公开(公告)号：EP1393604B1

公开(公告)日：2011-01-12

申请号：EP02769472.8

申请日：2002-05-08

Applicant: Endress + Hauser GmbH + Co. KG

Inventor： BIRGEL, Dietmar ,  HAUPTVOGEL, Karl-Peter ,  BRUTSCHIN, Wolfgang ,  MÜLLER, Alexander

IPC: H05K3/34 ,  H01R9/16

CPC classification number: H01R12/57 ,  H01R9/16 ,  H01R43/0256 ,  H05K1/183 ,  H05K3/3405 ,  H05K2201/09036 ,  H05K2201/10333

Abstract: The invention relates to a printed circuit board (15) comprising a contact sleeve (17) that is mounted thereon, whereby the contact sleeve (17) can be electrically connected to the PCB in the manner of an SMD component. The upper face of said circuit board (15) is provided with a recess (23), a metallised section (25, 26), which adjoins said recess (23) and is connected to a strip conductor (27) that runs across the printed circuit board (15), and a contact sleeve (17) that is inlaid in the recess (23), mechanically fixed by a solder joint (29) and electrically connected to the metallised section (25).

公开(公告)号：EP0936847A1

公开(公告)日：1999-08-18

申请号：EP98500253.4

申请日：1998-11-24

Applicant: MECANISMOS AUXILIARES INDUSTRIALES S.A. M.A.I.S.A.

Inventor： Arragones Carreta, Alberto

IPC: H05K1/02 ,  H05K1/14 ,  B60R16/02

CPC classification number: B60R16/0239 ,  H01H50/048 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/0352 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10333

Abstract: The improvements made on the main Invention Patent no. 9501610 consists, firstly, of manufacturing power circuits such as (23) of between 200 and 800 microns, see figure 4, whereby, and practically with the same voltage, the amperage or intensity which runs through the conducting tracks of the printed circuit broad (23) is doubled, it also being possible to fit relays (26) using the corresponding females (24), so that the services integrated on the box (10) can support a greater load, thereby expanding the possibilities of integration of services, with no type of modification made to configuration and structure.

Abstract translation: 主要发明专利No. 9501610首先包括制造200至800微米之间的（23）的电源电路，参见图4，由此实际上具有相同的电压，穿过印刷电路的导电轨迹的电流强度或强度变宽（ 23）是双倍的，还可以使用相应的女性（24）来适配继电器（26），使得集成在盒（10）上的服务可以支持更大的负载，从而扩大服务集成的可能性，与 没有对配置和结构进行任何修改。

公开(公告)号：EP0162474A3

公开(公告)日：1987-06-03

申请号：EP85106413

申请日：1985-05-24

Applicant: FUJITSU LIMITED

Inventor： Tanibe, Norio

IPC: H05K09/00 ,  H05K03/30

CPC classification number: H04M1/0277 ,  H01R12/58 ,  H01R12/718 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/308 ,  H05K3/368 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A printed circuit board (10) comprises a baseboard (15), having conductor patterns (15c,15d,15e) therein and ground layers (15a,15b) on both surfaces thereof, and terminal pins (16) mounted on the baseboard (15). The terminal pins (16) have a root portion which does not project from the baseboard (15) and a contact portion which projects from the baseboard (15). A circuit assembly comprises a mother printed circuit board (10), such as the above-mentioned printed circuit board, on which circuit modules (11) are mounted. The circuit module (11) has terminal jacks (14), which are enclosed within a shielded package (13) and into which the terminal pins (16) of the mother printed circuit board (10) are connected by insertion.

公开(公告)号：EP0160387A1

公开(公告)日：1985-11-06

申请号：EP85302067.5

申请日：1985-03-26

Applicant: THOMAS & BETTS CORPORATION

Inventor： Holzmann, Hubert A.

IPC: H01R9/09

CPC classification number: H01R43/205 ,  H01R13/436 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/10333 ,  H05K2201/10424 ,  Y10S269/903 ,  Y10T428/1397

Abstract: The contacts (4) have a body (4a) intended to pass through an opening in a card (5) and to be brazed on one side (5a) thereof, and a head (4b) of larger width than the body (4a), intended to be positioned on the other side (5b) of the card, this head (4b) being intended to receive a complementary contact.
The strip is formed of a band (1) of plastic material resisting the heat released during brazing and having cells (2) opening on one side, these cells being adapted to receive sealingly, by elastic deformation, the heads (4b) of the contacts (4) and being spaced apart according to a given pitch.
With this type of strip, a large number of contacts (4) can be positioned in a single operation on a printed circuit card (5), the heads (4b) of the contacts being protected during the brazing and washing operations from contaminants.

公开(公告)号：EP0037749A1

公开(公告)日：1981-10-14

申请号：EP81400315.8

申请日：1981-02-27

Applicant: THOMSON-CSF

Inventor： Legrand, Pierre ,  Desperques-Volmier, Serge ,  Baylard, Marcel

IPC: H05K3/36

CPC classification number: H05K1/141 ,  G01R1/04 ,  H05K3/3447 ,  H05K3/366 ,  H05K7/12 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10689

Abstract: L'invention a pour but de fournir un moyen de raccorder de façon simple, rapide et sans erreur de branchement, des composants enfichés sur une carte de câblage, avec des équipements de test et/ou de mesure.
Le support est constitué, à cet effet, par une plaque (9) en matériau isolant, du type utilisé pour réaliser les circuits imprimés, et présente des trous métallisés (91, 92) munis de douilles élastiques (90). Le composant (4) est enfiché dans des douilles (31) prolongées par des appendices de connexion (32) traversant la carte de câblage. Les douilles (90) destinées aux fiches des équipements de test et/ou de mesure sont reliées aux douilles (31 ) par des métallisations (93) tapissant les bords des trous métallisés.
Application aux cartes de circuits intégrés.

Abstract translation: 本发明包括用于将插入到印刷布线电路中的组件与测试和/或测量设备连接的简单的快速和无错误的装置。 为此，支撑体由用于制造印刷电路板的类型的绝缘材料制成的板（9）形成，并且具有装有弹簧加载插座（90,92）的电镀通孔（91,92） ）。 组件（4）插入通过印刷布线电路的连接附件（32）延伸的插座（31）中。 用于测试和/或测量设备的插头触点的插座（90）通过覆盖电镀通孔的边缘的金属（93）连接到插座（31）。 集成电路板应用。

公开(公告)号：KR20180062926A

公开(公告)日：2018-06-11

申请号：KR20170063059

申请日：2017-05-22

IPC: H01R4/24 ,  H01R9/05

CPC classification number: H05K1/182 ,  H05K3/34 ,  H05K3/3426 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/2027 ,  Y02P70/611 ,  Y02P70/613

Abstract: 단일의전도성플래너금속시트로부터형성되는마이크로클립장치는연장된길이를따라정의되는핀 리시버, 솔더패들및 브리지를포함하는부분들을포함한다. 핀리시버는제1 및제2 플래너링을포함하고그리고제1 링의주변에서제2 링의주변으로확장되는스프링바를포함한다. 솔더패들은핀 리시버의전도성금속시트말단의부분으로구성되고, 브리지는솔더패들의주변부로부터제2 링으로확장된다. 측면밴드는마이크로클립의여러부분을활용하기위해전도성플래너금속시트의길이를따라증착된다.

公开(公告)号：KR1020110003591A

公开(公告)日：2011-01-12

申请号：KR1020107028579

申请日：2003-03-20

Applicant: 콤스코프 테크놀로지스 엘엘씨

Inventor： 뷰온델몬트찰스제이. ,  멘델손조셉패트릭 ,  브라운리차드윌리암 ,  리민 ,  슈왈츠리차드프랭클린 ,  유파사니산자이수드하카르

IPC: H05K3/36 ,  H05K1/14

CPC classification number: H05K3/368 ,  B23K2201/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: 2개의 회로 기판 사이에 기계적/전기적 상호접속 및 그에 따라 요구되는 상호접속 부품을 제공하는 본 발명의 방법은 각각 미부, 견부 및 헤드부를 갖는 핀과 소켓을 포함한다. 미부는 제1 기판의 도금된 관통 구멍 내에 끼워 맞춤되도록 크기가 설정되고, 헤드부는 자동화 장비가 헤드부를 포획하는 것을 허용하고 도금된 관통 구멍 내부에 삽입될 때 그 상부에 안착되는 것을 허용하도록 크기가 설정되고, 견부는 도금된 관통 구멍의 내측에 안착되고 헤드부 아래에 그리고 도금된 관통 구멍 밑으로 미리 정해진 양의 땜납이 유동하는 것을 허용하지만 미부보다 아래로 유동하는 것을 허용하지 않도록 도금된 관통 구멍에 대해 크기가 설정되어 관통 구멍 내에 핀의 중심을 맞추는 것을 돕는다. 땜납 재유동 온도로 가열하면, 핀의 헤드부와 소켓의 견부 주연 둘레에 땜납 고리가 소켓의 견부와 핀의 헤드 아래로 유동하고, 그로 인해 핀과 제1 기판 사이 및 소켓과 제2 기판 사이에 땜납된 전기적 연결부를 형성한다. 소켓과 핀을 정렬하고 소켓의 공동 내에 핀의 미부를 삽입함으로써 분리 가능하고 신뢰성 있는 기계적 전기적 상호접속부가 제1 기판과 제2 기판 사이에 형성된다.

公开(公告)号：JP5060280B2

公开(公告)日：2012-10-31

申请号：JP2007338000

申请日：2007-12-27

Applicant: 富士通コンポーネント株式会社

Inventor： 裕子 大瀬 ,  敏弘 草谷

IPC: H01R13/24 ,  H01R33/76

CPC classification number: H05K3/308 ,  H01R12/52 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069 ,  H05K2201/10333 ,  Y10T29/49139

公开(公告)号：JP2010027814A

公开(公告)日：2010-02-04

申请号：JP2008186603

申请日：2008-07-18

Applicant: Mitsubishi Electric Corp ,  三菱電機株式会社

Inventor： OI TAKESHI ,  OKA SEIJI ,  TAIKAI YOSHIKO ,  USUI OSAMU ,  NAKAYAMA YASUSHI

IPC: H01L25/07 ,  H01L25/18

CPC classification number: H05K3/32 ,  H01L23/3121 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/284 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: PROBLEM TO BE SOLVED: To obtain a power semiconductor device reducing failures occurring in a main terminal section by the connection of external wiring, having high yield and excellent productivity, and sealed with a transfer molding resin with high reliability. SOLUTION: In the power semiconductor device, a power semiconductor element that is bonded to the wiring pattern of a circuit board, a cylindrical external terminal communication section, and a wiring formation means for electrically connecting the power semiconductor element and the cylindrical external terminal communication section, etc., are sealed with a transfer molding resin. The cylindrical external terminal communication section is installed roughly perpendicularly to the wiring pattern, and the external terminal is inserted and connected to the cylindrical external terminal communication section. A plurality of cylindrical external terminal communication sections are two-dimensionally arranged in each of the wiring patterns acting as the main circuit. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了获得功率半导体装置，通过外部布线的连接减少在主端子部分发生的故障，具有高产率和优异的生产率，并且用高可靠性的传递模塑树脂密封。 解决方案：在功率半导体器件中，接合到电路板的布线图案的功率半导体元件，圆柱形外部端子连通部分和用于将功率半导体元件和圆柱形外部电连接的布线形成装置 终端通信部等用传递模塑树脂密封。 圆筒形外部端子连通部分大致垂直于布线图案安装，外部端子插入并连接到圆筒形外部端子通信部分。 在用作主电路的每个布线图案中，二维地布置有多个圆柱形外部端子连通部。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2005183822A

公开(公告)日：2005-07-07

申请号：JP2003425313

申请日：2003-12-22

Applicant: T An T:Kk ,  株式会社テーアンテー

Inventor： OKANO HIROBUMI ,  OCHIAI HIROSHI

IPC: B60Q3/02 ,  H01R4/48 ,  H01R4/60 ,  H01R12/50 ,  H01R12/57 ,  H05K1/02 ,  H05K1/14 ,  H05K3/20 ,  H05K7/02

CPC classification number: H05K1/0263 ,  B60Q3/80 ,  H05K1/14 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/10272 ,  H05K2201/10333

Abstract: PROBLEM TO BE SOLVED: To provide a method for easily connecting both circuit boards and improving workability in a way that the bus bar of a bus bar substrate and the conductive pattern of a printed wiring board are electrically connected, by inserting a male pin provided in the bus bar substrate or printed wiring board into a female pin provided in the remaining substrate or board in connecting the bus bar substrate and printed wiring board.
SOLUTION: In a circuit connection structure where a bus bar substrate 1 having circuits structured by providing a bus bar 5 and a printed wiring board 4 are connected, the bus bar of the bus bar substrate and the conductive pattern of the printed wiring board are electrically connected by inserting a male pin 5a protruding from the above bus bar substrate into a male pin 4b electrically connected to the conductive pattern of the above printed wiring board.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种容易地连接两个电路板并且以汇流条基板的汇流条和印刷电路板的导电图案电连接的方式提高可操作性的方法，通过插入一个公头 将母线基板或印刷线路板设置在连接母线基板和印刷线路板的剩余基板或基板中的阴销中。 解决方案：在具有通过提供母线5和印刷线路板4构成的电路的汇流条基板1连接的电路连接结构中，汇流条基板的母线和印刷线路的导电图案 通过将从上述汇流条基板突出的凸销5a插入与上述印刷电路板的导电图案电连接的凸形销4b中，电连接板。 版权所有（C）2005，JPO＆NCIPI