公告)号:EP2256801A2

    公开(公告)日:2010-12-01

    申请号:EP10003118.6

    申请日:2010-03-24

    Inventor: Mauer, Peter

    Abstract: Es wird eine Kontakteinrichtung für ein Leistungshalbleitermodul beschrieben, die ein federndes Kontaktelement mit einem Kontaktierungs-Endabschnitt (18) aufweist, der zur Kontaktierung mit einem Anschlusselement (14) eines ebenen Schaltungsträgers (12) des Leistungshalbleitermoduls vorgesehen ist. Der Kontaktierungs-Endabschnitt (18) ist geradlinig stiftförmig ausgebildet und das Anschlusselement (14) weist ein Chipbauteil (10) auf, das mit einer Zentriervertiefung (16) für den Kontaktierungs-Endabschnitt (18) des federnden Kontaktelementes ausgebildet ist.

    Abstract translation: 该装置具有弹性接触元件,该弹性接触元件包括接触端部分(18),该接触端部分(18)设置成与互连装置(12)的连接元件(14)连接。 由氧化铝制成的功率半导体模块的衬底,其中连接元件具有用于端部的具有定心凹槽(16)的芯片部件(10)。 芯片组件被设计为自动表面安装的器件组装部件,并完全由金属制成,其中芯片部件设置有电镀(20)。

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