Abstract:
The invention relates to a printed circuit board (15) comprising a contact sleeve (17) that is mounted thereon, whereby the contact sleeve (17) can be electrically connected to the PCB in the manner of an SMD component. The upper face of said circuit board (15) is provided with a recess (23), a metallised section (25, 26), which adjoins said recess (23) and is connected to a strip conductor (27) that runs across the printed circuit board (15), and a contact sleeve (17) that is inlaid in the recess (23), mechanically fixed by a solder joint (29) and electrically connected to the metallised section (25).
Abstract:
The improvements made on the main Invention Patent no. 9501610 consists, firstly, of manufacturing power circuits such as (23) of between 200 and 800 microns, see figure 4, whereby, and practically with the same voltage, the amperage or intensity which runs through the conducting tracks of the printed circuit broad (23) is doubled, it also being possible to fit relays (26) using the corresponding females (24), so that the services integrated on the box (10) can support a greater load, thereby expanding the possibilities of integration of services, with no type of modification made to configuration and structure.
Abstract:
A printed circuit board (10) comprises a baseboard (15), having conductor patterns (15c,15d,15e) therein and ground layers (15a,15b) on both surfaces thereof, and terminal pins (16) mounted on the baseboard (15). The terminal pins (16) have a root portion which does not project from the baseboard (15) and a contact portion which projects from the baseboard (15). A circuit assembly comprises a mother printed circuit board (10), such as the above-mentioned printed circuit board, on which circuit modules (11) are mounted. The circuit module (11) has terminal jacks (14), which are enclosed within a shielded package (13) and into which the terminal pins (16) of the mother printed circuit board (10) are connected by insertion.
Abstract:
The contacts (4) have a body (4a) intended to pass through an opening in a card (5) and to be brazed on one side (5a) thereof, and a head (4b) of larger width than the body (4a), intended to be positioned on the other side (5b) of the card, this head (4b) being intended to receive a complementary contact. The strip is formed of a band (1) of plastic material resisting the heat released during brazing and having cells (2) opening on one side, these cells being adapted to receive sealingly, by elastic deformation, the heads (4b) of the contacts (4) and being spaced apart according to a given pitch. With this type of strip, a large number of contacts (4) can be positioned in a single operation on a printed circuit card (5), the heads (4b) of the contacts being protected during the brazing and washing operations from contaminants.
Abstract:
L'invention a pour but de fournir un moyen de raccorder de façon simple, rapide et sans erreur de branchement, des composants enfichés sur une carte de câblage, avec des équipements de test et/ou de mesure. Le support est constitué, à cet effet, par une plaque (9) en matériau isolant, du type utilisé pour réaliser les circuits imprimés, et présente des trous métallisés (91, 92) munis de douilles élastiques (90). Le composant (4) est enfiché dans des douilles (31) prolongées par des appendices de connexion (32) traversant la carte de câblage. Les douilles (90) destinées aux fiches des équipements de test et/ou de mesure sont reliées aux douilles (31 ) par des métallisations (93) tapissant les bords des trous métallisés. Application aux cartes de circuits intégrés.
Abstract:
2개의 회로 기판 사이에 기계적/전기적 상호접속 및 그에 따라 요구되는 상호접속 부품을 제공하는 본 발명의 방법은 각각 미부, 견부 및 헤드부를 갖는 핀과 소켓을 포함한다. 미부는 제1 기판의 도금된 관통 구멍 내에 끼워 맞춤되도록 크기가 설정되고, 헤드부는 자동화 장비가 헤드부를 포획하는 것을 허용하고 도금된 관통 구멍 내부에 삽입될 때 그 상부에 안착되는 것을 허용하도록 크기가 설정되고, 견부는 도금된 관통 구멍의 내측에 안착되고 헤드부 아래에 그리고 도금된 관통 구멍 밑으로 미리 정해진 양의 땜납이 유동하는 것을 허용하지만 미부보다 아래로 유동하는 것을 허용하지 않도록 도금된 관통 구멍에 대해 크기가 설정되어 관통 구멍 내에 핀의 중심을 맞추는 것을 돕는다. 땜납 재유동 온도로 가열하면, 핀의 헤드부와 소켓의 견부 주연 둘레에 땜납 고리가 소켓의 견부와 핀의 헤드 아래로 유동하고, 그로 인해 핀과 제1 기판 사이 및 소켓과 제2 기판 사이에 땜납된 전기적 연결부를 형성한다. 소켓과 핀을 정렬하고 소켓의 공동 내에 핀의 미부를 삽입함으로써 분리 가능하고 신뢰성 있는 기계적 전기적 상호접속부가 제1 기판과 제2 기판 사이에 형성된다.
Abstract:
PROBLEM TO BE SOLVED: To obtain a power semiconductor device reducing failures occurring in a main terminal section by the connection of external wiring, having high yield and excellent productivity, and sealed with a transfer molding resin with high reliability. SOLUTION: In the power semiconductor device, a power semiconductor element that is bonded to the wiring pattern of a circuit board, a cylindrical external terminal communication section, and a wiring formation means for electrically connecting the power semiconductor element and the cylindrical external terminal communication section, etc., are sealed with a transfer molding resin. The cylindrical external terminal communication section is installed roughly perpendicularly to the wiring pattern, and the external terminal is inserted and connected to the cylindrical external terminal communication section. A plurality of cylindrical external terminal communication sections are two-dimensionally arranged in each of the wiring patterns acting as the main circuit. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for easily connecting both circuit boards and improving workability in a way that the bus bar of a bus bar substrate and the conductive pattern of a printed wiring board are electrically connected, by inserting a male pin provided in the bus bar substrate or printed wiring board into a female pin provided in the remaining substrate or board in connecting the bus bar substrate and printed wiring board. SOLUTION: In a circuit connection structure where a bus bar substrate 1 having circuits structured by providing a bus bar 5 and a printed wiring board 4 are connected, the bus bar of the bus bar substrate and the conductive pattern of the printed wiring board are electrically connected by inserting a male pin 5a protruding from the above bus bar substrate into a male pin 4b electrically connected to the conductive pattern of the above printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI